MPC755CRX400LE
| Part Description |
PowerPC Microprocessor IC MPC7xx 1 Core, 32-Bit 400MHz 360-CBGA (25x25) |
|---|---|
| Quantity | 166 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC755 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Core Processor | PowerPC | Device Package | 360-CBGA (25x25) | ECCN | 3A991A2 | ||
|---|---|---|---|---|---|---|---|
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 1 (Unlimited) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | 0°C ~ 105°C (TA) | Package / Case | 360-BCBGA, FCCBGA | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 400MHz | Supplier Device Package | 360-CBGA (25×25) | ||
| Voltage – I/O | 2.5V, 3.3V |
Overview of MPC755CRX400LE – IC MPU MPC7XX 400MHz 360-CBGA
The MPC755CRX400LE is a single-core PowerPC RISC microprocessor running at 400 MHz in a 360-CBGA (25×25) package. It targets low-cost, low-power embedded systems and integrates key processor and system interfaces to support compact, surface-mount designs.
Designed with consumer qualification and RoHS compliance, the MPC755CRX400LE combines a 32-bit PowerPC core with on-chip cache and L2 support, power-management features and system debug facilities to simplify embedded system integration.
Key Features
- Core PowerPC 32-bit single core running at 400 MHz, optimized for RISC execution and embedded workloads.
- Cache and Memory Integrated processor with 32-Kbyte instruction cache and 32-Kbyte data cache plus an internal L2 tag and a dedicated L2 cache interface (MPC755 family), providing streamlined on-chip caching and L2 support.
- System Bus 60x bus interface for external system connectivity and memory access (per MPC755 family hardware specifications).
- Power and Thermal Management On-chip power-management modes including doze, nap, sleep and dynamic power management; documented thermal and power management features help manage system-level energy use.
- Debug and System Facilities JTAG/COP interface, time base counter/decrementer, clock multiplier and performance monitor support system bring-up, debugging and performance analysis.
- Package and Mounting 360-CBGA (25×25) package, surface-mount mounting type; package case identified as 360-BCBGA/FCCBGA in documentation.
- Operating Range Consumer qualification with an operating temperature range of 0°C to 105°C.
- Environmental Compliance RoHS compliant to support regulatory and assembly requirements.
Typical Applications
- Low-cost embedded controllers Suited to compact consumer and embedded applications that require a 32-bit PowerPC core with on-chip cache and L2 support.
- Energy-conscious designs Systems that benefit from multiple power-management states (doze, nap, sleep, dynamic management) to reduce run-time power consumption.
- Compact, surface-mount systems Designs requiring a high-density BGA package (360-CBGA, 25×25) for board-level space efficiency and robust mounting.
Unique Advantages
- PowerPC RISC architecture: A 32-bit PowerPC core delivering deterministic RISC execution for embedded software and legacy PowerPC codebases.
- Integrated cache and L2 interface: On-chip 32-Kbyte I and D caches plus L2 tags with a dedicated L2 interface reduce external memory bandwidth pressure and simplify cache hierarchy design.
- System-focused peripherals: Built-in debug (JTAG/COP), time base/decrementer and performance monitoring facilities accelerate bring-up and system validation.
- Flexible power management: Multiple power states (doze/nap/sleep and dynamic power management) support designs that need to balance performance and energy efficiency.
- Compact package: 360-CBGA (25×25) surface-mount package enables high-density board layouts while maintaining secure soldered attachment.
- Regulatory readiness: RoHS compliance helps address environmental and assembly process requirements for consumer-grade products.
Why Choose MPC755CRX400LE?
The MPC755CRX400LE delivers a focused combination of a 32-bit PowerPC core, integrated cache/L2 support and system-level features aimed at low-cost, low-power embedded designs. Its on-chip power-management capabilities and debug interfaces make it a practical choice for engineers building compact consumer and embedded systems that require disciplined power and performance behavior.
With a 360-CBGA surface-mount package, consumer qualification and RoHS compliance, the MPC755CRX400LE is positioned for designs that prioritize integration, thermal management and regulatory readiness while leveraging the PowerPC instruction set architecture.
Request a quote or submit an inquiry to receive pricing and availability for the MPC755CRX400LE and to discuss volume needs or delivery timelines.

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