MPC8245ARVV400D

IC MPU MPC82XX 400MHZ 352TBGA
Part Description

PowerPC 603e Microprocessor IC MPC82xx 1 Core, 32-Bit 400MHz 352-TBGA (35x35)

Quantity 476 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8245
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorPowerPC 603eDevice Package352-TBGA (35x35)ECCN3A991A2
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 85°C (TA)Package / Case352-LBGARAM ControllersSDRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed400MHz
Supplier Device Package352-TBGA (35×35)Voltage – I/O3.3V

Overview of MPC8245ARVV400D – IC MPU MPC82XX 400MHz 352-TBGA

The MPC8245ARVV400D is a PowerPC 603e-based 32-bit microprocessor integrating a high-performance processor core with system-level peripheral logic. Operating at 400 MHz with 3.3 V I/O, it targets embedded and consumer applications that require a compact, highly integrated processor solution.

On-chip peripheral logic includes a PCI bridge and a memory controller supporting ROM and SDRAM, enabling rapid system designs that leverage PCI peripherals and standard memory subsystems while keeping board-level complexity low.

Key Features

  • PowerPC 603e Core  A single 32-bit superscalar processor core with floating-point support, MMU and on-chip instruction and data caches (16 KB each) for deterministic embedded performance.
  • 400 MHz Operation  Processor clocked at 400 MHz, suitable for compute tasks in embedded consumer systems.
  • Integrated Peripheral Logic  Includes a PCI bridge, DUART, DMA controller, interrupt controller (PIC), message unit with I2O, and timers to simplify system integration.
  • Memory Subsystem  High-performance memory controller supporting various ROM types and SDRAM, with ECC controller and address translation facilities described in the hardware specification.
  • Standard Interfaces  I2C controller plus multiple serial and parallel interface options in the peripheral logic block to connect sensors and peripherals.
  • Package and Mounting  Supplied in a 352-TBGA (35×35) surface-mount package (352-LBGA package case) for high I/O density and compact board footprint.
  • Voltage and Temperature  3.3 V I/O operation and a consumer-grade operating temperature range of 0 °C to 85 °C.
  • Development and Debug Support  On-chip JTAG/COP interface and configuration facilities are provided as part of the integrated processor feature set.

Typical Applications

  • Consumer Embedded Systems  Control and application processing in consumer electronic products leveraging the integrated peripherals and SDRAM support.
  • PCI-Based Embedded Platforms  Embedded designs that require a built-in PCI bridge to interface with PCI peripherals and expansion cards.
  • Networking and Communications Modules  Edge devices and modules that benefit from DMA, interrupt controller, and message/I2O support for data movement and control.

Unique Advantages

  • Highly Integrated Peripheral Set:  On-chip PCI bridge, DUART, DMA, interrupt controller and I2C reduce external components and simplify PCB design.
  • Balanced Processor Subsystem:  PowerPC 603e core with FPU, MMU and 16 KB instruction/data caches delivers a practical blend of performance and efficiency for embedded workloads.
  • Flexible Memory Support:  Memory controller supports ROM and SDRAM types with ECC options, enabling robust system memory choices.
  • Compact High-Density Package:  352-TBGA (35×35) surface-mount package provides high pin count in a compact footprint for space-constrained designs.
  • Ready for PCI Integration:  Built-in PCI bridge accelerates designs that must incorporate existing PCI peripherals and expansion capabilities.
  • Production-Friendly Voltage and Temperature:  3.3 V I/O and consumer operating range (0 °C to 85 °C) align with common embedded product requirements.

Why Choose MPC8245ARVV400D?

The MPC8245ARVV400D positions itself as a practical, integrated microprocessor option for embedded and consumer applications that require a PowerPC 603e core combined with system-level peripherals. Its 400 MHz clock rate, integrated PCI bridge, and SDRAM-capable memory controller help reduce board-level complexity and accelerate time-to-market.

With comprehensive on-chip logic—DMA, interrupt controller, I2C, DUART and debug interfaces—this device is suited to designers seeking a compact solution that consolidates processor and platform functions while relying on available hardware documentation for system design and validation.

Request a quote or submit an inquiry for pricing and availability to evaluate the MPC8245ARVV400D for your next embedded design.

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