MPC823ZQ81B2T

IC MPU MPC8XX 81MHZ 256BGA
Part Description

PowerPC Microprocessor IC MPC8xx 1 Core, 32-Bit 81MHz 256-PBGA (23x23)

Quantity 98 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC823
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPCDevice Package256-PBGA (23x23)
Display & Interface ControllersLCD, VideoECCN3A991A2Ethernet10Mbps (1)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 95°C (TA)Package / Case256-BBGARAM ControllersDRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceRoHS non-compliantSpeed81MHz
Supplier Device Package256-PBGA (23×23)USBUSB 1.x (1)Voltage – I/O3.3V

Overview of MPC823ZQ81B2T – IC MPU MPC8XX 81MHZ 256BGA

The MPC823ZQ81B2T is a PowerPC-based embedded microprocessor designed for consumer-focused embedded applications. It integrates a single 32-bit PowerPC core running at 81 MHz together with a dedicated communications processor module (CPM) and a broad set of on-chip peripherals to support portable, image-capture and personal-communication products.

This device delivers a compact, highly integrated solution with on-chip DRAM controller, display interface controllers, USB and Ethernet connectivity, and serial interfaces, enabling efficient system designs that require mixed processing and peripheral functions at 3.3 V I/O levels.

Key Features

  • PowerPC Core  Single 32-bit PowerPC core operating at 81 MHz for embedded control and application processing.
  • Communications Processor Module (CPM)  On-chip RISC communications processor for offloading imaging and communication tasks from the main core, enabling parallel processing of peripheral workloads.
  • Memory and Cache  On-chip support for DRAM controllers and caching architecture drawn from the series datasheet to improve system memory performance.
  • Wide Peripheral Set  Integrated interfaces including USB 1.x (1 channel), 10 Mbps Ethernet (1), I2C, serial peripheral interface and multiple serial channels for flexible connectivity.
  • Display and Video Support  On-chip LCD and video display controllers suitable for embedded user interfaces and image display tasks.
  • Power and I/O  3.3 V I/O boundary for compatibility with standard embedded IO levels; surface-mount package simplifies board integration.
  • Package and Mounting  256-PBGA (23 × 23 mm) package in a surface-mount form factor for compact board designs.
  • Operating Range and Qualification  Consumer-qualified device with an operating temperature range of 0 °C to 95 °C; RoHS compliant.

Typical Applications

  • Mobile and Portable Devices  Ideal for low-power portable electronics where integrated processing and peripheral functions reduce system complexity.
  • Image Capture and Processing  CPM and video/LCD controllers support imaging workflows and display pipelines in camera or capture devices.
  • Personal Communication Products  USB, serial channels and CPM support communications and protocol handling in handheld or personal communication systems.
  • Embedded Multimedia and Display Systems  On-chip video and LCD interfaces enable compact multimedia UI implementations in consumer products.

Unique Advantages

  • Integrated Communications Offload  The on-chip CPM offloads imaging and protocol processing from the main PowerPC core, allowing parallel task handling and more efficient use of CPU resources.
  • Broad On-Chip Connectivity  USB 1.x, 10 Mbps Ethernet, I2C and multiple serial interfaces reduce external component count and simplify board-level design.
  • Compact PBGA Package  256-PBGA (23×23) surface-mount package provides a small footprint for space-constrained embedded systems.
  • 3.3 V I/O Compatibility  Standardized I/O voltage simplifies integration with common peripheral devices and board-level power rails.
  • Consumer-Grade Thermal Range  Rated for 0 °C to 95 °C operation to suit a wide range of consumer embedded environments.
  • RoHS Compliant  Environmentally compliant construction supports regulatory and manufacturing requirements.

Why Choose MPC823ZQ81B2T?

The MPC823ZQ81B2T combines a PowerPC embedded core with a dedicated communications processor module and a rich set of on-chip peripherals to deliver a highly integrated platform for consumer embedded designs. Its mix of processing capability, peripheral integration and standard 3.3 V I/O makes it suitable for designs that require compact board layout, wired and serial connectivity, and display or imaging support.

This part is well suited to engineers developing portable, image-capture, personal-communications and multimedia consumer products who need an integrated microprocessor solution with surface-mount packaging and RoHS compliance.

Request a quote or submit an RFQ to evaluate MPC823ZQ81B2T for your next embedded design project.

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