MPC8245TVV300D-NXP

The MPC8245TVV300D-NXP is a single-core PowerPC™ MPC603e RISC microprocessor delivering 300 MHz operation in a compact ball-grid package. It is targeted at embedded and industrial applications that require a 32-bit processor core with on-chip memory controller and DMA support.

With industrial temperature qualification and 3.3 V I/O, this device combines PowerPC architecture performance with system-level integration suitable for robust embedded designs.

Key Features

• Core Single PowerPC™ MPC603e core, 32-bit architecture running at 300 MHz for deterministic embedded processing.
• Memory and DMA Integrated SDRAM controller and DMA interface support for efficient data movement and external memory access.
• Voltage and I/O 3.3 V I/O voltage compatibility for interfacing with common embedded logic and peripherals.
• Package and Mounting Available in a 352-ball TBGA supplier package (35×35) with 352-LBGA package case designation; surface-mount mounting type suits high-density board layouts.
• Qualification and Temperature Range Industrial qualification with an operating temperature range of –40 °C to 105 °C for extended environmental tolerance.
• Interfaces On-chip DMA support to offload data transfer tasks and simplify system design.
• Environmental Compliance RoHS compliant to meet common environmental requirements.

Typical Applications

• Industrial Embedded Control — Processing and control in industrial equipment that requires a 32-bit PowerPC core and extended temperature operation.
• Embedded Communication Equipment — Use where a single-core processor with SDRAM interface and DMA can handle protocol processing and data buffering.
• General Embedded Systems — Integration into embedded devices that need a compact surface-mount processor solution with standard 3.3 V I/O.

Unique Advantages

• PowerPC Architecture: Provides a standardized 32-bit RISC core for legacy PowerPC designs and software compatibility within the MPC82xx family.
• Industrial Temperature Qualification: Rated from –40 °C to 105 °C to support deployments in demanding environmental conditions.
• On-Die SDRAM Controller and DMA: Reduces external controller requirements and simplifies high-speed data transfer design.
• Compact High-Density Package: 352-TBGA (35×35) and 352-LBGA package case fit space-constrained PCBs while supporting surface-mount assembly.
• 3.3 V I/O Compatibility: Ensures straightforward interfacing with common embedded peripherals and logic families.
• RoHS Compliant: Meets environmental compliance expectations for modern electronics production.

Why Choose MPC8245TVV300D-NXP?

The MPC8245TVV300D-NXP offers a balanced combination of PowerPC MPC603e processing, integrated memory/DMA capabilities, and industrial-grade temperature tolerance, making it suitable for embedded and industrial system designs that prioritize deterministic 32-bit processing and robust operation. Its 3.3 V I/O and compact BGA packaging simplify board-level integration in space-constrained applications.

Provided by NXP Semiconductors and built to MPC82xx series characteristics, this device is a practical option for engineering teams implementing reliable embedded solutions that require a single-core PowerPC processor with SDRAM support and industrial qualification.

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