MPC8245ARZU400D
| Part Description |
PowerPC 603e Microprocessor IC MPC82xx 1 Core, 32-Bit 400MHz 352-TBGA (35x35) |
|---|---|
| Quantity | 1,479 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8245 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Core Processor | PowerPC 603e | Device Package | 352-TBGA (35x35) | ECCN | 3A991A2 | ||
|---|---|---|---|---|---|---|---|
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | 0°C ~ 85°C (TA) | Package / Case | 352-LBGA | RAM Controllers | SDRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | RoHS non-compliant | Speed | 400MHz | ||
| Supplier Device Package | 352-TBGA (35×35) | Voltage – I/O | 3.3V |
Overview of MPC8245ARZU400D – IC MPU MPC82XX 400MHZ 352TBGA
The MPC8245ARZU400D is an NXP Semiconductors PowerPC-based microprocessor integrating a PowerPC 603e core running at 400 MHz with peripheral logic and a PCI bridge. Designed for embedded and consumer-class systems, it delivers a compact, system-oriented solution that combines processor performance with on-chip memory and peripheral controllers.
With a single 32-bit core, SDRAM memory controller, I2C interface, and surface-mount 352-TBGA (35×35) package, this device targets embedded designs that require tight integration of CPU, memory and standard system interfaces while operating from 3.3 V I/O and across a 0 °C to 85 °C temperature range.
Key Features
- Core — PowerPC 603e single 32-bit superscalar processor core, 400 MHz clock speed, with instruction and data caches (16 Kbyte instruction cache, 16 Kbyte data cache documented in the integrated processor datasheet).
- Integrated PCI Bridge & Peripheral Logic — On-chip PCI bridge and peripheral logic simplify system design by providing standard PCI connectivity alongside integrated controllers (DUART, DMA controller, interrupt controller, timers).
- Memory Subsystem — High-performance memory controller with support for SDRAM and ROM, plus ECC controller and memory management features documented in the hardware specification.
- System Interfaces — Built-in I2C controller, DUART, message/I2O unit, JTAG/COP interface and multiple serial/interrupt resources for flexible peripheral connectivity and debug.
- Power & Clock — Integrated processor PLLs and power-management features to support system clocking and power control as described in the hardware documentation.
- Package & Mounting — 352-TBGA (35×35) surface-mount package (supplier device package) with package case listed as 352-LBGA in product specifications.
- Electrical & Environmental — 3.3 V I/O voltage and RoHS compliant; operating temperature range 0 °C to 85 °C (consumer qualification).
Typical Applications
- Embedded System Controllers — Use the integrated PCI bridge and peripheral logic to build compact embedded controllers that interface with standard PCI peripherals.
- Consumer Electronics — Suitable for consumer-class products requiring a 400 MHz PowerPC core with on-chip memory controller and serial interfaces for control and user-interface processing.
- Communications and Control Modules — On-chip DUART, DMA, interrupt controller and I2C support real-time communications and subsystem control in network or device modules.
Unique Advantages
- Highly integrated processor-peripheral combination: On-chip PCI bridge, memory controller and peripheral logic reduce external component count and simplify board design.
- Proven PowerPC 603e core: 400 MHz single-core architecture with instruction and data caches for predictable embedded performance.
- Flexible memory support: High-performance SDRAM controller and ECC/documented memory management features enable robust system memory handling.
- Compact surface-mount package: 352-TBGA (35×35) package optimizes PCB area for dense embedded boards.
- Design documentation available: Hardware specification and integrated processor reference material are provided to support system-level design and validation.
- Environmental compliance: RoHS compliant construction supports regulatory requirements for lead-free assemblies.
Why Choose MPC8245ARZU400D?
The MPC8245ARZU400D positions a PowerPC 603e 400 MHz core alongside an integrated PCI bridge, SDRAM controller and a broad set of peripheral logic on a single 352-TBGA device. This combination delivers a balanced mix of processing capability and system-level integration for embedded and consumer designs that demand consolidated functionality and streamlined BOM.
Engineers and procurement teams benefit from a documented hardware specification and integrated processor reference resources from NXP Semiconductors, enabling straightforward integration into designs that require on-chip PCI support, serial interfaces and memory control while operating at 3.3 V I/O and across a 0 °C to 85 °C range.
Request a quote or submit a pricing and availability inquiry today to evaluate the MPC8245ARZU400D for your embedded design needs.

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