MPC8250ACZQIHBC
| Part Description |
PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 200MHz 516-PBGA (27x27) |
|---|---|
| Quantity | 339 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8250 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC G2 | Device Package | 516-PBGA (27x27) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10/100Mbps (3) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 105°C (TA) | ||
| Package / Case | 516-BBGA | RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 200MHz | Supplier Device Package | 516-PBGA (27×27) | ||
| Voltage – I/O | 3.3V |
Overview of MPC8250ACZQIHBC – PowerPC G2 200 MHz 32‑Bit MPU, 516‑PBGA
The MPC8250ACZQIHBC is a single‑core PowerPC G2 microprocessor from the MPC8250 series, implemented as a PowerQUICC II communications processor. It integrates a 200 MHz 32‑bit G2 core with on‑chip communications and system peripherals for embedded and industrial designs.
Designed for embedded communications and industrial applications, the device combines processing performance, on‑chip memory controllers and multiple Ethernet interfaces with an industrial operating temperature range and RoHS compliance.
Key Features
- Core and Performance Single PowerPC G2 core, 32‑bit, running at 200 MHz with separate 16‑KB instruction and 16‑KB data caches and an on‑chip floating‑point unit (FPU).
- Communications Processor Module (CPM) Integrated CPM with RISC microcontroller functions and serial DMA capabilities; supports multiple MII ports and three 10/100 Mbps Ethernet interfaces.
- Memory and Bus Subsystem On‑chip DRAM/SDRAM controllers and a 60x bus with 64‑bit data and 32‑bit address support; local and PCI bus interfaces (up to 66 MHz) for flexible system integration.
- Interfaces and Peripherals Multiple serial interfaces including I2C and SPI plus a variety of serial communication channels exposed by the CPM for protocol and peripheral connectivity.
- Power and Packaging Separate power domains for internal logic (1.8 V) and I/O (3.3 V); available in a 516‑pin PBGA (27×27 mm) surface‑mount package.
- System Reliability and Debug PowerPC‑architecture MMU, bus snooping for cache coherency, and a common on‑chip processor (COP) test interface for system validation and reliability.
- Industrial Qualification and Environmental Industrial qualification with operating temperature range of −40 °C to 105 °C and RoHS compliance for regulated environments.
Typical Applications
- Industrial Communications Equipment Provides integrated Ethernet and CPM resources for protocol handling and device communication in industrial networks.
- Embedded Networking Appliances Acts as a communications‑centric processor for routers, gateways and network modules that require multiple 10/100 interfaces and on‑chip DMA.
- Networked Control Systems Suitable for embedded controllers that combine local processing, real‑time serial channels and memory interfacing under industrial temperature requirements.
Unique Advantages
- Highly Integrated Communications Engine: On‑chip CPM, serial DMAs and three 10/100 Mbps Ethernet ports reduce external component count for networked designs.
- Balanced Processing and I/O: 200 MHz PowerPC G2 core with separate instruction/data caches and FPU provides deterministic processing for embedded workloads.
- Flexible Memory and Bus Options: DRAM/SDRAM controllers and wide 60x bus with local/PCI bus support enable scalable memory and system I/O architectures.
- Industrial‑Ready Thermal Range: −40 °C to 105 °C operating range and industrial qualification support deployment in demanding environments.
- Standard PBGA Footprint: 516‑pin PBGA (27×27 mm) surface‑mount package supports compact board layouts and standard assembly processes.
- Regulatory and Supply Considerations: RoHS compliance for environmental conformity.
Why Choose MPC8250ACZQIHBC?
The MPC8250ACZQIHBC positions itself as a communications‑focused embedded processor that combines a 200 MHz PowerPC G2 core with an integrated CPM, multiple Ethernet interfaces and memory controllers—built to the needs of industrial and embedded networking designs. Its industrial temperature rating and RoHS compliance make it suitable for long‑lifecycle deployments in harsh environments.
As part of the MPC8250 family from NXP Semiconductors, the device offers footprint compatibility and system integration options that help simplify redesign and hardware migration while delivering the on‑chip peripherals required to reduce BOM and board complexity.
Request a quote or submit an RFQ to evaluate the MPC8250ACZQIHBC for your next embedded communications or industrial design.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
Revenue: $10.53 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016