MPC8250AVVPIBC

IC MPU MPC82XX 300MHZ 480TBGA
Part Description

PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 300MHz 480-TBGA (37.5x37.5)

Quantity 394 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8250
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2Device Package480-TBGA (37.5x37.5)
ECCN5A991B4BEthernet10/100Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case480-LBGA Exposed PadRAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed300MHzSupplier Device Package480-TBGA (37.5×37.5)
Voltage – I/O3.3V

Overview of MPC8250AVVPIBC – IC MPU MPC82XX 300MHZ 480TBGA

The MPC8250AVVPIBC is a PowerPC G2 based microprocessor designed for embedded communications applications. It is a single‑core, 32‑bit MPU running at 300 MHz, optimized for systems that require integrated communications peripherals and memory controller functionality.

Packaged in a 480‑TBGA (37.5 × 37.5 mm) surface‑mount package with exposed pad and RoHS compliance, this device targets embedded and networking markets where on‑chip integration of CPM, Ethernet and DRAM/SDRAM controllers reduces board complexity and accelerates time to market.

Key Features

  • Core PowerPC G2 single‑core, 32‑bit processor core running at 300 MHz with on‑chip floating point support and separate 16 KB instruction and 16 KB data caches as described in the device documentation.
  • Communications Processor Module (CPM) Integrated RISC CPM and communications co‑processor resources to support serial and network protocol handling and offload host processing.
  • Memory and Bus On‑chip DRAM/SDRAM controllers and a 60x‑style system bus with support for multiple bus masters and burst transfers to facilitate high throughput memory access.
  • Integrated Networking Interfaces Three 10/100 Mbps Ethernet interfaces and multiple MII ports for networking and communication system designs.
  • Serial and Peripheral Interfaces Multiple serial controllers, SPI and I2C support for peripheral connectivity and system control.
  • Clocking and Power Separate PLLs for the G2 core and CPM with configurable clock multipliers; separate internal core supply (1.8 V) and I/O supply (3.3 V) allow power/performance optimization.
  • Package and Mounting 480‑LBGA exposed pad package (supplier device package: 480‑TBGA, 37.5 × 37.5 mm), surface mount.
  • Operating Conditions Qualified for consumer applications with an operating temperature range of 0 °C to 105 °C.
  • Standards and Compliance RoHS compliant.

Typical Applications

  • Embedded Communications Systems On‑chip CPM, multiple Ethernet ports and serial interfaces make the MPC8250AVVPIBC suitable for protocol processing and control in embedded communications devices.
  • Network Equipment Use in routers, switches or access devices where integrated Ethernet interfaces and DMA support reduce external component count.
  • Telecommunications Infrastructure CPM and TDM/MII support enable implementation of telephony and transport functions within infrastructure modules.
  • Industrial Networking Robust I/O, DRAM/SDRAM controller integration and a wide operating temperature range support industrial embedded networking and control systems.

Unique Advantages

  • Highly integrated communications engine: Integrated CPM, Ethernet ports and peripheral interfaces reduce BOM and simplify board design for networked embedded systems.
  • Flexible clock and power domains: Separate PLLs and supply rails for core and I/O enable power/performance tuning for varied system requirements.
  • On‑chip memory controllers: Built‑in DRAM/SDRAM controllers streamline memory subsystem design and accelerate system integration.
  • Proven PowerPC architecture: PowerPC G2 core with instruction and data caches and MMU support provides a familiar architecture for embedded software development.
  • RoHS compliant package: 480‑TBGA surface‑mount package with exposed pad supports modern manufacturing and thermal strategies.

Why Choose MPC8250AVVPIBC?

The MPC8250AVVPIBC combines a PowerPC G2 core with an integrated Communications Processor Module, multiple Ethernet interfaces, and on‑chip memory controllers to deliver a compact, systems‑oriented solution for embedded communications and networking designs. Its separate core and I/O power domains and configurable clocking provide designers with control over power and performance tradeoffs.

This device is well suited for engineers building embedded networking equipment, telecom modules, or industrial communication controllers who need an integrated processor with targeted communications peripherals and proven PowerPC architecture support.

Request a quote or submit a purchase inquiry to receive pricing and availability for the MPC8250AVVPIBC. Our team can assist with lead times and volume options to support your design schedule.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2006


    Headquarters: Eindhoven, North Brabant, Netherlands


    Employees: 38,000+


    Revenue: $10.53 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up