MPC8245TZU266D

The MPC8245TZU266D is a single-core, 32-bit PowerPC 603e microprocessor operating at 266 MHz, designed for embedded applications. As part of the MPC8245 series from NXP Semiconductors, it integrates key system interfaces—such as an SDRAM controller and DMA—while delivering industrial-grade operating range and assembly-ready packaging.

Key Features

• Core – PowerPC 603e single-core 32-bit architecture running at 266 MHz for deterministic embedded processing.
• Memory & DMA – Built-in SDRAM controller and DMA interface support to simplify external memory interfacing and offload data movement.
• Power & I/O – 3.3 V I/O compatibility for common embedded system voltage domains.
• Package & Mounting – 352-TBGA (35×35) supplier package with 352-LBGA exposed pad package case; surface-mount mounting type suited for automated assembly.
• Qualification & Temperature – Industrial qualification and an operating temperature range of −40 °C to 105 °C for deployment in harsh environments.
• Environmental Compliance – RoHS compliant to meet modern regulatory requirements.

Typical Applications

• Industrial Embedded Systems – Suitable for industrial controllers and instrumentation that require a robust processor with an extended temperature range and SDRAM interface.
• Embedded Control Platforms – Fits designs that need a 32-bit PowerPC core with DMA support for efficient on-board data handling.
• Board-Level Integration – Used in embedded assemblies where a 352-TBGA surface-mount package and exposed pad improve thermal performance and automated manufacturing.

Unique Advantages

• Deterministic Processing: Single-core PowerPC 603e at 266 MHz provides predictable performance for embedded tasks.
• Integrated Memory Support: On-chip SDRAM controller and DMA reduce external component count and simplify memory subsystem design.
• Industrial Reliability: Qualified for industrial use with an operating range from −40 °C to 105 °C for extended-environment deployments.
• Assembly-Ready Package: 352-TBGA (35×35) with exposed pad and surface-mount mounting supports standard PCB assembly workflows.
• 3.3 V I/O Compatibility: Aligns with common embedded voltage domains for straightforward system integration.
• Regulatory Compliance: RoHS compliant for environmental and manufacturing consistency.

Why Choose MPC8245TZU266D?

The MPC8245TZU266D combines a proven PowerPC 603e core with integrated SDRAM control and DMA capabilities in a 352-TBGA package tailored for embedded, industrial deployments. Its 266 MHz performance, 3.3 V I/O, and −40 °C to 105 °C operating range make it suitable for designs that require dependable processing and robust environmental tolerance.

Designed by NXP Semiconductors as part of the MPC8245 series, this device is appropriate for engineers seeking a compact, assembly-friendly microprocessor solution that supports standard memory interfaces and streamlined board-level integration.

Request a quote for MPC8245TZU266D today to check availability and obtain pricing for your next embedded design.