MPC8247CZQTIEA

IC MPU MPC82XX 400MHZ PBGA516
Part Description

PowerPC G2_LE Microprocessor IC MPC82xx 1 Core, 32-Bit 400MHz 516-PBGA (27x27)

Quantity 473 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8247
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2_LEDevice Package516-PBGA (27x27)
ECCN3A991A2Ethernet10/100Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case516-BBGARAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed400MHzSupplier Device Package516-PBGA (27×27)
USBUSB 2.0 (1)Voltage – I/O3.3V

Overview of MPC8247CZQTIEA – PowerPC G2_LE 400 MHz Microprocessor

The MPC8247CZQTIEA is a single-core, 32-bit PowerPC G2_LE microprocessor running at 400 MHz, designed for embedded and industrial communications applications. Built in a 516-PBGA (27×27) surface-mount package and qualified for industrial temperature operation, it combines a deterministic PowerPC core with on-chip communications support to simplify system-level networking designs.

With dedicated communications co-processing (RISC CPM), dual 10/100 Mbps Ethernet ports, and a USB 2.0 interface, this device targets embedded networking, control and automation, and edge appliance designs that require integrated connectivity and robust operating-temperature performance.

Key Features

  • Core PowerPC G2_LE single-core, 32-bit processor operating at 400 MHz for deterministic embedded control and protocol processing.
  • Memory Interfaces On-chip controllers for DRAM and SDRAM to support system memory requirements.
  • Communications Co-processor RISC CPM co-processor targeted at communications tasks to offload protocol handling and I/O processing.
  • Ethernet Two integrated 10/100 Mbps Ethernet ports for dual-network or redundant connectivity.
  • USB Single USB 2.0 full/low-rate interface for peripheral connectivity and host/device I/O.
  • Package & Mounting 516-PBGA (27×27) lead-free package, surface-mount for compact board designs.
  • Voltage & Power 3.3 V I/O interface level for compatibility with common embedded system power rails.
  • Operating Range Industrial temperature range from −40 °C to 105 °C for reliable operation in harsh environments.
  • Environmental Compliance RoHS compliant.

Typical Applications

  • Industrial Networking Equipment Dual 10/100 Ethernet ports and industrial temperature qualification make this device suitable for embedded routers, switches, and protocol converters.
  • Embedded Communications Controllers RISC CPM and Ethernet/USB interfaces support telecom and datacom control-plane processors and communications modules.
  • Edge Gateways & Appliances Integrated connectivity and memory-controller support enable compact edge appliances that bridge field devices to higher-level networks.
  • Control & Automation Systems Deterministic PowerPC core and robust thermal rating fit factory automation controllers and remote I/O concentrators.

Unique Advantages

  • Integrated Communications Subsystem: On-chip RISC CPM plus dual Ethernet and USB reduce external controller requirements and simplify BOM.
  • Industrial Temperature Qualification: Rated −40 °C to 105 °C for reliable operation in demanding environments and extended deployment scenarios.
  • Compact Surface-Mount Package: 516-PBGA (27×27) enables high-density board layouts while providing robust pin count for system connectivity.
  • Standard 3.3 V I/O: Widely compatible I/O voltage simplifies integration with common embedded peripherals and power domains.
  • Memory Flexibility: Integrated DRAM and SDRAM controllers support a range of system memory configurations for application needs.
  • Regulatory-Friendly: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose MPC8247CZQTIEA?

The MPC8247CZQTIEA balances a deterministic PowerPC G2_LE core running at 400 MHz with a communications-focused feature set—dual 10/100 Ethernet, USB 2.0, and an on-chip RISC CPM—making it well-suited for embedded communications and industrial networking designs. Its industrial temperature rating, 516-PBGA surface-mount package, and 3.3 V I/O provide practical deployment advantages for robust, compact systems.

Backed by NXP Semiconductors and supported by documentation for the MPC82xx family, this part is a viable choice for engineering teams building networked embedded devices that require integrated connectivity, memory support, and industrial-grade thermal performance.

Request a quote or submit a procurement inquiry to check pricing, availability, and lead times for the MPC8247CZQTIEA. Provide your project requirements to receive customization or volume-delivery information.

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