Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Total Products: 134,052

Part Number	Manufacturer	Description	Category	Device Package	Voltage	Operating Temp	Additional Specifications	Qty	Get A Quote
MPC8248ZQPIEA	NXP Semiconductors	IC MPU MPC82XX 300MHZ PBGA516	Microprocessors	516-PBGA (27x27)	N/A	0°C ~ 105°C (TA)	Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27)	214	GET A QUOTE
MPC8248ZQTIEA	NXP Semiconductors	IC MPU MPC82XX 400MHZ PBGA516	Microprocessors	516-PBGA (27x27)	N/A	0°C ~ 105°C (TA)	Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27)	1,087	GET A QUOTE
MPC8250ACVRIHBC	NXP Semiconductors	IC MPU MPC82XX 200MHZ PBGA516	Microprocessors	516-PBGA (27x27)	N/A	-40°C ~ 105°C (TA)	Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27)	418	GET A QUOTE
MPC8250ACVVMHBC	NXP Semiconductors	IC MPU MPC82XX 266MHZ 480TBGA	Microprocessors	480-TBGA (37.5x37.5)	N/A	-40°C ~ 105°C (TA)	Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5)	935	GET A QUOTE
MPC8250ACZQIHBC	NXP Semiconductors	IC MPU MPC82XX 200MHZ PBGA516	Microprocessors	516-PBGA (27x27)	N/A	-40°C ~ 105°C (TA)	Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27)	1,296	GET A QUOTE
MPC8250ACZUMHBC	NXP Semiconductors	IC MPU MPC82XX 266MHZ 480TBGA	Microprocessors	480-TBGA (37.5x37.5)	N/A	-40°C ~ 105°C (TA)	Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5)	925	GET A QUOTE
MPC8250AVRIHBC	NXP Semiconductors	IC MPU MPC82XX 200MHZ PBGA516	Microprocessors	516-PBGA (27x27)	N/A	0°C ~ 105°C (TA)	Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27)	396	GET A QUOTE
MPC8250AVVMHBC	NXP Semiconductors	IC MPU MPC82XX 266MHZ 480TBGA	Microprocessors	480-TBGA (37.5x37.5)	N/A	0°C ~ 105°C (TA)	Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5)	568	GET A QUOTE
MPC8250AVVPIBC	NXP Semiconductors	IC MPU MPC82XX 300MHZ 480TBGA	Microprocessors	480-TBGA (37.5x37.5)	N/A	0°C ~ 105°C (TA)	Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5)	326	GET A QUOTE
MPC8250AZQIHBC	NXP Semiconductors	IC MPU MPC82XX 200MHZ PBGA516	Microprocessors	516-PBGA (27x27)	N/A	0°C ~ 105°C (TA)	Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27)	692	GET A QUOTE
MPC8250AZUMHBC	NXP Semiconductors	IC MPU MPC82XX 266MHZ 480TBGA	Microprocessors	480-TBGA (37.5x37.5)	N/A	0°C ~ 105°C (TA)	Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5)	932	GET A QUOTE
MPC8250AZUPIBC	NXP Semiconductors	IC MPU MPC82XX 300MHZ 480TBGA	Microprocessors	480-TBGA (37.5x37.5)	N/A	0°C ~ 105°C (TA)	Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5)	248	GET A QUOTE
MPC8255ACVVMHBB	NXP Semiconductors	IC MPU MPC82XX 266MHZ 480TBGA	Microprocessors	480-TBGA (37.5x37.5)	N/A	-40°C ~ 105°C (TA)	Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5)	383	GET A QUOTE
MPC8255ACZUMHBB	NXP Semiconductors	IC MPU MPC82XX 266MHZ 480TBGA	Microprocessors	480-TBGA (37.5x37.5)	N/A	-40°C ~ 105°C (TA)	Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5)	246	GET A QUOTE
MPC8255ACZUMIBB	NXP Semiconductors	IC MPU MPC82XX 266MHZ 480TBGA	Microprocessors	480-TBGA (37.5x37.5)	N/A	-40°C ~ 105°C (TA)	Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5)	641	GET A QUOTE
MPC8255AZUMHBB	NXP Semiconductors	IC MPU MPC82XX 266MHZ 480TBGA	Microprocessors	480-TBGA (37.5x37.5)	N/A	0°C ~ 105°C (TA)	Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5)	391	GET A QUOTE
MPC8260ACVVMHBB	NXP Semiconductors	IC MPU MPC82XX 266MHZ 480TBGA	Microprocessors	480-TBGA (37.5x37.5)	N/A	-40°C ~ 105°C (TA)	Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5)	927	GET A QUOTE
MPC8260ACVVMIBB	NXP Semiconductors	IC MPU MPC82XX 266MHZ 480TBGA	Microprocessors	480-TBGA (37.5x37.5)	N/A	-40°C ~ 105°C (TA)	Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5)	517	GET A QUOTE
MPC8260ACZUMHBB	NXP Semiconductors	IC MPU MPC82XX 266MHZ 480TBGA	Microprocessors	480-TBGA (37.5x37.5)	N/A	-40°C ~ 105°C (TA)	Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5)	249	GET A QUOTE
MPC8260ACZUMIBB	NXP Semiconductors	IC MPU MPC82XX 266MHZ 480TBGA	Microprocessors	480-TBGA (37.5x37.5)	N/A	-40°C ~ 105°C (TA)	Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5)	779	GET A QUOTE