Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MPC755BRX300LEMPC755BRX300LENXP SemiconductorsIC MPU MPC7XX 300MHZ 360CBGAMicroprocessors360-CBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Graphics Acceleration:
No
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-CBGA (25×25)
379
MPC755BRX350LEMPC755BRX350LENXP SemiconductorsIC MPU MPC7XX 350MHZ 360CBGAMicroprocessors360-CBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
350MHz
Graphics Acceleration:
No
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-CBGA (25×25)
840
MPC755BRX350TEMPC755BRX350TENXP SemiconductorsIC MPU MPC7XX 350MHZ 360CBGAMicroprocessors360-CBGA (25x25)2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
350MHz
Mounting Type:
Surface Mount
1,078
MPC755BVT300LEMPC755BVT300LENXP SemiconductorsIC MPU MPC7XX 300MHZ 360FCPBGAMicroprocessors360-FCPBGA (25x25)2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Mounting Type:
Surface Mount
245
MPC755BVT350LEMPC755BVT350LENXP SemiconductorsIC MPU MPC7XX 350MHZ 360FCPBGAMicroprocessors360-FCPBGA (25x25)2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
350MHz
Mounting Type:
Surface Mount
318
MPC755CPX400LER2MPC755CPX400LER2NXP SemiconductorsIC MPU MPC7XX 400MHZ 360FCPBGAMicroprocessors360-FCPBGA (25x25)2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
1,131
MPC755CRX400LEMPC755CRX400LENXP SemiconductorsIC MPU MPC7XX 400MHZ 360CBGAMicroprocessors360-CBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Graphics Acceleration:
No
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-CBGA (25×25)
537
MPC755CVT400LEMPC755CVT400LENXP SemiconductorsIC MPU MPC7XX 400MHZ 360FCPBGAMicroprocessors360-FCPBGA (25x25)2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
82
MPC823CVR66B2TMPC823CVR66B2TNXP SemiconductorsIC MPU MPC8XX 66MHZ 256BGAMicroprocessors256-PBGA (23x23)3.3V-40°C – 95°C
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Mounting Type:
Surface Mount
994
MPC823CZQ66B2TMPC823CZQ66B2TNXP SemiconductorsIC MPU MPC8XX 66MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A-40°C ~ 95°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
1,551
MPC823VR75B2TMPC823VR75B2TNXP SemiconductorsIC MPU MPC8XX 75MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
75MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
642
MPC823VR81B2TMPC823VR81B2TNXP SemiconductorsIC MPU MPC8XX 81MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
81MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
1,428
MPC823ZQ66B2TMPC823ZQ66B2TNXP SemiconductorsIC MPU MPC8XX 66MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
789
MPC823ZQ81B2TMPC823ZQ81B2TNXP SemiconductorsIC MPU MPC8XX 81MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
81MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
874
MPC8241LVR166DMPC8241LVR166DNXP SemiconductorsIC MPU MPC82XX 166MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
166MHz
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
151
MPC8241LVR200DMPC8241LVR200DNXP SemiconductorsIC MPU MPC82XX 200MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
943
MPC8241LVR266DMPC8241LVR266DNXP SemiconductorsIC MPU MPC82XX 266MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
718
MPC8241LZQ200DMPC8241LZQ200DNXP SemiconductorsIC MPU MPC82XX 200MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
16
MPC8241LZQ266DMPC8241LZQ266DNXP SemiconductorsIC MPU MPC82XX 266MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
662
MPC8245ARVV400DMPC8245ARVV400DNXP SemiconductorsIC MPU MPC82XX 400MHZ 352TBGAMicroprocessors352-TBGA (35x35)N/A0°C ~ 85°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
352-LBGA
Supplier Device Package:
352-TBGA (35×35)
932

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