MPC823VR75B2T

IC MPU MPC8XX 75MHZ 256BGA
Part Description

PowerPC Microprocessor IC MPC8xx 1 Core, 32-Bit 75MHz 256-PBGA (23x23)

Quantity 1,290 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC823
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPCDevice Package256-PBGA (23x23)
Display & Interface ControllersLCD, VideoECCN3A991A2Ethernet10Mbps (1)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 95°C (TA)Package / Case256-BBGARAM ControllersDRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed75MHz
Supplier Device Package256-PBGA (23×23)USBUSB 1.x (1)Voltage – I/O3.3V

Overview of MPC823VR75B2T – IC MPU MPC8XX 75MHZ 256BGA

The MPC823VR75B2T is a single-core PowerPC microprocessor with integrated peripheral functionality, designed for embedded and mobile computing applications. It combines a 32-bit PowerPC core with a dedicated communication processor module (CPM) and on-chip controllers for video, LCD, USB and serial interfaces, offering a compact, low-voltage solution for portable, image-capture and personal-communication products.

Key Features

  • PowerPC Core – 32-bit, 75 MHz: Single-issue PowerPC core operating at 75 MHz, delivering measured Dhrystone performance as indicated in the product datasheet.
  • On-chip Communication Processor Module (CPM): Integrated RISC CPM provides parallel processing for communications and imaging tasks and is documented to deliver 75+ MIPS at 75 MHz, reducing load on the main core.
  • Caches and MMU: On-chip instruction and data caches (2K instruction, 1K data) with memory management units and fully associative TLBs supporting multiple page sizes for flexible memory mapping.
  • Integrated Interfaces: Built-in controllers include USB 1.x, a 10 Mbps Ethernet interface, I2C, LCD and video display controllers, serial peripheral interface and multiple serial channels for connectivity and display control.
  • Peripheral and DMA Support: Virtual DMA channels and a dedicated DMA accelerator enable programmable memory-to-memory and memory-to-I/O transfers to offload peripheral tasks from the core.
  • Bus and Endianness Flexibility: Dynamic data bus sizing supports 8-, 16-, and 32-bit buses and configurable endianness to interface with a range of memory systems and external devices.
  • Powering and Operating Range: 3.3 V I/O boundary with a completely static design supporting 0–75 °C operation and surface-mount 256‑PBGA package (23 × 23 mm).
  • Consumer Qualification and RoHS Compliance: Device is qualified for consumer applications and is RoHS compliant.

Typical Applications

  • Mobile and Handheld Computing: Integrated core and peripheral set make the device suitable for compact mobile computing platforms and handheld systems that require display and serial connectivity.
  • Image Capture and Processing: CPM’s embedded signal-processing capability supports image compression/decompression and offloads imaging tasks from the main core.
  • Personal Communication Devices: On-chip USB, serial channels and Ethernet provide connectivity for communication-oriented embedded devices.
  • Embedded Display Systems: Built-in LCD and video display controllers simplify designs that require user interfaces or video output in a compact package.

Unique Advantages

  • Highly Integrated Architecture: Combines a PowerPC core, RISC CPM, display controllers and multiple serial/USB/Ethernet interfaces on a single chip to reduce BOM and board complexity.
  • Parallel Processing via CPM: CPM runs in parallel with the main core and is capable of handling communication and imaging workloads, improving overall system efficiency.
  • Flexible Memory and Bus Handling: Dynamic bus sizing and comprehensive MMU/TLB support enable flexible memory interfacing and protection schemes for varied embedded designs.
  • Low-Voltage, Static Operation: 3.3 V I/O and a completely static design allow predictable operation across the specified frequency range up to 75 MHz.
  • Compact Surface-Mount Package: 256‑pin PBGA (23 × 23 mm) package supports high integration density in space-constrained designs.
  • Consumer-Grade Qualification and RoHS Compliance: Suited for consumer product lifecycles with environmental compliance aligned to RoHS requirements.

Why Choose MPC823VR75B2T?

The MPC823VR75B2T positions itself as a compact, integrated microprocessor solution for embedded designs that require a balance of core processing and dedicated peripheral handling. Its combination of a PowerPC core, a communication processor module, on-chip display and connectivity controllers, and flexible memory support makes it suitable for portable, imaging and communication-focused products.

Designers targeting consumer applications who need a single-chip approach to reduce board complexity and offload peripheral processing will find the MPC823VR75B2T a practical choice, providing a deterministic operating range, a small PBGA footprint, and the architectural features documented in the product datasheet.

Request a quote or submit an inquiry to receive pricing, availability and detailed ordering information for MPC823VR75B2T tailored to your project requirements.

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