MPC8250AVRIHBC

IC MPU MPC82XX 200MHZ PBGA516
Part Description

PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 200MHz 516-PBGA (27x27)

Quantity 627 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8250
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2Device Package516-PBGA (27x27)
ECCN5A991B4BEthernet10/100Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case516-BBGARAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed200MHzSupplier Device Package516-PBGA (27×27)
Voltage – I/O3.3V

Overview of MPC8250AVRIHBC – IC MPU MPC82XX 200 MHz PBGA516

The MPC8250AVRIHBC is a PowerPC G2-based embedded microprocessor from NXP Semiconductors' MPC8250 series. It implements a single 32-bit G2 core running at 200 MHz and integrates communication-focused peripherals and memory controllers targeted at embedded and communications applications.

Designed for embedded systems that require on-chip communications processing, the device delivers a balance of processing performance, integrated I/O and memory support, and compact PBGA packaging for surface-mount assembly.

Key Features

  • Core and Performance  PowerPC G2 single 32-bit core, running at 200 MHz, with separate instruction and data caches (16 Kbytes each) and a floating-point unit as described in the MPC8250 series documentation.
  • Communications Processing  Integrated Communications Processor Module (CPM) and communication co-processors for RISC/communications tasks, supporting multi-port serial interfaces and protocol handling.
  • Ethernet and Serial Interfaces  On-chip support for 10/100 Mbps Ethernet ports and additional serial interfaces including I2C and multiple MII-capable ports (as documented for the MPC8250 series).
  • Memory and Bus  On-chip DRAM/SDRAM controllers and a 60x/Local/PCI bus architecture with support for multiple bus masters and burst transfers to simplify system memory integration.
  • Clocking and Power  Separate PLLs for the G2 core and CPM enable independent clocking; separate power domains are provided for internal logic (1.8 V) and I/O (3.3 V) to support optimized power/performance configurations.
  • Package and Mounting  516-pin PBGA package (27×27 mm footprint), surface-mount mounting for compact board-level integration; package variants and pinout details are provided in the MPC8250 documentation.
  • Operating Range and Qualification  Consumer-qualified device with an operating temperature range of 0 °C to 105 °C.

Typical Applications

  • Embedded Communications Equipment  Use as a communications processor where integrated CPM functionality and 10/100 Mbps Ethernet support simplify protocol handling and network interfacing.
  • Networking Appliances  Suitable for routers, switches or gateways that benefit from on-chip memory controllers, multiple serial/MII interfaces, and a 32-bit PowerPC core.
  • Industrial Embedded Systems  Compact PBGA packaging and surface-mount assembly support space-constrained embedded controllers that require deterministic processing and I/O integration.
  • Telecommunications Modules  Integrated TDM and serial resources in the MPC8250 series make the device applicable for telecom line cards and protocol-handling modules.

Unique Advantages

  • Integrated Communications Subsystem  On-chip CPM and serial DMA resources reduce external controller requirements and simplify BOM for communications-centric designs.
  • Separated Clock Domains  Independent PLLs for the core and CPM allow designers to tune core and peripheral frequencies for optimal power and performance trade-offs.
  • Compact Surface-Mount PBGA  516-pin PBGA (27×27) package provides a high-density pinout in a board-friendly surface-mount form factor.
  • Memory Flexibility  Built-in DRAM/SDRAM controllers and a 60x-to-local/PCI bridge simplify integration with common memory and bus architectures.
  • Clear Thermal and Electrical Data  Detailed hardware specifications and package descriptions available in the MPC8250 documentation support reliable thermal and system-level design.

Why Choose MPC8250AVRIHBC?

The MPC8250AVRIHBC positions itself as a compact, communications-oriented embedded processor that pairs a PowerPC G2 core with an integrated Communications Processor Module and memory interfaces. Its combination of on-chip communications resources, separate core/CPM clocking, and standard 3.3 V I/O support makes it suitable for embedded designs that need built-in protocol handling and flexible system integration.

Engineers designing networked embedded systems, telecommunications modules, or space-constrained controllers will find the MPC8250AVRIHBC offers a documented platform with the required interfaces, package options, and operating range to support robust product development and deployment.

Request a quote or submit an inquiry to obtain pricing and availability for MPC8250AVRIHBC and to discuss how it fits your embedded communications design requirements.

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