MPC8250ACVVMHBC
| Part Description |
PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 266MHz 480-TBGA (37.5x37.5) |
|---|---|
| Quantity | 243 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8250 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC G2 | Device Package | 480-TBGA (37.5x37.5) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10/100Mbps (3) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 105°C (TA) | ||
| Package / Case | 480-LBGA Exposed Pad | RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 266MHz | Supplier Device Package | 480-TBGA (37.5×37.5) | ||
| Voltage – I/O | 3.3V |
Overview of MPC8250ACVVMHBC – IC MPU MPC82XX 266MHZ 480TBGA
The MPC8250ACVVMHBC is a PowerPC G2-based 32-bit microprocessor from the MPC8250 series, delivering a 266 MHz core in a high-density 480-TBGA (37.5×37.5 mm) package. Designed for embedded and communications-centric applications, the device integrates a communications processor module (CPM), multi-port Ethernet, and comprehensive memory interfaces to support networking and industrial embedded systems.
Key value comes from on-chip integration—separate core and CPM PLLs, integrated DRAM/SDRAM controllers, and multiple Ethernet ports—providing a compact, industrial-qualified solution for designs that require deterministic performance across a wide operating temperature range.
Key Features
- Core Architecture PowerPC G2 single-core, 32-bit processor running at 266 MHz with separate floating-point unit and PowerPC-compliant MMU.
- Caches Separate 16 KB instruction and 16 KB data caches, four-way set associative with LRU replacement for improved instruction and data throughput.
- Communications Processor Module (CPM) Integrated CPM for communications tasks, including serial DMAs, RISC microcontroller and program ROM for offloading protocol processing.
- Memory and Bus On-chip DRAM and SDRAM controllers plus a 60x system bus (64-bit data / 32-bit address) that supports multiple masters and single- or four-beat burst transfers with 64/32/16/8-bit port sizes.
- Networking Interfaces Three 10/100 Mbps Ethernet ports and multiple serial interfaces (including I2C and SPI) for networked embedded designs.
- Clocking and Performance Separate PLLs for core and CPM and internal clock multipliers (several ratios available) allow independent core and CPM frequencies for power/performance tuning.
- Power Domains Separate supplies for internal logic (1.8 V) and I/O (3.3 V) to support robust system-level power design.
- Package and Mounting Supplied in a 480-TBGA (37.5×37.5 mm) package with exposed pad; surface-mount mounting suitable for dense board layouts.
- Industrial Qualification & Temperature Industrial qualification with an operating temperature range of −40 °C to 105 °C for deployment in demanding environments.
- Standards and Compliance RoHS compliant.
Typical Applications
- Industrial Networking Equipment Ideal for routers, switches, and gateways that require integrated Ethernet ports and a CPM for protocol handling.
- Embedded Communications Systems Suitable for communications appliances that need on-chip serial DMAs, multiple serial interfaces, and flexible clocking between core and CPM.
- Industrial Control and Automation Enables control systems that demand industrial temperature operation and robust memory interfaces (DRAM/SDRAM).
Unique Advantages
- Integrated Communications Engine: On-chip CPM and three 10/100 Mbps Ethernet ports reduce external component count for compact networking designs.
- Flexible Performance Partitioning: Separate PLLs and clock multipliers for the G2 core and CPM let designers optimize core and communications performance independently.
- Robust Memory and Bus Architecture: Built-in DRAM/SDRAM controllers and a 60x bus with multiple master support enable high-throughput system architectures.
- Industrial-Grade Operation: Qualified for −40 °C to 105 °C operation and RoHS compliant, supporting deployment in harsh environments.
- High-Pin-Count, Compact Package: 480-TBGA (37.5×37.5 mm) with exposed pad supports dense designs while providing ample I/O and signal routing capability.
Why Choose MPC8250ACVVMHBC?
The MPC8250ACVVMHBC combines a PowerPC G2 core with an integrated communications processor and multi-port Ethernet in a single industrial-qualified package, delivering a balanced solution for embedded networking and industrial control applications. Its separation of power domains and dedicated PLLs for core and CPM enable designers to tailor performance and power consumption to application needs.
This part is well suited to engineers building compact, networked embedded systems that require reliable operation across a wide temperature range and a high degree of on-chip integration to minimize board-level complexity and BOM count.
Request a quote or submit an RFQ to evaluate the MPC8250ACVVMHBC for your next embedded communications or industrial design.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
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