MPC8247CZQMIBA

The MPC8247CZQMIBA is a single-core, 32-bit microprocessor based on the PowerPC G2_LE core, operating at 266 MHz. It is a member of the PowerQUICC II family and targets embedded and industrial communications applications that require integrated connectivity and memory controller support.

Designed for industrial environments, the device provides a 3.3 V I/O interface, dual 10/100 Mbps Ethernet ports, USB 2.0 support, DRAM/SDRAM controllers and a compact 516-PBGA (27×27 mm) surface-mount package with an operating range of −40 °C to 105 °C.

Key Features

• Core  Dual-issue PowerPC G2_LE core; single 32-bit core operating at 266 MHz for deterministic embedded processing.
• Memory and MMU  Integrated memory management units and separate instruction/data caches (family documentation indicates 16 KB I-cache and 16 KB D-cache); on-chip DRAM/SDRAM controllers simplify external memory interfacing.
• Communications & Coprocessors  Integrated modified Communications Processor Module (CPM) and communications DSP capabilities for offloading protocol and packet tasks.
• Ethernet & USB  Dual 10/100 Mbps Ethernet controllers and one USB 2.0 full/low-rate controller provide robust wired connectivity options.
• Additional Interfaces  I2C interface plus general-purpose serial controllers typical of the PowerQUICC II family for peripheral control and management.
• System I/O and Voltage  3.3 V I/O signalling compatible with common embedded peripherals.
• Package & Mounting  516-pin PBGA package (27×27 mm), surface-mount for compact system-level integration.
• Industrial Qualification & Temperature  Qualified for industrial use with an operating temperature range of −40 °C to 105 °C.
• PCI Bridge  On-chip PCI bridge support as documented for the PowerQUICC II family for system expansion.

Typical Applications

• Industrial Networking & Gateways  Dual 10/100 Ethernet ports and CPM/DSP resources make the device suitable for protocol handling and packet processing in industrial routers and gateways.
• Embedded Communications Appliances  Single-core PowerPC processing with integrated USB and serial interfaces supports compact communications appliances and peripheral controllers.
• Industrial Control & Automation  Industrial temperature rating and DRAM/SDRAM controller support enable deployment in control nodes and field equipment operating in harsh environments.
• System Expansion & I/O Concentration  On-chip PCI bridge and multiple serial interfaces support designs that require system-level expansion and consolidated I/O control.

Unique Advantages

• Highly integrated communications interfaces: Dual 10/100 Ethernet ports, USB 2.0 and I2C reduce external PHY and controller count for streamlined board design.
• Embedded memory management: MMUs with separate instruction and data caches and DRAM/SDRAM controller support provide a foundation for efficient memory architectures.
• Communications offload capability: Built-in CPM and communications DSP resources let designers offload protocol handling from the main core to improve system determinism.
• Industrial-ready thermal range: −40 °C to 105 °C operating range and industrial qualification support deployment in temperature-sensitive and rugged environments.
• Compact, surface-mount PBGA package: 516-pin 27×27 mm PBGA enables high pin-count connectivity in a compact footprint suitable for space-constrained embedded systems.
• 3.3 V I/O compatibility: Standard 3.3 V I/O simplifies interfacing with common legacy and modern peripherals.

Why Choose MPC8247CZQMIBA?

The MPC8247CZQMIBA delivers a balanced combination of PowerPC G2_LE processing, integrated communications peripherals and memory controller support aimed at embedded and industrial communications designs. Its family-level documentation and on-chip CPM/DSP resources make it a practical option for systems that require protocol handling, Ethernet connectivity and controlled memory architectures.

With industrial qualification, a broad operating temperature range and a compact 516-PBGA package, the MPC8247CZQMIBA is well suited to engineers designing rugged, connectivity-focused embedded systems that need a single-chip communications-capable processor backed by PowerQUICC II family documentation from NXP Semiconductors.

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