MPC8245TZU300D

The MPC8245TZU300D is a single-core PowerPC 603e microprocessor operating at 300 MHz, designed for embedded applications. It integrates a 32-bit core with SDRAM controller support and DMA interfaces, packaged in a 352-TBGA (35×35) surface-mount package and qualified for industrial use.

With 3.3 V I/O and an extended operating temperature range of -40 °C to 105 °C, this device targets embedded and industrial designs that require deterministic processing and board-level integration in a compact BGA footprint.

Key Features

• Core & Performance Single PowerPC 603e 32-bit core running at 300 MHz for predictable, general-purpose processing in embedded systems.
• Memory & Data Handling Integrated SDRAM controller support and DMA interfaces to streamline data movement and external memory access.
• Power & I/O 3.3 V I/O level compatible with common embedded peripherals and board-level interfaces.
• Package & Mounting 352-TBGA (35×35) supplier device package with exposed pad, supplied as a surface-mount component for compact PCB implementations.
• Thermal & Qualification Industrial qualification with an operating temperature range of -40 °C to 105 °C for temperature-sensitive installations.
• System Interfaces Additional DMA interface support to assist in efficient peripheral and memory transfers.
• Compliance RoHS compliant manufacturing to meet environmental regulatory requirements.
• Graphics No graphics acceleration—focused on control and data-processing tasks rather than graphical workloads.

Typical Applications

• Embedded Control Systems Used as the main processing element in embedded designs where a single 32-bit PowerPC core and SDRAM support are required.
• Industrial Automation Suitable for industrial control and automation applications that demand industrial qualification and extended temperature operation.
• Board-Level OEM Designs Fits compact system-on-board implementations requiring a 352-TBGA footprint and surface-mount assembly.
• Rugged or Temperature-Sensitive Deployments Deployed in environments that benefit from the device’s -40 °C to 105 °C operating range and industrial qualification.

Unique Advantages

• Single-Core PowerPC 603e: Provides a focused, deterministic 32-bit processing element at 300 MHz for general embedded workloads.
• Integrated Memory and DMA Support: SDRAM controller and DMA interfaces simplify external memory integration and improve data throughput on system buses.
• Industrial Temperature Range: Rated from -40 °C to 105 °C to support a wide range of operational environments.
• Compact 352-TBGA Package: 35×35 TBGA with exposed pad enables dense board layouts and reliable thermal performance at the board level.
• 3.3 V I/O Compatibility: Standard I/O voltage simplifies interfacing with common embedded peripherals and board components.
• RoHS Compliant: Environmentally compliant construction for regulated product assemblies.

Why Choose MPC8245TZU300D?

The MPC8245TZU300D combines a single PowerPC 603e 32-bit core running at 300 MHz with integrated SDRAM and DMA support, packaged in a compact 352-TBGA suitable for surface-mount assembly. Its industrial qualification and extended temperature range make it appropriate for embedded and industrial system designs that require reliable operation across challenging environments.

Manufactured by NXP Semiconductors, this device provides a balance of processing capability, board-level integration, and compliance that supports long-term deployment in embedded OEM and industrial applications.

Request a quote or submit your procurement inquiry to receive pricing and availability information for the MPC8245TZU300D.