MPC8250AVVMHBC

IC MPU MPC82XX 266MHZ 480TBGA
Part Description

PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 266MHz 480-TBGA (37.5x37.5)

Quantity 16 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8250
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2Device Package480-TBGA (37.5x37.5)
ECCN5A991B4BEthernet10/100Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case480-LBGA Exposed PadRAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed266MHzSupplier Device Package480-TBGA (37.5×37.5)
Voltage – I/O3.3V

Overview of MPC8250AVVMHBC – IC MPU MPC82XX 266MHz 480-TBGA

The MPC8250AVVMHBC is a single-core PowerPC G2 microprocessor in the MPC8250 series, operating at 266 MHz and supplied in a 480-TBGA package (37.5×37.5 mm). It targets embedded applications that require a compact, integrated communications-capable processor with on-chip memory controllers and multiple serial/network interfaces.

Built with a dedicated Communications Processor Module (CPM) and support for DRAM/SDRAM, 10/100 Mbps Ethernet ports, and standard serial interfaces, the device delivers a balanced combination of processing, I/O integration, and system-level connectivity for consumer and embedded designs.

Key Features

  • Core — PowerPC G2 architecture, single 32-bit core running at 266 MHz, suitable for embedded control and communications processing.
  • Processing & Acceleration — Includes a floating-point unit (FPU) and a Communications Processor Module (CPM) with RISC co-processor capabilities for communications tasks.
  • Memory Subsystem — Integrated DRAM and SDRAM controllers; datasheet references separate 16 KB instruction and 16 KB data caches and an MMU for memory management.
  • Ethernet & Networking — Supports three 10/100 Mbps Ethernet ports for multi-port networked systems and communications applications.
  • Interfaces — Multiple serial interfaces including I2C plus on-chip peripherals described in the series documentation (MII/SPI/serial channels and PCI/local bus interfaces referenced in product datasheet).
  • Power Domains — Separate supplies for internal core logic and I/O: internal core logic supply referenced at 1.8 V in the series datasheet and I/O at 3.3 V.
  • Package & Mounting — 480-TBGA (37.5×37.5 mm) exposed-pad LBGA package, surface-mount mounting suitable for compact system designs.
  • Operating Range & Compliance — Operating temperature range 0 °C to 105 °C; RoHS compliant; Consumer qualification.

Typical Applications

  • Embedded Networking and Communications — Multi-port 10/100 Mbps Ethernet and the CPM support networked embedded systems and communication endpoints.
  • Industrial and Consumer Embedded Systems — Single-core PowerPC performance with integrated memory controllers and serial interfaces for embedded control, gateway, and appliance designs.
  • Systems Requiring On-Chip Peripherals — Designs that leverage integrated DRAM/SDRAM support, serial buses (I2C and other serial interfaces), and on-chip CPM offload.

Unique Advantages

  • Integrated Communications Subsystem: On-chip Communications Processor Module and multiple Ethernet ports reduce external component count for networking applications.
  • Balanced Processing and I/O: A 266 MHz PowerPC G2 core with FPU plus extensive peripheral interfaces supports both control and data-path workloads.
  • Flexible Memory Support: Built-in DRAM/SDRAM controllers and cache/MMU features simplify memory subsystem design and improve system performance predictability.
  • Dual Power Domains: Separate internal core and I/O supplies enable optimized power sequencing and system-level power planning.
  • Compact, Surface-Mount Package: 480-TBGA (37.5×37.5 mm) exposed-pad package allows high-density board layout in space-constrained designs.
  • Regulatory and Environmental Compliance: RoHS-compliant construction supports lead-free manufacturing and environmental requirements.

Why Choose MPC8250AVVMHBC?

The MPC8250AVVMHBC combines a PowerPC G2 single-core processor at 266 MHz with an integrated Communications Processor Module, memory controllers, and multiport Ethernet capability to deliver a compact, integrated solution for embedded networking and control applications. Its combination of on-chip peripherals and separate power domains supports designs that need both processing performance and flexible I/O integration.

This part is well suited to engineers and procurement teams building consumer and embedded systems that require a balance of compute, communications, and memory interfaces in a surface-mount TBGA package with an operating range up to 105 °C and RoHS compliance.

Request a quote or submit an inquiry to obtain pricing and availability for the MPC8250AVVMHBC and discuss how it fits your next embedded design project.

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