MPC8245TZU350D

The MPC8245TZU350D is a microprocessor based on the Power Architecture 603e core, delivering a single 32-bit processing core running at 350 MHz. It integrates memory controller support and DMA interfaces to serve embedded system designs that require industrial operating range and board-level integration.

With industrial qualification and a wide operating temperature range, this device is positioned for embedded and industrial applications that demand reliable 3.3 V I/O compatibility, surface-mount packaging, and standard SDRAM memory support.

Key Features

• Core & Performance 603e single core, 32-bit processor running at 350 MHz, suitable for deterministic embedded workloads.
• Memory Integration On-chip SDRAM controller support simplifies system memory interfacing for typical embedded memory architectures.
• Interfaces & Data Movement Integrated DMA support for efficient data transfers and reduced CPU overhead in I/O-heavy tasks.
• Power & I/O 3.3 V I/O voltage compatibility to match standard embedded peripherals and board-level designs.
• Package & Mounting 352-TBGA package (35 × 35 mm) designed for surface-mount assembly to support compact, high-density board layouts.
• Industrial Qualification & Temperature Range Qualified for industrial use with an operating temperature range of -40 °C to 105 °C for deployment in harsh environments.
• Environmental Compliance RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Embedded Control Use as the primary processor in embedded control systems that require a 32-bit Power Architecture core and SDRAM support.
• Industrial Automation Suited for industrial devices operating across -40 °C to 105 °C where industrial qualification is required.
• Board-Level Integrated Designs Ideal for compact, surface-mount applications that benefit from a 352-TBGA (35×35) footprint and 3.3 V I/O compatibility.

Unique Advantages

• Deterministic 32-bit performance: The 603e core at 350 MHz provides predictable single-core execution for embedded workloads.
• Integrated SDRAM controller: Reduces external memory interface complexity and simplifies system BOM.
• Efficient data handling with DMA: Offloads data transfer tasks from the CPU to improve overall system throughput.
• Industrial temperature readiness: Rated from -40 °C to 105 °C for reliable operation in demanding environments.
• Compact, assembly-ready package: 352-TBGA (35×35) surface-mount package supports high-density PCBs and automated assembly processes.
• 3.3 V I/O compatibility: Aligns with common embedded peripherals and board-level voltage domains.

Why Choose MPC8245TZU350D?

The MPC8245TZU350D combines a Power Architecture 603e core with integrated SDRAM support and DMA to deliver a focused, single-core solution for embedded and industrial designs. Its 350 MHz performance, 3.3 V I/O, and compact 352-TBGA package make it a practical choice for board-level implementations that require robust thermal performance and reliable operation.

This device is well suited to engineers and OEMs developing embedded control and industrial automation equipment who need predictable processing, simplified memory interfacing, and industrial-grade temperature qualification. The product’s specification set supports designs that prioritize integration, manufacturability, and long-term field reliability.

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