MPC8245TZU333D

The MPC8245TZU333D is a PowerPC 603e microprocessor in the MPC82xx family, offering a single 32-bit core running at 333 MHz. It integrates an SDRAM controller and I2C interface in a compact 352-TBGA (35×35) surface-mount package and is specified for industrial operation.

This device targets embedded applications that require a PowerPC 603e architecture, 3.3 V I/O compatibility, and an extended operating temperature range from −40 °C to 105 °C.

Key Features

• Core  Single PowerPC 603e core delivering 333 MHz of processing capability in a 32-bit architecture.
• Memory  Integrated SDRAM controller to interface directly with SDRAM memory.
• Power and I/O  3.3 V I/O voltage level for compatibility with standard embedded peripherals.
• Interfaces  On-chip I2C interface for system management and peripheral control.
• Package & Mounting  352-TBGA (35×35) supplier device package, 352-LBGA package case, surface-mount mounting type.
• Qualification & Temperature  Industrial qualification with an operating temperature range of −40 °C to 105 °C.
• Graphics  No graphics acceleration included.

Typical Applications

• Industrial Embedded Systems  Use in control and monitoring platforms where industrial temperature qualification is required.
• Single-Core 32-Bit Designs  Suitable for embedded applications relying on a single PowerPC 603e core and SDRAM-based memory subsystems.
• Board-Level Integration  Surface-mount 352-TBGA package enables compact board layouts for embedded modules and OEM designs.

Unique Advantages

• PowerPC 603e Architecture: Provides a well-defined 32-bit core at 333 MHz for legacy and embedded PowerPC-based designs.
• Integrated SDRAM Controller: Simplifies memory interfacing with on-chip SDRAM support.
• Industrial Temperature Rating: Operates from −40 °C to 105 °C for deployment in demanding environments.
• Standard 3.3 V I/O: Ensures compatibility with common embedded peripherals and I/O standards.
• Compact TBGA Footprint: 352-TBGA (35×35) surface-mount package supports dense board integration.
• On-chip I2C Interface: Provides a common system management and peripheral control interface.

Why Choose MPC8245TZU333D?

The MPC8245TZU333D combines the PowerPC 603e single-core architecture with on-chip SDRAM control and I2C interface in a compact 352-TBGA package, making it suitable for embedded and industrial applications that require a 333 MHz 32-bit processor and extended temperature operation. Its 3.3 V I/O and surface-mount form factor support standard embedded system designs.

Manufactured by NXP Semiconductors and specified for industrial qualification, the MPC8245TZU333D is a practical choice for engineers building robust embedded systems that rely on the PowerPC 603e architecture and SDRAM-based memory subsystems.

Request a quote or submit a pricing inquiry to initiate procurement for MPC8245TZU333D today.