MPC755BRX350LE

The MPC755BRX350LE is a single-core PowerPC microprocessor running at 350 MHz, offered in a 360-ball CBGA (25×25) surface-mount package. It is part of the MPC755 family from NXP Semiconductors and is targeted at low-cost, low-power embedded and consumer systems that require a 32-bit PowerPC core and on-chip system features.

Designed with on-chip power and thermal management features and an integrated L2 tag plus a dedicated L2 cache interface, this device delivers a compact, integrated solution for embedded designs where board-level integration and power control are priorities.

Key Features

• Core & Architecture Single 32-bit PowerPC core operating at 350 MHz, implementing the PowerPC instruction set architecture.
• Memory & Cache Integrated L2 tag with a dedicated L2 cache interface and a 60x bus interface; on-chip 32 Kbyte instruction cache and 32 Kbyte data cache are documented in the family hardware specifications.
• Power & Thermal Management Built-in power management features including doze, nap, sleep and dynamic power management, plus thermal/power management support described in the hardware documentation.
• System & Debug Interfaces JTAG/COP interface and system-level peripherals such as time base counter and decrementer facilitate debug and system control.
• Package & Mounting 360-ball CBGA package (25×25) suitable for surface-mount assembly; package references include 360-BCBGA/FCCBGA notation in the supplier data.
• Operating Range & Qualification Consumer-grade qualification with an operating temperature range specified from 0 °C to 105 °C and RoHS compliance.
• Graphics & I/O No onboard graphics acceleration; device focuses on CPU and system integration features for embedded workloads.

Typical Applications

• Low-cost embedded systems — Suited to compact designs that prioritize integration and power management for consumer-oriented embedded products.
• Consumer electronics — Useful in consumer devices that require a 32-bit PowerPC core with on-chip cache interface and power control features.
• Embedded control and interface appliances — Appropriate for control, interface and system-management roles within consumer embedded platforms where a surface-mount CBGA package is required.

Unique Advantages

• Integrated L2 tag and interface — On-chip L2 tag and a dedicated L2 cache interface reduce external BOM complexity and simplify system cache integration.
• Power-management modes — Multiple power states (doze, nap, sleep and dynamic power management) enable designers to optimize system power use in consumer embedded applications.
• Documented PowerPC architecture — Implements the PowerPC instruction set as described in the MPC7xx family documentation, aiding software portability within the family.
• Compact CBGA package — 360-ball (25×25) CBGA surface-mount package delivers high pin density in a compact footprint for space-constrained boards.
• Wide consumer operating range — Rated for 0 °C to 105 °C operation to cover a variety of consumer embedded environments.
• RoHS compliant — Complies with RoHS environmental requirements for lead-free assembly processes.

Why Choose MPC755BRX350LE?

The MPC755BRX350LE pairs a 350 MHz PowerPC core with on-chip L2 support and comprehensive power-management features, positioning it for designers building compact, low-power consumer embedded systems that need the PowerPC architecture. Its surface-mount 360-CBGA package and documented system interfaces make it suitable for designs that require on-board integration and standard debug capabilities.

As a member of the MPC755 family from NXP Semiconductors, this device is supported by detailed hardware specifications covering cache architecture, bus interfaces and power/thermal management, enabling designers to evaluate system integration and thermal planning with confidence.

Request a quote or submit an inquiry to obtain pricing, lead-time and availability for the MPC755BRX350LE and to discuss how it fits your embedded design requirements.