MPC8250AVRIHBC
| Part Description |
PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 200MHz 516-PBGA (27x27) |
|---|---|
| Quantity | 627 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8250 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC G2 | Device Package | 516-PBGA (27x27) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10/100Mbps (3) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 105°C (TA) | ||
| Package / Case | 516-BBGA | RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 200MHz | Supplier Device Package | 516-PBGA (27×27) | ||
| Voltage – I/O | 3.3V |
Overview of MPC8250AVRIHBC – IC MPU MPC82XX 200 MHz PBGA516
The MPC8250AVRIHBC is a PowerPC G2-based embedded microprocessor from NXP Semiconductors' MPC8250 series. It implements a single 32-bit G2 core running at 200 MHz and integrates communication-focused peripherals and memory controllers targeted at embedded and communications applications.
Designed for embedded systems that require on-chip communications processing, the device delivers a balance of processing performance, integrated I/O and memory support, and compact PBGA packaging for surface-mount assembly.
Key Features
- Core and Performance PowerPC G2 single 32-bit core, running at 200 MHz, with separate instruction and data caches (16 Kbytes each) and a floating-point unit as described in the MPC8250 series documentation.
- Communications Processing Integrated Communications Processor Module (CPM) and communication co-processors for RISC/communications tasks, supporting multi-port serial interfaces and protocol handling.
- Ethernet and Serial Interfaces On-chip support for 10/100 Mbps Ethernet ports and additional serial interfaces including I2C and multiple MII-capable ports (as documented for the MPC8250 series).
- Memory and Bus On-chip DRAM/SDRAM controllers and a 60x/Local/PCI bus architecture with support for multiple bus masters and burst transfers to simplify system memory integration.
- Clocking and Power Separate PLLs for the G2 core and CPM enable independent clocking; separate power domains are provided for internal logic (1.8 V) and I/O (3.3 V) to support optimized power/performance configurations.
- Package and Mounting 516-pin PBGA package (27×27 mm footprint), surface-mount mounting for compact board-level integration; package variants and pinout details are provided in the MPC8250 documentation.
- Operating Range and Qualification Consumer-qualified device with an operating temperature range of 0 °C to 105 °C.
Typical Applications
- Embedded Communications Equipment Use as a communications processor where integrated CPM functionality and 10/100 Mbps Ethernet support simplify protocol handling and network interfacing.
- Networking Appliances Suitable for routers, switches or gateways that benefit from on-chip memory controllers, multiple serial/MII interfaces, and a 32-bit PowerPC core.
- Industrial Embedded Systems Compact PBGA packaging and surface-mount assembly support space-constrained embedded controllers that require deterministic processing and I/O integration.
- Telecommunications Modules Integrated TDM and serial resources in the MPC8250 series make the device applicable for telecom line cards and protocol-handling modules.
Unique Advantages
- Integrated Communications Subsystem On-chip CPM and serial DMA resources reduce external controller requirements and simplify BOM for communications-centric designs.
- Separated Clock Domains Independent PLLs for the core and CPM allow designers to tune core and peripheral frequencies for optimal power and performance trade-offs.
- Compact Surface-Mount PBGA 516-pin PBGA (27×27) package provides a high-density pinout in a board-friendly surface-mount form factor.
- Memory Flexibility Built-in DRAM/SDRAM controllers and a 60x-to-local/PCI bridge simplify integration with common memory and bus architectures.
- Clear Thermal and Electrical Data Detailed hardware specifications and package descriptions available in the MPC8250 documentation support reliable thermal and system-level design.
Why Choose MPC8250AVRIHBC?
The MPC8250AVRIHBC positions itself as a compact, communications-oriented embedded processor that pairs a PowerPC G2 core with an integrated Communications Processor Module and memory interfaces. Its combination of on-chip communications resources, separate core/CPM clocking, and standard 3.3 V I/O support makes it suitable for embedded designs that need built-in protocol handling and flexible system integration.
Engineers designing networked embedded systems, telecommunications modules, or space-constrained controllers will find the MPC8250AVRIHBC offers a documented platform with the required interfaces, package options, and operating range to support robust product development and deployment.
Request a quote or submit an inquiry to obtain pricing and availability for MPC8250AVRIHBC and to discuss how it fits your embedded communications design requirements.

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