MPC8245LVV350D
| Part Description |
PowerPC 603e Microprocessor IC MPC82xx 1 Core, 32-Bit 350MHz 352-TBGA (35x35) |
|---|---|
| Quantity | 1,200 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8245 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Core Processor | PowerPC 603e | Device Package | 352-TBGA (35x35) | ECCN | 3A991A2 | ||
|---|---|---|---|---|---|---|---|
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | 0°C ~ 105°C (TA) | Package / Case | 352-LBGA | RAM Controllers | SDRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 350MHz | ||
| Supplier Device Package | 352-TBGA (35×35) | Voltage – I/O | 3.3V |
Overview of MPC8245LVV350D – IC MPU MPC82XX 350MHz 352-TBGA
The MPC8245LVV350D is a single‑core, 32‑bit microprocessor based on the PowerPC™ 603e core, operating at 350 MHz. It integrates a PowerPC MPC603e processor core with peripheral logic to support PCI peripherals and standard embedded interfaces.
Designed for consumer and embedded applications, the device combines processor performance, memory subsystem support, and on‑chip peripheral logic to simplify system design and accelerate time to market.
Key Features
- Core Superscalar PowerPC 603e processor core, 32‑bit, single core running at 350 MHz with floating‑point support and integrated MMU.
- Caches 16‑Kbyte instruction cache and 16‑Kbyte data cache for reduced memory latency and improved instruction throughput.
- Memory subsystem High‑performance memory controller with support for SDRAM and ROM; includes ECC controller and memory timing features described in the MPC8245 hardware specification.
- Integrated peripheral logic On‑chip PCI bridge plus integrated peripherals including DUART, DMA controller, programmable interrupt controller (PIC), timers, message unit (with I2O), and I2C controller to reduce external components.
- System interfaces PCI bus interface and standard serial/control interfaces (I2C, DUART) for connecting PCI peripherals and board‑level devices.
- Package and mounting 352‑TBGA (35 × 35 mm) package, surface‑mount configuration suitable for compact board designs.
- Electrical I/O voltage: 3.3 V, matching common embedded system power rails.
- Operating range Qualified for consumer applications with an operating temperature range of 0 °C to 105 °C.
- Compliance RoHS compliant.
Typical Applications
- PCI‑based embedded systems Use the integrated PCI bridge and peripheral logic to host PCI peripherals and standard expansion cards within compact embedded platforms.
- Consumer embedded products Processor performance, SDRAM support, and integrated I/O make it suitable for consumer devices requiring general‑purpose compute and system control.
- Control and communication modules On‑chip DMA, interrupt controller, DUART and I2C facilitate deterministic control, serial communications, and peripheral interfacing.
- Memory‑centric designs High‑performance memory controller with ECC support is tailored for designs that rely on SDRAM and ROM for code and data storage.
Unique Advantages
- Highly integrated processor and peripheral logic: Reduces bill of materials by combining a PowerPC core with PCI bridge, memory controller and common peripherals on a single device.
- Optimized for PCI ecosystems: Built‑in PCI bridge and bus interface simplify integration with PCI peripherals and standard PC‑style expansion devices.
- Balanced performance: 350 MHz PowerPC 603e core with instruction and data caches plus floating‑point support delivers responsive compute for embedded workloads.
- Robust memory support: Memory controller with SDRAM support and ECC capabilities helps maintain data integrity in memory‑driven applications.
- Compact packaging: 352‑TBGA (35×35 mm) surface‑mount package enables dense board layouts for space‑constrained designs.
- Regulatory and temperature considerations: RoHS compliance and a 0 °C to 105 °C operating range align with a wide set of consumer and embedded deployment scenarios.
Why Choose MPC8245LVV350D?
The MPC8245LVV350D positions itself as a balanced, integrated microprocessor solution for embedded and consumer systems that require a PowerPC 603e core, PCI connectivity, and a capable memory subsystem. With on‑chip peripheral logic and standard interfaces, it streamlines system architecture and shortens design cycles.
Manufactured by NXP Semiconductors as part of the MPC8245 family, this device is suited for designers seeking a single‑chip approach combining CPU performance, memory control, and peripheral integration, backed by documented hardware specifications for system implementation.
Request a quote or submit an inquiry to receive pricing and availability information for the MPC8245LVV350D and to discuss how it can fit into your next embedded design.

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