 | | MPC8245ARZU400D | NXP Semiconductors | IC MPU MPC82XX 400MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | 0°C ~ 85°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 352-TBGA (35×35) | 953 | |
 | | MPC8245LVV266D | NXP Semiconductors | IC MPU MPC82XX 266MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 352-TBGA (35×35) | 1,056 | |
 | | MPC8245LVV300D | NXP Semiconductors | IC MPU MPC82XX 300MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 352-TBGA (35×35) | 930 | |
| N/A | | MPC8245LVV333D | NXP Semiconductors | IC MPU MPC82XX 333MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 352-LBGA Exposed Pad Supplier Device Package: 352-TBGA (35×35) | 440 | |
 | | MPC8245LVV350D | NXP Semiconductors | IC MPU MPC82XX 350MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 352-TBGA (35×35) | 1,022 | |
 | | MPC8245LZU266D | NXP Semiconductors | IC MPU MPC82XX 266MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 352-TBGA (35×35) | 1,202 | |
 | | MPC8245LZU300D | NXP Semiconductors | IC MPU MPC82XX 300MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 352-TBGA (35×35) | 465 | |
 | | MPC8245LZU333D | NXP Semiconductors | RISC MICROCONTROLLER, 32-BIT, PO | Microprocessors | 352-TBGA (35x35) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC 603e Mounting Type: Surface Mount Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 105°C (TA) Supplier Device Package: 352-TBGA (35×35) | 1,218 | |
 | | MPC8245LZU350D | NXP Semiconductors | IC MPU MPC82XX 350MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 352-TBGA (35×35) | 824 | |
 | | MPC8245TVV266D | NXP Semiconductors | IC MPU MPC82XX 266MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 352-TBGA (35×35) | 217 | |
 | | MPC8245TVV300D | NXP Semiconductors | IC MPU MPC82XX 300MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 352-TBGA (35×35) | 1,910 | |
 | | MPC8245TVV300D-NXP | NXP Semiconductors | RISC MICROPROCESSOR, 32 BIT, PO | Microprocessors | 352-TBGA (35x35) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC™ MPC603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 352-TBGA (35×35) | 523 | |
 | | MPC8245TVV333D | NXP Semiconductors | IC MPU MPC82XX 333MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 352-TBGA (35×35) | 844 | |
 | | MPC8245TVV350D | NXP Semiconductors | IC MPU MPC82XX 350MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 352-TBGA (35×35) | 81 | |
| N/A | | MPC8245TZU266D | NXP Semiconductors | IC MPU MPC82XX 266MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 352-LBGA Exposed Pad Supplier Device Package: 352-TBGA (35×35) | 690 | |
| N/A | | MPC8245TZU300D | NXP Semiconductors | IC MPU MPC82XX 300MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 352-LBGA Exposed Pad Supplier Device Package: 352-TBGA (35×35) | 71 | |
 | | MPC8245TZU333D | NXP Semiconductors | IC MPU MPC82XX 333MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 352-TBGA (35×35) | 239 | |
 | | MPC8245TZU350D | NXP Semiconductors | 32 BIT POWER ARCHITECTURE, 350MH | Microprocessors | 352-TBGA (35x35) | N/A | -40 °C – 105 °C | Number of Cores/Bus Width: 1 Core, 32-Bit | 1,219 | |
 | | MPC8247CVRMIBA | NXP Semiconductors | IC MPU MPC82XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 1,757 | |
 | | MPC8247CVRTIEA | NXP Semiconductors | IC MPU MPC82XX 400MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 495 | |