MPC8245ARZU400D

IC MPU MPC82XX 400MHZ 352TBGA
Part Description

PowerPC 603e Microprocessor IC MPC82xx 1 Core, 32-Bit 400MHz 352-TBGA (35x35)

Quantity 1,479 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8245
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorPowerPC 603eDevice Package352-TBGA (35x35)ECCN3A991A2
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 85°C (TA)Package / Case352-LBGARAM ControllersSDRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceRoHS non-compliantSpeed400MHz
Supplier Device Package352-TBGA (35×35)Voltage – I/O3.3V

Overview of MPC8245ARZU400D – IC MPU MPC82XX 400MHZ 352TBGA

The MPC8245ARZU400D is an NXP Semiconductors PowerPC-based microprocessor integrating a PowerPC 603e core running at 400 MHz with peripheral logic and a PCI bridge. Designed for embedded and consumer-class systems, it delivers a compact, system-oriented solution that combines processor performance with on-chip memory and peripheral controllers.

With a single 32-bit core, SDRAM memory controller, I2C interface, and surface-mount 352-TBGA (35×35) package, this device targets embedded designs that require tight integration of CPU, memory and standard system interfaces while operating from 3.3 V I/O and across a 0 °C to 85 °C temperature range.

Key Features

  • Core — PowerPC 603e single 32-bit superscalar processor core, 400 MHz clock speed, with instruction and data caches (16 Kbyte instruction cache, 16 Kbyte data cache documented in the integrated processor datasheet).
  • Integrated PCI Bridge & Peripheral Logic — On-chip PCI bridge and peripheral logic simplify system design by providing standard PCI connectivity alongside integrated controllers (DUART, DMA controller, interrupt controller, timers).
  • Memory Subsystem — High-performance memory controller with support for SDRAM and ROM, plus ECC controller and memory management features documented in the hardware specification.
  • System Interfaces — Built-in I2C controller, DUART, message/I2O unit, JTAG/COP interface and multiple serial/interrupt resources for flexible peripheral connectivity and debug.
  • Power & Clock — Integrated processor PLLs and power-management features to support system clocking and power control as described in the hardware documentation.
  • Package & Mounting — 352-TBGA (35×35) surface-mount package (supplier device package) with package case listed as 352-LBGA in product specifications.
  • Electrical & Environmental — 3.3 V I/O voltage and RoHS compliant; operating temperature range 0 °C to 85 °C (consumer qualification).

Typical Applications

  • Embedded System Controllers — Use the integrated PCI bridge and peripheral logic to build compact embedded controllers that interface with standard PCI peripherals.
  • Consumer Electronics — Suitable for consumer-class products requiring a 400 MHz PowerPC core with on-chip memory controller and serial interfaces for control and user-interface processing.
  • Communications and Control Modules — On-chip DUART, DMA, interrupt controller and I2C support real-time communications and subsystem control in network or device modules.

Unique Advantages

  • Highly integrated processor-peripheral combination: On-chip PCI bridge, memory controller and peripheral logic reduce external component count and simplify board design.
  • Proven PowerPC 603e core: 400 MHz single-core architecture with instruction and data caches for predictable embedded performance.
  • Flexible memory support: High-performance SDRAM controller and ECC/documented memory management features enable robust system memory handling.
  • Compact surface-mount package: 352-TBGA (35×35) package optimizes PCB area for dense embedded boards.
  • Design documentation available: Hardware specification and integrated processor reference material are provided to support system-level design and validation.
  • Environmental compliance: RoHS compliant construction supports regulatory requirements for lead-free assemblies.

Why Choose MPC8245ARZU400D?

The MPC8245ARZU400D positions a PowerPC 603e 400 MHz core alongside an integrated PCI bridge, SDRAM controller and a broad set of peripheral logic on a single 352-TBGA device. This combination delivers a balanced mix of processing capability and system-level integration for embedded and consumer designs that demand consolidated functionality and streamlined BOM.

Engineers and procurement teams benefit from a documented hardware specification and integrated processor reference resources from NXP Semiconductors, enabling straightforward integration into designs that require on-chip PCI support, serial interfaces and memory control while operating at 3.3 V I/O and across a 0 °C to 85 °C range.

Request a quote or submit a pricing and availability inquiry today to evaluate the MPC8245ARZU400D for your embedded design needs.

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