MPC8250AVVPIBC
| Part Description |
PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 300MHz 480-TBGA (37.5x37.5) |
|---|---|
| Quantity | 394 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8250 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC G2 | Device Package | 480-TBGA (37.5x37.5) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10/100Mbps (3) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 105°C (TA) | ||
| Package / Case | 480-LBGA Exposed Pad | RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 300MHz | Supplier Device Package | 480-TBGA (37.5×37.5) | ||
| Voltage – I/O | 3.3V |
Overview of MPC8250AVVPIBC – IC MPU MPC82XX 300MHZ 480TBGA
The MPC8250AVVPIBC is a PowerPC G2 based microprocessor designed for embedded communications applications. It is a single‑core, 32‑bit MPU running at 300 MHz, optimized for systems that require integrated communications peripherals and memory controller functionality.
Packaged in a 480‑TBGA (37.5 × 37.5 mm) surface‑mount package with exposed pad and RoHS compliance, this device targets embedded and networking markets where on‑chip integration of CPM, Ethernet and DRAM/SDRAM controllers reduces board complexity and accelerates time to market.
Key Features
- Core PowerPC G2 single‑core, 32‑bit processor core running at 300 MHz with on‑chip floating point support and separate 16 KB instruction and 16 KB data caches as described in the device documentation.
- Communications Processor Module (CPM) Integrated RISC CPM and communications co‑processor resources to support serial and network protocol handling and offload host processing.
- Memory and Bus On‑chip DRAM/SDRAM controllers and a 60x‑style system bus with support for multiple bus masters and burst transfers to facilitate high throughput memory access.
- Integrated Networking Interfaces Three 10/100 Mbps Ethernet interfaces and multiple MII ports for networking and communication system designs.
- Serial and Peripheral Interfaces Multiple serial controllers, SPI and I2C support for peripheral connectivity and system control.
- Clocking and Power Separate PLLs for the G2 core and CPM with configurable clock multipliers; separate internal core supply (1.8 V) and I/O supply (3.3 V) allow power/performance optimization.
- Package and Mounting 480‑LBGA exposed pad package (supplier device package: 480‑TBGA, 37.5 × 37.5 mm), surface mount.
- Operating Conditions Qualified for consumer applications with an operating temperature range of 0 °C to 105 °C.
- Standards and Compliance RoHS compliant.
Typical Applications
- Embedded Communications Systems On‑chip CPM, multiple Ethernet ports and serial interfaces make the MPC8250AVVPIBC suitable for protocol processing and control in embedded communications devices.
- Network Equipment Use in routers, switches or access devices where integrated Ethernet interfaces and DMA support reduce external component count.
- Telecommunications Infrastructure CPM and TDM/MII support enable implementation of telephony and transport functions within infrastructure modules.
- Industrial Networking Robust I/O, DRAM/SDRAM controller integration and a wide operating temperature range support industrial embedded networking and control systems.
Unique Advantages
- Highly integrated communications engine: Integrated CPM, Ethernet ports and peripheral interfaces reduce BOM and simplify board design for networked embedded systems.
- Flexible clock and power domains: Separate PLLs and supply rails for core and I/O enable power/performance tuning for varied system requirements.
- On‑chip memory controllers: Built‑in DRAM/SDRAM controllers streamline memory subsystem design and accelerate system integration.
- Proven PowerPC architecture: PowerPC G2 core with instruction and data caches and MMU support provides a familiar architecture for embedded software development.
- RoHS compliant package: 480‑TBGA surface‑mount package with exposed pad supports modern manufacturing and thermal strategies.
Why Choose MPC8250AVVPIBC?
The MPC8250AVVPIBC combines a PowerPC G2 core with an integrated Communications Processor Module, multiple Ethernet interfaces, and on‑chip memory controllers to deliver a compact, systems‑oriented solution for embedded communications and networking designs. Its separate core and I/O power domains and configurable clocking provide designers with control over power and performance tradeoffs.
This device is well suited for engineers building embedded networking equipment, telecom modules, or industrial communication controllers who need an integrated processor with targeted communications peripherals and proven PowerPC architecture support.
Request a quote or submit a purchase inquiry to receive pricing and availability for the MPC8250AVVPIBC. Our team can assist with lead times and volume options to support your design schedule.

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