MPC823ZQ81B2T
| Part Description |
PowerPC Microprocessor IC MPC8xx 1 Core, 32-Bit 81MHz 256-PBGA (23x23) |
|---|---|
| Quantity | 98 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC823 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC | Device Package | 256-PBGA (23x23) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD, Video | ECCN | 3A991A2 | Ethernet | 10Mbps (1) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | 0°C ~ 95°C (TA) | Package / Case | 256-BBGA | RAM Controllers | DRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | RoHS non-compliant | Speed | 81MHz | ||
| Supplier Device Package | 256-PBGA (23×23) | USB | USB 1.x (1) | Voltage – I/O | 3.3V |
Overview of MPC823ZQ81B2T – IC MPU MPC8XX 81MHZ 256BGA
The MPC823ZQ81B2T is a PowerPC-based embedded microprocessor designed for consumer-focused embedded applications. It integrates a single 32-bit PowerPC core running at 81 MHz together with a dedicated communications processor module (CPM) and a broad set of on-chip peripherals to support portable, image-capture and personal-communication products.
This device delivers a compact, highly integrated solution with on-chip DRAM controller, display interface controllers, USB and Ethernet connectivity, and serial interfaces, enabling efficient system designs that require mixed processing and peripheral functions at 3.3 V I/O levels.
Key Features
- PowerPC Core Single 32-bit PowerPC core operating at 81 MHz for embedded control and application processing.
- Communications Processor Module (CPM) On-chip RISC communications processor for offloading imaging and communication tasks from the main core, enabling parallel processing of peripheral workloads.
- Memory and Cache On-chip support for DRAM controllers and caching architecture drawn from the series datasheet to improve system memory performance.
- Wide Peripheral Set Integrated interfaces including USB 1.x (1 channel), 10 Mbps Ethernet (1), I2C, serial peripheral interface and multiple serial channels for flexible connectivity.
- Display and Video Support On-chip LCD and video display controllers suitable for embedded user interfaces and image display tasks.
- Power and I/O 3.3 V I/O boundary for compatibility with standard embedded IO levels; surface-mount package simplifies board integration.
- Package and Mounting 256-PBGA (23 × 23 mm) package in a surface-mount form factor for compact board designs.
- Operating Range and Qualification Consumer-qualified device with an operating temperature range of 0 °C to 95 °C; RoHS compliant.
Typical Applications
- Mobile and Portable Devices Ideal for low-power portable electronics where integrated processing and peripheral functions reduce system complexity.
- Image Capture and Processing CPM and video/LCD controllers support imaging workflows and display pipelines in camera or capture devices.
- Personal Communication Products USB, serial channels and CPM support communications and protocol handling in handheld or personal communication systems.
- Embedded Multimedia and Display Systems On-chip video and LCD interfaces enable compact multimedia UI implementations in consumer products.
Unique Advantages
- Integrated Communications Offload The on-chip CPM offloads imaging and protocol processing from the main PowerPC core, allowing parallel task handling and more efficient use of CPU resources.
- Broad On-Chip Connectivity USB 1.x, 10 Mbps Ethernet, I2C and multiple serial interfaces reduce external component count and simplify board-level design.
- Compact PBGA Package 256-PBGA (23×23) surface-mount package provides a small footprint for space-constrained embedded systems.
- 3.3 V I/O Compatibility Standardized I/O voltage simplifies integration with common peripheral devices and board-level power rails.
- Consumer-Grade Thermal Range Rated for 0 °C to 95 °C operation to suit a wide range of consumer embedded environments.
- RoHS Compliant Environmentally compliant construction supports regulatory and manufacturing requirements.
Why Choose MPC823ZQ81B2T?
The MPC823ZQ81B2T combines a PowerPC embedded core with a dedicated communications processor module and a rich set of on-chip peripherals to deliver a highly integrated platform for consumer embedded designs. Its mix of processing capability, peripheral integration and standard 3.3 V I/O makes it suitable for designs that require compact board layout, wired and serial connectivity, and display or imaging support.
This part is well suited to engineers developing portable, image-capture, personal-communications and multimedia consumer products who need an integrated microprocessor solution with surface-mount packaging and RoHS compliance.
Request a quote or submit an RFQ to evaluate MPC823ZQ81B2T for your next embedded design project.

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