MPC8247CVRMIBA
| Part Description |
PowerPC G2_LE Microprocessor IC MPC82xx 1 Core, 32-Bit 266MHz 516-PBGA (27x27) |
|---|---|
| Quantity | 135 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8247 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC G2_LE | Device Package | 516-PBGA (27x27) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A991A2 | Ethernet | 10/100Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 105°C (TA) | ||
| Package / Case | 516-BBGA | RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 266MHz | Supplier Device Package | 516-PBGA (27×27) | ||
| USB | USB 2.0 (1) | Voltage – I/O | 3.3V |
Overview of MPC8247CVRMIBA – PowerPC G2_LE Microprocessor IC 266 MHz 516-PBGA
The MPC8247CVRMIBA is a single-core, 32-bit PowerPC G2_LE microprocessor rated at 266 MHz in a 516-pin PBGA (27×27) package. It combines a dual-issue integer core with integrated communications peripherals and memory controllers to address embedded communications and industrial applications.
Designed for industrial operating conditions and RoHS-compliant production, the device delivers a compact, highly integrated solution for networking, gateway, and embedded control designs that require Ethernet, USB, and multiple serial interfaces alongside on-chip memory support.
Key Features
- Core & Architecture Dual-issue PowerPC G2_LE 32-bit core running at 266 MHz with integrated memory management units and separate instruction and data caches (16 KB I-cache, 16 KB D-cache) as documented in the product family hardware specification.
- Co-processors & Communications Processor Module (CPM) On-chip communications co-processors and a modified Communications Processor Module (CPM) provide protocol and peripheral support for embedded communications tasks.
- Memory Controllers Integrated DRAM and SDRAM controllers simplify external memory interfacing for system designs requiring external volatile memory.
- Connectivity Dual 10/100 Mbps Ethernet interfaces, a USB 2.0 full/low‑rate port, and I2C support provide a broad set of standard interfaces for networking and peripheral integration.
- Package & Mounting 516‑ball PBGA (27 × 27 mm) surface-mount package provides high pin density for complex board designs.
- Electrical & Environmental 3.3 V I/O voltage and industrial qualification with an operating temperature range of −40 °C to 105 °C. RoHS‑compliant manufacturing status.
Typical Applications
- Networking Equipment Embedded routers, switches, and access devices leveraging dual 10/100 Ethernet ports and integrated communications processing for packet handling and protocol offload.
- Industrial Control Control and automation systems that require industrial temperature operation and reliable peripheral interfaces such as I2C and USB.
- Communications Gateways Protocol conversion and gateway devices that benefit from the CPM and communications co-processors alongside external DRAM/SDRAM support.
- Embedded Appliances Specialized appliances and instrumentation that need a compact, single‑chip processing solution with integrated I/O and memory interfaces.
Unique Advantages
- Highly integrated communications capability: On-chip CPM and communications co-processors reduce external logic and simplify BOM for networking and gateway designs.
- Deterministic embedded performance: Dual-issue PowerPC G2_LE core with MMU and dedicated instruction/data caches supports responsive embedded workloads at 266 MHz.
- Industrial ready: Operates across −40 °C to 105 °C and is qualified for industrial use, supporting deployment in demanding environments.
- Flexible peripheral set: Dual 10/100 Ethernet, USB 2.0, and I2C plus DRAM/SDRAM controllers enable a wide range of connectivity and memory configurations.
- Compact, high-density packaging: 516‑ball PBGA (27×27 mm) delivers high I/O count in a surface-mount footprint suitable for space-constrained boards.
- Compliance and manufacturability: RoHS‑compliant construction supports modern production and environmental requirements.
Why Choose MPC8247CVRMIBA?
The MPC8247CVRMIBA is positioned for embedded designs that require a balanced combination of processing capability, integrated communications peripherals, and industrial temperature operation. Its single PowerPC G2_LE core with MMU and caches, together with Ethernet, USB, and memory controller integration, reduces system complexity while supporting common embedded networking and control tasks.
This part is appropriate for engineers and procurement teams building communication-focused embedded systems, industrial controllers, and compact appliances where integration, temperature range, and standard interfaces matter. Detailed hardware specifications and datasheet documentation are available to support design and validation activities.
If you require pricing, availability, or a formal quote for MPC8247CVRMIBA, submit a request or sales inquiry to receive a prompt response and configuration assistance.

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