Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MPC8245ARZU400DMPC8245ARZU400DNXP SemiconductorsIC MPU MPC82XX 400MHZ 352TBGAMicroprocessors352-TBGA (35x35)N/A0°C ~ 85°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
352-LBGA
Supplier Device Package:
352-TBGA (35×35)
953
MPC8245LVV266DMPC8245LVV266DNXP SemiconductorsIC MPU MPC82XX 266MHZ 352TBGAMicroprocessors352-TBGA (35x35)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
352-LBGA
Supplier Device Package:
352-TBGA (35×35)
1,056
MPC8245LVV300DMPC8245LVV300DNXP SemiconductorsIC MPU MPC82XX 300MHZ 352TBGAMicroprocessors352-TBGA (35x35)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
352-LBGA
Supplier Device Package:
352-TBGA (35×35)
930
N/AMPC8245LVV333DNXP SemiconductorsIC MPU MPC82XX 333MHZ 352TBGAMicroprocessors352-TBGA (35x35)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
352-LBGA Exposed Pad
Supplier Device Package:
352-TBGA (35×35)
440
MPC8245LVV350DMPC8245LVV350DNXP SemiconductorsIC MPU MPC82XX 350MHZ 352TBGAMicroprocessors352-TBGA (35x35)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
350MHz
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
352-LBGA
Supplier Device Package:
352-TBGA (35×35)
1,022
MPC8245LZU266DMPC8245LZU266DNXP SemiconductorsIC MPU MPC82XX 266MHZ 352TBGAMicroprocessors352-TBGA (35x35)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
352-LBGA
Supplier Device Package:
352-TBGA (35×35)
1,202
MPC8245LZU300DMPC8245LZU300DNXP SemiconductorsIC MPU MPC82XX 300MHZ 352TBGAMicroprocessors352-TBGA (35x35)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
352-LBGA
Supplier Device Package:
352-TBGA (35×35)
465
MPC8245LZU333DMPC8245LZU333DNXP SemiconductorsRISC MICROCONTROLLER, 32-BIT, POMicroprocessors352-TBGA (35x35)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Graphics Acceleration:
No
Mounting Type:
Surface Mount
Number of Cores/Bus Width:
1 Core, 32-Bit
Operating Temperature:
0°C ~ 105°C (TA)
Package / Case:
352-LBGA
RAM Controllers:
SDRAM
Speed:
333MHz
Supplier Device Package:
352-TBGA (35×35)
Voltage – I/O:
3.3V
1,218
MPC8245LZU350DMPC8245LZU350DNXP SemiconductorsIC MPU MPC82XX 350MHZ 352TBGAMicroprocessors352-TBGA (35x35)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
350MHz
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
352-LBGA
Supplier Device Package:
352-TBGA (35×35)
824
MPC8245TVV266DMPC8245TVV266DNXP SemiconductorsIC MPU MPC82XX 266MHZ 352TBGAMicroprocessors352-TBGA (35x35)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
352-LBGA
Supplier Device Package:
352-TBGA (35×35)
217
MPC8245TVV300DMPC8245TVV300DNXP SemiconductorsIC MPU MPC82XX 300MHZ 352TBGAMicroprocessors352-TBGA (35x35)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
352-LBGA
Supplier Device Package:
352-TBGA (35×35)
1,910
MPC8245TVV300D-NXPMPC8245TVV300D-NXPNXP SemiconductorsRISC MICROPROCESSOR, 32 BIT, POMicroprocessors352-TBGA (35x35)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPCâ„¢ MPC603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
352-LBGA
Supplier Device Package:
352-TBGA (35×35)
523
MPC8245TVV333DMPC8245TVV333DNXP SemiconductorsIC MPU MPC82XX 333MHZ 352TBGAMicroprocessors352-TBGA (35x35)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
352-LBGA
Supplier Device Package:
352-TBGA (35×35)
844
MPC8245TVV350DMPC8245TVV350DNXP SemiconductorsIC MPU MPC82XX 350MHZ 352TBGAMicroprocessors352-TBGA (35x35)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
350MHz
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
352-LBGA
Supplier Device Package:
352-TBGA (35×35)
81
N/AMPC8245TZU266DNXP SemiconductorsIC MPU MPC82XX 266MHZ 352TBGAMicroprocessors352-TBGA (35x35)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
352-LBGA Exposed Pad
Supplier Device Package:
352-TBGA (35×35)
690
N/AMPC8245TZU300DNXP SemiconductorsIC MPU MPC82XX 300MHZ 352TBGAMicroprocessors352-TBGA (35x35)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
352-LBGA Exposed Pad
Supplier Device Package:
352-TBGA (35×35)
71
MPC8245TZU333DMPC8245TZU333DNXP SemiconductorsIC MPU MPC82XX 333MHZ 352TBGAMicroprocessors352-TBGA (35x35)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
352-LBGA
Supplier Device Package:
352-TBGA (35×35)
239
MPC8245TZU350DMPC8245TZU350DNXP Semiconductors32 BIT POWER ARCHITECTURE, 350MHMicroprocessors352-TBGA (35x35)N/A-40 °C – 105 °C
Speed:
350 MHz
Voltage – I/O:
3.3 V
Core Processor:
603e
Number of Cores/Bus Width:
1 Core, 32-Bit
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Qualification:
Industrial
1,219
MPC8247CVRMIBAMPC8247CVRMIBANXP SemiconductorsIC MPU MPC82XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
1,757
MPC8247CVRTIEAMPC8247CVRTIEANXP SemiconductorsIC MPU MPC82XX 400MHZ PBGA516Microprocessors516-PBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
495

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