MPC8245TVV333D

The MPC8245TVV333D is a PowerPC 603e single-core microprocessor from NXP Semiconductors, delivering a 32-bit core running at 333 MHz. It is targeted at embedded systems with integrated memory support and industrial operating requirements.

With on-chip SDRAM controller support, I2C interface, 3.3 V I/O compatibility and an industrial temperature range, this device is suited for designs that require a compact, surface-mount 352-TBGA package and reliable operation in extended environments.

Key Features

• Core — PowerPC 603e architecture, single 32-bit core operating at 333 MHz for general-purpose embedded processing.
• Memory Support — Integrated SDRAM controller to simplify external memory interfacing and system memory design.
• Interfaces — I2C interface for peripheral and sensor connectivity; I/O voltage specified at 3.3 V.
• Package & Mounting — 352-TBGA (35×35) supplier device package with 352-LBGA package case; designed for surface-mount assembly.
• Operating Range & Qualification — Industrial qualification with operating temperature from −40 °C to 105 °C for extended-environment deployment.

Typical Applications

• Embedded Control — Single-core 32-bit processing at 333 MHz with SDRAM support for control firmware and real-time embedded tasks.
• Industrial Equipment — Industrial qualification and −40 °C to 105 °C operating range suit equipment deployed in harsh or variable environments.
• OEM Electronics — Compact 352-TBGA surface-mount package for space-constrained designs requiring robust, board-level processing.

Unique Advantages

• Industry-Grade Temperature Range: Rated −40 °C to 105 °C to support reliable operation across extended-temperature applications.
• Integrated Memory Controller: On-chip SDRAM controller reduces external memory interface complexity and helps streamline system design.
• Standard 3.3 V I/O: 3.3 V I/O voltage simplifies compatibility with common peripheral families and system power domains.
• Compact High-Density Package: 352-TBGA (35×35) package enables high pin count in a compact footprint for dense embedded boards.
• Proven PowerPC Core: Based on the PowerPC 603e core within the MPC8245 series from NXP Semiconductors, providing a known architecture for embedded development.

Why Choose MPC8245TVV333D?

The MPC8245TVV333D combines a 333 MHz PowerPC 603e core with integrated SDRAM support, standard 3.3 V I/O, and industrial-grade temperature qualification to address embedded and industrial design needs. Its 352-TBGA surface-mount package delivers a compact solution for space-constrained, board-level systems.

This device is well suited for engineers and procurement teams designing reliable embedded controllers, industrial electronics, and OEM systems that require a balance of processing capability, memory integration, and extended-temperature operation from a recognized NXP Semiconductors series.

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