MPC823VR81B2T

IC MPU MPC8XX 81MHZ 256BGA
Part Description

PowerPC Microprocessor IC MPC8xx 1 Core, 32-Bit 81MHz 256-PBGA (23x23)

Quantity 208 Available (as of October 7, 2026)
Product CategoryMicroprocessors
Part SeriesMPC823
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPCDevice Package256-PBGA (23x23)
Display & Interface ControllersLCD, VideoECCN3A991A2Ethernet10Mbps (1)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 95°C (TA)Package / Case256-BBGARAM ControllersDRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed81MHz
Supplier Device Package256-PBGA (23×23)USBUSB 1.x (1)Voltage – I/O3.3V

Overview of MPC823VR81B2T – IC MPU MPC8XX 81MHZ 256BGA

The MPC823VR81B2T is a PowerPC-based microprocessor optimized for embedded applications requiring integrated peripheral support and efficient task offload. It combines a 32-bit single PowerPC core with a Communication Processor Module (CPM) to handle imaging and communications tasks.

Targeted use cases include low-power portable devices, image capture and personal communications products where integration of USB, display controllers and serial interfaces reduces system complexity and component count.

Key Features

  • Core — Single 32-bit PowerPC core; the device is specified at 81 MHz and includes core-focused design elements from the MPC8xx family.
  • Communication Processor Module (CPM) — On-chip CPM implements a RISC-style processor for communications and imaging tasks, enabling parallel processing and offloading of peripheral functions from the main core.
  • Caches & Memory Management — Series documentation describes on-chip instruction and data caches and memory management support, including Translation Lookaside Buffers (TLBs) and multiple page-size support for virtual memory control.
  • Interfaces — Integrated peripheral interfaces include USB 1.x, I2C, an Ethernet 10 Mbps channel, multiple serial channels and a serial peripheral interface for broad connectivity options.
  • Display & Imaging — On-chip LCD and video display controllers plus CPM-based image processing support for compact imaging and display subsystems.
  • Memory Controllers — DRAM controller support for external memory subsystems.
  • Power & I/O — 3.3 V I/O boundary and design focused on low-power operation for portable applications.
  • Package & Mounting — 256-PBGA (23 × 23 mm) package, surface-mount mounting type; package case listed as 256-BBGA.
  • Operating Range — Consumer qualification with an operating temperature range of 0 °C to 95 °C and RoHS compliant status.

Typical Applications

  • Portable Imaging Devices — Integrated CPM and video/LCD controllers support image capture and local display tasks while offloading the main core.
  • Personal Communication Equipment — USB, serial channels and Ethernet connectivity enable communication-centric products that require protocol handling and interface flexibility.
  • Handheld and Low-Power Systems — 3.3 V I/O and an architecture designed for efficient peripheral handling make the device suitable for power-conscious portable designs.

Unique Advantages

  • Integrated Communication Offload: The CPM handles imaging and serial protocol tasks, reducing CPU load and simplifying firmware partitioning.
  • Broad Peripheral Integration: Built-in USB, I2C, Ethernet and multiple serial channels reduce external component count and board complexity.
  • Compact, Surface-Mount Package: 256-PBGA (23×23) package supports dense PCB layouts for space-constrained designs.
  • Memory and Display Support: On-chip DRAM controller plus LCD and video controllers streamline memory and display subsystem design.
  • RoHS Compliant: Conforms to RoHS requirements for environmentally sensitive designs.

Why Choose MPC823VR81B2T?

The MPC823VR81B2T combines a PowerPC core with a dedicated Communication Processor Module and a comprehensive set of integrated interfaces to deliver a highly integrated embedded processor solution. It is positioned for designers building portable, imaging or communication-focused products who need on-chip peripheral support and efficient task offload.

With a 3.3 V I/O boundary, consumer-grade operating temperature range, and a compact 256-PBGA package, this device offers a balance of integration and practicality for production designs supported by NXP Semiconductors documentation and resources.

Request a quote or contact sales to discuss availability and procurement for MPC823VR81B2T.

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