MPC8245TVV300D

The MPC8245TVV300D is a PowerPC 603e-based microprocessor module from NXP Semiconductors, delivering a 300 MHz single-core, 32-bit processing solution for embedded designs. It integrates an SDRAM memory controller and system interfaces in a 352-TBGA supplier package, targeting industrial embedded applications that require a robust temperature range and standard 3.3 V I/O.

Key Features

• Core PowerPC 603e single-core 32-bit processor running at 300 MHz for deterministic embedded processing.
• Memory Integrated SDRAM controller to support external SDRAM memory architectures.
• Power and I/O 3.3 V I/O voltage compatibility for common embedded system interfacing.
• Interfaces Includes I2C as an additional system interface for peripheral control and board-level management.
• Package and Mounting Supplier device package: 352-TBGA (35×35); package case listed as 352-LBGA. Surface mount device suitable for compact board layouts.
• Qualification and Temperature Industrial qualification with an operating temperature range of −40 °C to 105 °C for deployment in demanding environments.
• Environmental Compliance RoHS compliant construction to meet lead-free manufacturing requirements.

Typical Applications

• Industrial Embedded Systems Suitable for embedded control platforms where industrial qualification and extended temperature range are required.
• Control and Automation Single-core 32-bit processing and SDRAM support for control logic, sequencing, and deterministic tasks in automation equipment.
• Networking and Communication Modules I2C and standard 3.3 V I/O enable integration with board-level peripherals and system management functions.

Unique Advantages

• Proven PowerPC 603e Core: Provides a known 32-bit architecture at 300 MHz for consistent embedded performance.
• Integrated SDRAM Controller: Simplifies memory subsystem design and reduces external controller BOM.
• Industrial Temperature Range: Rated from −40 °C to 105 °C to support deployment in harsh or temperature-variable environments.
• High-Density Package: 352-TBGA (35×35) supplier package supports compact, high-pin-count board layouts for integration-dense designs.
• Standard 3.3 V I/O: Eases compatibility with a wide range of embedded peripherals and board-level logic.
• RoHS Compliant: Meets lead-free manufacturing requirements for regulated production environments.

Why Choose MPC8245TVV300D?

The MPC8245TVV300D combines a PowerPC 603e 300 MHz core, integrated SDRAM controller, and industrial-grade temperature rating in a compact 352-TBGA package, making it well suited for embedded and industrial applications that require reliable, mid-range processing and robust environmental performance. As a component from NXP Semiconductors, it fits designs that prioritize a 32-bit PowerPC architecture, standard 3.3 V I/O, and board-level flexibility provided by I2C and surface-mount packaging.

This device is ideal for engineers and procurement teams building industrial embedded systems, control equipment, or communication modules where predictable processing, SDRAM support, and extended temperature operation are key selection criteria.

Request a quote or submit an inquiry to purchase MPC8245TVV300D and evaluate its fit for your next industrial embedded design.