MPC823VR81B2T
| Part Description |
PowerPC Microprocessor IC MPC8xx 1 Core, 32-Bit 81MHz 256-PBGA (23x23) |
|---|---|
| Quantity | 208 Available (as of October 7, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC823 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC | Device Package | 256-PBGA (23x23) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD, Video | ECCN | 3A991A2 | Ethernet | 10Mbps (1) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | 0°C ~ 95°C (TA) | Package / Case | 256-BBGA | RAM Controllers | DRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 81MHz | ||
| Supplier Device Package | 256-PBGA (23×23) | USB | USB 1.x (1) | Voltage – I/O | 3.3V |
Overview of MPC823VR81B2T – IC MPU MPC8XX 81MHZ 256BGA
The MPC823VR81B2T is a PowerPC-based microprocessor optimized for embedded applications requiring integrated peripheral support and efficient task offload. It combines a 32-bit single PowerPC core with a Communication Processor Module (CPM) to handle imaging and communications tasks.
Targeted use cases include low-power portable devices, image capture and personal communications products where integration of USB, display controllers and serial interfaces reduces system complexity and component count.
Key Features
- Core — Single 32-bit PowerPC core; the device is specified at 81 MHz and includes core-focused design elements from the MPC8xx family.
- Communication Processor Module (CPM) — On-chip CPM implements a RISC-style processor for communications and imaging tasks, enabling parallel processing and offloading of peripheral functions from the main core.
- Caches & Memory Management — Series documentation describes on-chip instruction and data caches and memory management support, including Translation Lookaside Buffers (TLBs) and multiple page-size support for virtual memory control.
- Interfaces — Integrated peripheral interfaces include USB 1.x, I2C, an Ethernet 10 Mbps channel, multiple serial channels and a serial peripheral interface for broad connectivity options.
- Display & Imaging — On-chip LCD and video display controllers plus CPM-based image processing support for compact imaging and display subsystems.
- Memory Controllers — DRAM controller support for external memory subsystems.
- Power & I/O — 3.3 V I/O boundary and design focused on low-power operation for portable applications.
- Package & Mounting — 256-PBGA (23 × 23 mm) package, surface-mount mounting type; package case listed as 256-BBGA.
- Operating Range — Consumer qualification with an operating temperature range of 0 °C to 95 °C and RoHS compliant status.
Typical Applications
- Portable Imaging Devices — Integrated CPM and video/LCD controllers support image capture and local display tasks while offloading the main core.
- Personal Communication Equipment — USB, serial channels and Ethernet connectivity enable communication-centric products that require protocol handling and interface flexibility.
- Handheld and Low-Power Systems — 3.3 V I/O and an architecture designed for efficient peripheral handling make the device suitable for power-conscious portable designs.
Unique Advantages
- Integrated Communication Offload: The CPM handles imaging and serial protocol tasks, reducing CPU load and simplifying firmware partitioning.
- Broad Peripheral Integration: Built-in USB, I2C, Ethernet and multiple serial channels reduce external component count and board complexity.
- Compact, Surface-Mount Package: 256-PBGA (23×23) package supports dense PCB layouts for space-constrained designs.
- Memory and Display Support: On-chip DRAM controller plus LCD and video controllers streamline memory and display subsystem design.
- RoHS Compliant: Conforms to RoHS requirements for environmentally sensitive designs.
Why Choose MPC823VR81B2T?
The MPC823VR81B2T combines a PowerPC core with a dedicated Communication Processor Module and a comprehensive set of integrated interfaces to deliver a highly integrated embedded processor solution. It is positioned for designers building portable, imaging or communication-focused products who need on-chip peripheral support and efficient task offload.
With a 3.3 V I/O boundary, consumer-grade operating temperature range, and a compact 256-PBGA package, this device offers a balance of integration and practicality for production designs supported by NXP Semiconductors documentation and resources.
Request a quote or contact sales to discuss availability and procurement for MPC823VR81B2T.

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