MPC8250AZUPIBC

The MPC8250AZUPIBC is a PowerQUICC II communications processor based on a PowerPC G2 core, delivering a 300 MHz, single‑core 32‑bit processing platform in a high‑pin‑count 480‑TBGA (37.5×37.5 mm) package. It targets embedded communications and networking applications that require integrated protocol handling, deterministic processing and a broad set of on‑chip peripheral functions.

Designed with an on‑chip Communications Processor Module (CPM), multiple Ethernet interfaces and memory controllers for DRAM/SDRAM, the MPC8250 provides a tightly integrated foundation for routers, gateways, industrial controllers and other embedded systems requiring sustained packet and control processing. The device includes flexible clocking and power domains to support performance and system design tradeoffs.

Key Features

• Core PowerPC G2 single core, 32‑bit architecture running at 300 MHz; dual‑issue integer microarchitecture and on‑chip floating point unit support.
• Cache and MMU Separate 16 KB instruction and 16 KB data caches with MMU support for virtual memory and cache coherency strategies.
• Communications Processor Module (CPM) Integrated CPM for communications offload and protocol handling; supports multiple serial controllers and serial DMA engines as described in the MPC8250 family documentation.
• Ethernet and Serial Interfaces Three 10/100 Mbps Ethernet ports and additional serial interfaces including I2C; multiple MII ports and flexible serial controllers are provided by the family architecture.
• Memory Support On‑chip controllers for DRAM and SDRAM, enabling direct connection to common system memories for buffering and code storage.
• Clocking and Performance Separate PLLs for the G2 core and the CPM with internal core/bus and CPM/bus clock multipliers to optimize core and peripheral frequencies independently.
• Power Domains Separate power supplies for internal logic and I/O (internal logic at 1.8 V, I/O at 3.3 V) to support system power partitioning and standard 3.3 V signalling.
• Packaging and Mounting 480‑TBGA (37.5×37.5 mm) surface‑mount package with exposed pad for thermal management and high pin count for complex system connectivity.
• Operating Range and Compliance Qualified for consumer applications with an operating temperature range of 0 °C to 105 °C and RoHS compliance for environmental regulations.

Typical Applications

• Embedded Networking Equipment Ideal for routers, switches and gateways where integrated Ethernet ports, CPM offload and deterministic packet processing reduce external BOM and simplify system architecture.
• Communications Controllers Suited for protocol handling and serial communications applications that leverage the on‑chip CPM, serial DMA and multiple serial controller resources.
• Industrial Control Systems Provides a compact processing and I/O solution for industrial controllers and automation equipment that require DRAM/SDRAM support, robust packaging and extended temperature operation up to 105 °C.
• Embedded Appliance Control Fits embedded appliance designs that benefit from a dedicated communications processor, integrated memory controllers and 3.3 V I/O signalling.

Unique Advantages

• Highly integrated communications subsystem: On‑chip CPM, multiple Ethernet ports and serial interfaces consolidate protocol processing and reduce external peripheral requirements.
• Flexible clock and power partitioning: Separate PLLs and clock multipliers for core and CPM let designers tune performance and power independently.
• Compact, high‑density package: 480‑TBGA with exposed pad supports high pin counts and thermal dissipation for complex embedded systems.
• Memory and I/O versatility: DRAM/SDRAM controllers and 3.3 V I/O support common memory and interface choices for robust system design.
• Developer‑oriented architecture: PowerPC G2 core with caches and MMU provides familiar architectural features for systems requiring virtual memory and efficient instruction/data handling.
• Regulatory and supply readiness: RoHS compliance and consumer qualification simplify regulatory integration into commercial products.

Why Choose MPC8250AZUPIBC?

The MPC8250AZUPIBC combines a PowerPC G2 compute core with an integrated Communications Processor Module and multiple Ethernet and serial interfaces to deliver a tightly integrated platform for embedded communications and control applications. Its separate clocking domains, memory controllers and high‑pin‑count 480‑TBGA package make it suited to designs that require both protocol offload and substantial I/O connectivity.

This device is appropriate for embedded system designers and procurement teams building networking equipment, communications controllers or industrial appliances who need a compact, RoHS‑compliant solution from NXP Semiconductors that balances processing performance, integration and thermal/package considerations.

Request a quote or submit an inquiry to purchase the MPC8250AZUPIBC and discuss availability, pricing and lead times with our sales team.