MPC8245LZU350D
| Part Description |
PowerPC 603e Microprocessor IC MPC82xx 1 Core, 32-Bit 350MHz 352-TBGA (35x35) |
|---|---|
| Quantity | 989 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8245 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Core Processor | PowerPC 603e | Device Package | 352-TBGA (35x35) | ECCN | 3A991A2 | ||
|---|---|---|---|---|---|---|---|
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | 0°C ~ 105°C (TA) | Package / Case | 352-LBGA | RAM Controllers | SDRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | RoHS non-compliant | Speed | 350MHz | ||
| Supplier Device Package | 352-TBGA (35×35) | Voltage – I/O | 3.3V |
Overview of MPC8245LZU350D – IC MPU MPC82XX 350MHZ 352TBGA
The MPC8245LZU350D is a single‑core, 32‑bit microprocessor integrating a PowerPC 603e core running at 350 MHz with extensive on‑chip peripheral logic. It combines processor performance with a PCI bridge and a high‑performance memory controller to simplify system design for embedded applications.
Designed for embedded and consumer systems, the MPC8245 family provides tight integration of CPU, memory interface and industry‑standard I/O to accelerate time‑to‑market for PCI‑centric designs that require SDRAM support and robust peripheral control.
Key Features
- PowerPC 603e Core – 32‑bit superscalar processor core with floating‑point support and integrated MMU for standard embedded processing tasks.
- 350 MHz Clock Rate – Processor core clocked at 350 MHz to deliver deterministic embedded performance for control and data‑path applications.
- Caches – On‑chip 16 KB instruction cache and 16 KB data cache to reduce memory latency and improve throughput.
- Integrated Memory Controller – High‑performance controller supporting SDRAM and multiple ROM types, with ECC controller and memory timing support.
- PCI Bridge and Peripheral Logic – Built‑in PCI bridge plus peripheral blocks including DMA controller, interrupt controller (PIC), timers and message unit to simplify system architecture for PCI peripherals.
- Serial and Control Interfaces – On‑chip I2C controller and DUART support for serial communications and peripheral management; message unit includes I2O capability as documented in the hardware specification.
- System and Debug – JTAG/COP interface, watchpoint facility and performance monitor support system bring‑up and debug.
- Power and Mounting – 3.3 V I/O voltage and surface mount 352‑TBGA (35 × 35 mm) package for compact board designs; package case referenced as 352‑LBGA.
- Operating Range and Qualification – Consumer qualification with operating temperature range from 0 °C to 105 °C; RoHS compliant.
Typical Applications
- Embedded Control Systems – Single‑core PowerPC processing with integrated peripherals and DMA support for control and real‑time tasks in embedded platforms.
- PCI‑Based Systems – On‑chip PCI bridge enables integration with standard PCI peripherals and accelerates designs that rely on PCI expansion.
- Consumer Electronics – Consumer‑qualified device suitable for applications requiring SDRAM memory support, serial interfaces and compact TBGA packaging.
- Communications and Networking Appliances – Integrated message unit, interrupt controller and DMA simplify protocol handling and data movement in networked embedded devices.
Unique Advantages
- Highly Integrated Platform: Combines a PowerPC 603e core with PCI bridge, memory controller and peripheral logic to reduce board‑level component count and BOM complexity.
- Memory Subsystem with ECC: High‑performance SDRAM controller and ECC support improve data integrity and predictable system behavior.
- Developer and System Support: Backed by detailed hardware specifications and an integrated processor reference manual to aid system design, bring‑up and validation.
- Compact, Surface‑Mount Packaging: 352‑TBGA (35 × 35 mm) package facilitates dense board layouts while providing a robust thermal and mechanical footprint for embedded systems.
- Rich Peripheral Set: On‑chip DMA, DUART, I2C, timers and interrupt controller streamline peripheral integration and reduce external glue logic.
- Consumer Qualification and RoHS Compliance: Designed for consumer markets and compliant with RoHS requirements for regulatory and supply‑chain compatibility.
Why Choose MPC8245LZU350D?
The MPC8245LZU350D positions itself as a practical, integrated processor solution for embedded and consumer systems that require PowerPC computational capability together with PCI connectivity and a flexible memory subsystem. Its combination of a 350 MHz PowerPC 603e core, on‑chip PCI bridge, SDRAM controller (with ECC) and a broad set of peripheral controllers reduces system complexity and accelerates development.
This device is well suited for designers targeting compact, PCI‑centric embedded platforms where documented hardware behavior, peripheral integration and consumer qualification are required. Supported by the MPC8245 hardware specification and accompanying documentation, the MPC8245LZU350D offers a solid foundation for long‑term, maintainable designs.
Request a quote or submit an inquiry to receive pricing, availability and technical documentation for the MPC8245LZU350D. Our team can provide part‑specific information and lead‑time details to support your design and procurement process.

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