MPC8250AVVMHBC
| Part Description |
PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 266MHz 480-TBGA (37.5x37.5) |
|---|---|
| Quantity | 16 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8250 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC G2 | Device Package | 480-TBGA (37.5x37.5) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10/100Mbps (3) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 105°C (TA) | ||
| Package / Case | 480-LBGA Exposed Pad | RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 266MHz | Supplier Device Package | 480-TBGA (37.5×37.5) | ||
| Voltage – I/O | 3.3V |
Overview of MPC8250AVVMHBC – IC MPU MPC82XX 266MHz 480-TBGA
The MPC8250AVVMHBC is a single-core PowerPC G2 microprocessor in the MPC8250 series, operating at 266 MHz and supplied in a 480-TBGA package (37.5×37.5 mm). It targets embedded applications that require a compact, integrated communications-capable processor with on-chip memory controllers and multiple serial/network interfaces.
Built with a dedicated Communications Processor Module (CPM) and support for DRAM/SDRAM, 10/100 Mbps Ethernet ports, and standard serial interfaces, the device delivers a balanced combination of processing, I/O integration, and system-level connectivity for consumer and embedded designs.
Key Features
- Core — PowerPC G2 architecture, single 32-bit core running at 266 MHz, suitable for embedded control and communications processing.
- Processing & Acceleration — Includes a floating-point unit (FPU) and a Communications Processor Module (CPM) with RISC co-processor capabilities for communications tasks.
- Memory Subsystem — Integrated DRAM and SDRAM controllers; datasheet references separate 16 KB instruction and 16 KB data caches and an MMU for memory management.
- Ethernet & Networking — Supports three 10/100 Mbps Ethernet ports for multi-port networked systems and communications applications.
- Interfaces — Multiple serial interfaces including I2C plus on-chip peripherals described in the series documentation (MII/SPI/serial channels and PCI/local bus interfaces referenced in product datasheet).
- Power Domains — Separate supplies for internal core logic and I/O: internal core logic supply referenced at 1.8 V in the series datasheet and I/O at 3.3 V.
- Package & Mounting — 480-TBGA (37.5×37.5 mm) exposed-pad LBGA package, surface-mount mounting suitable for compact system designs.
- Operating Range & Compliance — Operating temperature range 0 °C to 105 °C; RoHS compliant; Consumer qualification.
Typical Applications
- Embedded Networking and Communications — Multi-port 10/100 Mbps Ethernet and the CPM support networked embedded systems and communication endpoints.
- Industrial and Consumer Embedded Systems — Single-core PowerPC performance with integrated memory controllers and serial interfaces for embedded control, gateway, and appliance designs.
- Systems Requiring On-Chip Peripherals — Designs that leverage integrated DRAM/SDRAM support, serial buses (I2C and other serial interfaces), and on-chip CPM offload.
Unique Advantages
- Integrated Communications Subsystem: On-chip Communications Processor Module and multiple Ethernet ports reduce external component count for networking applications.
- Balanced Processing and I/O: A 266 MHz PowerPC G2 core with FPU plus extensive peripheral interfaces supports both control and data-path workloads.
- Flexible Memory Support: Built-in DRAM/SDRAM controllers and cache/MMU features simplify memory subsystem design and improve system performance predictability.
- Dual Power Domains: Separate internal core and I/O supplies enable optimized power sequencing and system-level power planning.
- Compact, Surface-Mount Package: 480-TBGA (37.5×37.5 mm) exposed-pad package allows high-density board layout in space-constrained designs.
- Regulatory and Environmental Compliance: RoHS-compliant construction supports lead-free manufacturing and environmental requirements.
Why Choose MPC8250AVVMHBC?
The MPC8250AVVMHBC combines a PowerPC G2 single-core processor at 266 MHz with an integrated Communications Processor Module, memory controllers, and multiport Ethernet capability to deliver a compact, integrated solution for embedded networking and control applications. Its combination of on-chip peripherals and separate power domains supports designs that need both processing performance and flexible I/O integration.
This part is well suited to engineers and procurement teams building consumer and embedded systems that require a balance of compute, communications, and memory interfaces in a surface-mount TBGA package with an operating range up to 105 °C and RoHS compliance.
Request a quote or submit an inquiry to obtain pricing and availability for the MPC8250AVVMHBC and discuss how it fits your next embedded design project.

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