MPC8250ACZUMHBC

The MPC8250ACZUMHBC is a PowerPC G2 32-bit microprocessor IC with a single core running at 266 MHz, supplied in a 480-TBGA (37.5×37.5 mm) package. Designed for embedded and communications-focused applications, it integrates a communications processor module (CPM), memory controllers and multiple on-chip interfaces to simplify networked system designs.

With industrial qualification and an operating temperature range of −40°C to 105°C, the MPC8250ACZUMHBC targets robust embedded deployments that require integrated I/O, deterministic control and broad peripheral support in a surface-mount BGA package.

Key Features

• Core and Performance – PowerPC G2 single core at 266 MHz with dual-issue integer architecture and an integrated floating-point unit (FPU) for embedded compute tasks.
• Caches and MMU – Separate 16 KB instruction and 16 KB data caches with a PowerPC-compliant memory management unit (MMU) to improve software performance and memory protection.
• Communications Processor Module (CPM) – On-chip CPM providing RISC-based communications co-processing, serial DMAs, time-slot assigner and TDM ports to offload protocol and real-time I/O processing.
• Memory Controllers – Integrated DRAM/SDRAM controllers for system memory interfacing.
• Ethernet and Networking – Three 10/100 Mbps Ethernet ports for multi-port networked applications.
• System Interfaces – Multiple serial interfaces including I2C, SPI, SCC/SMC/PCI support and a 60x-to-PCI bridge for flexible peripheral connectivity.
• Power and Clocking – Separate supplies for internal logic (1.8 V) and I/O (3.3 V), with dedicated PLLs and internal clock multipliers to optimize core and CPM frequencies.
• Package and Temperature – 480-LBGA exposed pad / 480-TBGA (37.5×37.5 mm) surface-mount package; industrial qualification and operating range from −40°C to 105°C.

Typical Applications

• Industrial Networking – Multi-port 10/100 Ethernet and industrial temperature qualification make it suitable for networked controllers, protocol gateways and Ethernet-enabled field devices.
• Communications Equipment – On-chip CPM, TDM ports and serial DMAs support channelized voice/data processing and protocol offload in telecom and VoIP gateways.
• Embedded Control Systems – PowerPC G2 core, MMU and integrated timers/parallel I/O address real-time control, automation and embedded compute tasks.
• Interface and Bridge Devices – Integrated 60x-to-PCI bridge and flexible bus architecture enable use in bridging, expansion and I/O aggregation modules.

Unique Advantages

• Highly integrated communications processing: Combined CPM, serial DMAs and multiple serial interfaces reduce external components and simplify BOM for networking products.
• Flexible clocking and power domains: Separate PLLs and distinct 1.8 V core / 3.3 V I/O supplies enable optimized power/performance trade-offs.
• Footprint compatibility: Footprint-compatible with MPC8260, easing migration or board reuse where applicable.
• Industrial-grade operation: Qualified for industrial use with an operating temperature range of −40°C to 105°C for demanding environments.
• On-chip memory and MMU: 16 KB I-cache and 16 KB D-cache plus MMU support improved application performance and software protection.

Why Choose MPC8250ACZUMHBC?

The MPC8250ACZUMHBC positions itself as a compact, communications-focused PowerPC G2 solution for embedded designs that require on-chip communications processing, multiple Ethernet ports and robust memory/interface integration. Its single 266 MHz core, integrated CPM and peripheral set deliver a balance of deterministic I/O handling and application processing in a single BGA package.

Ideal for system designers building industrial networking equipment, communications gateways or embedded control platforms, the MPC8250ACZUMHBC offers long-term value through integration, industrial qualification and flexible clocking/power options that simplify board-level design and system integration.

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