MPC755BVT350LE
| Part Description |
PowerPC Microprocessor IC MPC7xx 1 Core, 32-Bit 350MHz 360-FCPBGA (25x25) |
|---|---|
| Quantity | 680 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC755 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Core Processor | PowerPC | Device Package | 360-FCPBGA (25x25) | Mounting Type | Surface Mount | ||
|---|---|---|---|---|---|---|---|
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C – 105°C | Package / Case | Tray | ||
| Speed | 350MHz | Voltage | 2.5V, 3.3V |
Overview of MPC755BVT350LE – PowerPC 32‑Bit 350 MHz, 360‑FCPBGA
The MPC755BVT350LE is a single‑core PowerPC RISC microprocessor implementing a 32‑bit core running at 350 MHz, designed for embedded, consumer‑oriented applications. It is part of the MPC755 series from NXP Semiconductors and targets low‑cost, low‑power systems with integrated system features and on‑chip support for an external L2 cache interface.
Built with system integration and power control in mind, the device combines an internal L2 tag, a dedicated L2 cache interface with a 60x bus, and multiple power management modes to support energy‑aware embedded designs.
Key Features
- Core Architecture PowerPC RISC single‑core, 32‑bit processor operating at 350 MHz for deterministic embedded processing.
- L2 Cache and System Interface Internal L2 tag combined with a dedicated L2 cache interface and a 60x bus to support external L2 cache configurations.
- Power Management Hardware support for doze, nap, sleep and dynamic power management modes to help reduce system energy use in low‑power designs.
- System Timing & Monitoring On‑chip time base counter and decrementer plus performance monitoring capabilities to support real‑time control and performance analysis.
- Debug & Test JTAG/COP interface for system debug and boundary‑scan testability.
- Clocking Integrated clock multiplier to support system clocking configurations.
- Package & Mounting Available in a 360‑FCPBGA (25×25) surface‑mount package supplied in tray‑packaging.
- Operating Range & Qualification Consumer‑qualified device with an operating temperature range of 0 °C to 105 °C.
Typical Applications
- Embedded control systems Single‑core 32‑bit processing and on‑chip timing support make the MPC755BVT350LE suitable for general embedded control and real‑time tasks.
- Low‑power consumer devices Targeted for low‑cost, low‑power designs where power management modes and a compact BGA package are beneficial.
- Compact compute modules Use in small form‑factor modules that require a 350 MHz PowerPC core and an external L2 cache interface for expanded memory performance.
Unique Advantages
- Single‑chip PowerPC compute at 350 MHz: Delivers embedded processing capability in a single 32‑bit core for streamlined control tasks.
- Integrated L2 support: Internal L2 tag plus a dedicated L2 cache interface and 60x bus simplify designs that require external L2 cache.
- Comprehensive power modes: Doze, nap, sleep and dynamic power management provide flexible options to lower system power consumption.
- On‑chip system features: Time base, decrementer, performance monitors and JTAG/COP support accelerate development, debugging and system integration.
- Compact BGA package: 360‑FCPBGA (25×25) surface‑mount package supports dense board layouts and standard assembly processes.
- Consumer qualification and thermal range: Designed for consumer applications with an operating range of 0 °C to 105 °C.
Why Choose MPC755BVT350LE?
The MPC755BVT350LE positions itself as a practical PowerPC‑based solution for embedded and consumer systems that require a 350 MHz, single‑core 32‑bit processor with integrated system features. Its dedicated L2 cache interface, 60x bus, and power management modes make it suitable for designs where integration, predictable performance, and energy control are priorities.
As part of the MPC7xx family from NXP Semiconductors, the MPC755BVT350LE is offered in a compact 360‑FCPBGA package and is consumer qualified, providing a balance of integration and thermal performance for a range of embedded modules and low‑power applications.
Request a quote or submit a product availability inquiry to get pricing, lead time, and ordering information for the MPC755BVT350LE.

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