MPC8245LZU300D

IC MPU MPC82XX 300MHZ 352TBGA
Part Description

PowerPC 603e Microprocessor IC MPC82xx 1 Core, 32-Bit 300MHz 352-TBGA (35x35)

Quantity 82 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8245
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorPowerPC 603eDevice Package352-TBGA (35x35)ECCN3A991A2
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 105°C (TA)Package / Case352-LBGARAM ControllersSDRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceRoHS non-compliantSpeed300MHz
Supplier Device Package352-TBGA (35×35)Voltage – I/O3.3V

Overview of MPC8245LZU300D – IC MPU MPC82XX 300MHZ 352TBGA

The MPC8245LZU300D is a PowerPC-based microprocessor module featuring a single PowerPC 603e core running at 300 MHz. It combines a high-performance 32-bit superscalar processor core with integrated peripheral logic to simplify embedded system designs.

Designed for embedded applications that require PCI-based peripheral integration and SDRAM support, the MPC8245LZU300D delivers system-level integration—including a PCI bridge and memory controller—while operating from 3.3 V I/O and a 0 °C to 105 °C temperature range.

Key Features

  • Core & Architecture PowerPC 603e 32-bit superscalar core, single-core operation at 300 MHz with integrated MMU and floating-point support.
  • Instruction and Data Caches On-chip 16-Kbyte instruction cache and 16-Kbyte data cache to accelerate instruction fetch and data access.
  • Memory Subsystem High-performance memory controller supporting SDRAM and various ROM types, with ECC support in the data path as documented in the hardware specification.
  • PCI Integration & Peripheral Logic Integrated PCI bridge and peripheral logic allow rapid system designs using PCI peripherals and standard interfaces.
  • Serial and Messaging Interfaces Includes an I2C controller, DUART serial interfaces, and a message unit with I2O support for peripheral communication.
  • System Controllers On-chip DMA controller, programmable interrupt controller (PIC) with multiple IRQs, timers, and configuration registers for system control.
  • Debug & Power Management JTAG/COP interface and on-chip power management features including PLL configuration and clocking support.
  • Package & Thermal Supplied in a 352-TBGA (35 × 35 mm) surface-mount package; operating temperature specified from 0 °C to 105 °C.
  • Electrical 3.3 V I/O signaling and RoHS-compliant manufacturing.

Typical Applications

  • Embedded Control Systems Use the MPC8245LZU300D for embedded controllers that require a 32-bit PowerPC core with integrated memory and peripheral interfaces.
  • PCI-Based Systems Leverage the on-chip PCI bridge to integrate standard PCI peripherals into compact, single-chip designs.
  • Communications & Networking Equipment Employ the message unit, I2O support, and serial interfaces for packet handling and peripheral messaging in networking appliances.
  • Industrial Systems Benefit from SDRAM support, DMA, and a wide operating temperature range for industrial embedded applications.

Unique Advantages

  • Highly Integrated Peripheral Logic: Combines PCI bridge, memory controller, DUART, DMA, PIC and message unit on-chip to reduce board-level component count and simplify system design.
  • Balanced On-Chip Performance: MPC603e core with separate instruction and data caches and floating-point support provides predictable 32-bit processing capability at 300 MHz.
  • Flexible Memory Support: Memory controller supports SDRAM and multiple ROM types, enabling straightforward memory subsystem designs with ECC where required by the hardware spec.
  • Standard Peripheral Interfaces: Built-in I2C, DUART, and I2O-capable message unit facilitate integration with a wide range of serial and peripheral devices.
  • Robust Packaging and Thermal Range: 352-TBGA (35 × 35) surface-mount package and 0 °C to 105 °C operating range provide a compact footprint and suitability for consumer and industrial embedded environments.
  • Regulatory and Environmental Compliance: RoHS-compliant manufacturing supports environmental and supply-chain requirements.

Why Choose MPC8245LZU300D?

The MPC8245LZU300D positions itself as a practical, integrated microprocessor for embedded designers who need a PowerPC 603e core combined with system-level peripherals such as a PCI bridge, SDRAM controller, and serial/message interfaces. Its single-chip integration reduces external components and shortens development time for PCI-centric and SDRAM-based systems.

As part of the MPC8245 family from NXP Semiconductors, this device is suited to teams building embedded control, communications, and industrial systems that require a combination of processor performance, peripheral integration, and a compact 352-TBGA package.

Request a quote or submit a procurement inquiry to obtain pricing and availability for the MPC8245LZU300D and begin integrating this PowerPC-based processor into your next embedded design.

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