MPC8250AZUMHBC

IC MPU MPC82XX 266MHZ 480TBGA
Part Description

PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 266MHz 480-TBGA (37.5x37.5)

Quantity 1,204 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8250
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2Device Package480-TBGA (37.5x37.5)
ECCN5A991B4BEthernet10/100Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case480-LBGA Exposed PadRAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed266MHzSupplier Device Package480-TBGA (37.5×37.5)
Voltage – I/O3.3V

Overview of MPC8250AZUMHBC – IC MPU MPC82XX 266MHz 480-TBGA

The MPC8250AZUMHBC is a single-core PowerPC G2 microprocessor in the MPC8250 series, delivering a 32-bit core operating at 266 MHz. Designed for embedded applications, it integrates communications-oriented peripherals and memory interfaces to serve networking and general embedded control markets.

Key value comes from integrated communications support, on-chip memory/controller resources, and a high-density 480‑TBGA package suitable for surface-mount assembly in space-constrained systems.

Key Features

  • Core & Architecture PowerPC G2 single-core, 32-bit processor running at 266 MHz with a dual-issue integer core and on-chip floating-point and MMU capabilities as documented for the MPC8250 family.
  • Caches & Performance Separate instruction and data caches (16 KB each) and support for bus snooping for data cache coherency to improve system performance in multi-master environments.
  • Communications Processor Module (CPM) Integrated CPM/RISC coprocessor functionality for communications tasks, plus multiple Ethernet ports supporting 10/100 Mbps (3), enabling packet and protocol offload.
  • Memory & DMA On-chip DRAM/SDRAM controllers and serial DMAs including virtual IDMAs to simplify system memory interfacing and efficient data movement.
  • System & Bus Interfaces 60x local bus (64-bit data, 32-bit address) and a 32-bit PCI interface capability (up to 66 MHz) for system expansion and peripheral connectivity.
  • Serial & Control Interfaces Multiple serial interfaces including I2C and SPI, along with SCC/SMC serial controllers and baud-rate generators for broad peripheral support.
  • Power Domains & Clocking Separate internal logic power (1.8 V) and I/O power (3.3 V), and independent PLLs for core and CPM with configurable core/bus multipliers to balance performance and power.
  • Package & Thermal 480‑TBGA package (37.5 × 37.5 mm) with exposed pad, surface-mount mounting and an operating temperature range of 0 °C to 105 °C; RoHS compliant.

Typical Applications

  • Networking & Communications Equipment Protocol handling, packet processing and interface bridging using integrated CPM and multiple 10/100 Mbps Ethernet ports.
  • Embedded Control Systems General-purpose embedded processing where a compact, surface-mount PowerPC G2 core with serial and memory interfaces is required.
  • Consumer Network Appliances Consumer-class network devices and appliances that benefit from on-chip communications modules and a consumer qualification level.

Unique Advantages

  • Highly integrated communications support: On-chip CPM, multiple Ethernet ports and serial controllers reduce external component count for networking designs.
  • Balanced performance and integration: A 266 MHz PowerPC G2 core with separate caches, MMU and FPU (as part of the MPC8250 family) delivers deterministic embedded processing performance.
  • Flexible system connectivity: 60x local bus and PCI interface options allow straightforward expansion and integration with existing system buses.
  • Configurable clocking and power domains: Separate PLLs for core and CPM and distinct I/O and core voltages enable power/performance tuning.
  • Surface-mount, high-density package: 480‑TBGA (37.5 × 37.5 mm) package with exposed pad supports compact board designs and thermal management options.
  • Standards-ready compliance: RoHS-compliant construction and consumer qualification simplify regulatory and supply-chain considerations.

Why Choose MPC8250AZUMHBC?

The MPC8250AZUMHBC positions itself as a compact, communications-capable PowerPC G2 microprocessor that combines processor performance with integrated communications and memory interfaces. It is suited for embedded designers looking to consolidate protocol handling, bus interfacing and DMA functions into a single package.

With a documented feature set from the MPC8250 family—covering caches, CPM, bus options and configurable clocking—this device supports designs requiring reliable embedded processing and network-oriented peripheral integration while maintaining a consumer-grade qualification and RoHS compliance.

Request a quote or submit your RFQ to receive pricing and lead-time information for the MPC8250AZUMHBC.

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