 | | MPC755BRX300LE | NXP Semiconductors | IC MPU MPC7XX 300MHZ 360CBGA | Microprocessors | 360-CBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Voltage – I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-CBGA (25×25) | 379 | |
 | | MPC755BRX350LE | NXP Semiconductors | IC MPU MPC7XX 350MHZ 360CBGA | Microprocessors | 360-CBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Voltage – I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-CBGA (25×25) | 840 | |
 | | MPC755BRX350TE | NXP Semiconductors | IC MPU MPC7XX 350MHZ 360CBGA | Microprocessors | 360-CBGA (25x25) | 2.5V, 3.3V | 0°C – 105°C | Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 1,078 | |
 | | MPC755BVT300LE | NXP Semiconductors | IC MPU MPC7XX 300MHZ 360FCPBGA | Microprocessors | 360-FCPBGA (25x25) | 2.5V, 3.3V | 0°C – 105°C | Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 245 | |
 | | MPC755BVT350LE | NXP Semiconductors | IC MPU MPC7XX 350MHZ 360FCPBGA | Microprocessors | 360-FCPBGA (25x25) | 2.5V, 3.3V | 0°C – 105°C | Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 318 | |
 | | MPC755CPX400LER2 | NXP Semiconductors | IC MPU MPC7XX 400MHZ 360FCPBGA | Microprocessors | 360-FCPBGA (25x25) | 2.5V, 3.3V | 0°C – 105°C | Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 1,131 | |
 | | MPC755CRX400LE | NXP Semiconductors | IC MPU MPC7XX 400MHZ 360CBGA | Microprocessors | 360-CBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Voltage – I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-CBGA (25×25) | 537 | |
 | | MPC755CVT400LE | NXP Semiconductors | IC MPU MPC7XX 400MHZ 360FCPBGA | Microprocessors | 360-FCPBGA (25x25) | 2.5V, 3.3V | 0°C – 105°C | Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 82 | |
 | | MPC823CVR66B2T | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | 3.3V | -40°C – 95°C | Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 994 | |
 | | MPC823CZQ66B2T | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM Display & Interface Controllers: LCD, Video Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 1,551 | |
 | | MPC823VR75B2T | NXP Semiconductors | IC MPU MPC8XX 75MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM Display & Interface Controllers: LCD, Video Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 642 | |
 | | MPC823VR81B2T | NXP Semiconductors | IC MPU MPC8XX 81MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM Display & Interface Controllers: LCD, Video Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 1,428 | |
 | | MPC823ZQ66B2T | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM Display & Interface Controllers: LCD, Video Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 789 | |
 | | MPC823ZQ81B2T | NXP Semiconductors | IC MPU MPC8XX 81MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM Display & Interface Controllers: LCD, Video Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 874 | |
 | | MPC8241LVR166D | NXP Semiconductors | IC MPU MPC82XX 166MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 151 | |
 | | MPC8241LVR200D | NXP Semiconductors | IC MPU MPC82XX 200MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 943 | |
 | | MPC8241LVR266D | NXP Semiconductors | IC MPU MPC82XX 266MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 718 | |
 | | MPC8241LZQ200D | NXP Semiconductors | IC MPU MPC82XX 200MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 16 | |
 | | MPC8241LZQ266D | NXP Semiconductors | IC MPU MPC82XX 266MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 662 | |
 | | MPC8245ARVV400D | NXP Semiconductors | IC MPU MPC82XX 400MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | 0°C ~ 85°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 352-TBGA (35×35) | 932 | |