MPC8250ACVRIHBC
| Part Description |
PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 200MHz 516-PBGA (27x27) |
|---|---|
| Quantity | 972 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8250 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC G2 | Device Package | 516-PBGA (27x27) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10/100Mbps (3) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 105°C (TA) | ||
| Package / Case | 516-BBGA | RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 200MHz | Supplier Device Package | 516-PBGA (27×27) | ||
| Voltage – I/O | 3.3V |
Overview of MPC8250ACVRIHBC – IC MPU MPC82XX 200MHZ PBGA516
The MPC8250ACVRIHBC is a PowerPC G2-based microprocessor from NXP Semiconductors (MPC8250 series) featuring a single 32-bit core running at 200 MHz in a 516-pin PBGA (27×27) package. It is designed as a communications-focused embedded MPU with integrated communications peripherals and memory controllers for networked and industrial applications.
With on-chip communications processing, multiple Ethernet interfaces, configurable clocking and separate core/I/O power domains, the MPC8250ACVRIHBC targets embedded systems that require a compact, industrial-grade processing engine with strong I/O integration.
Key Features
- Core and Architecture Dual-issue PowerPC G2 integer core (EC603e family) operating at 200 MHz; single 32-bit core with separate instruction and data caches (16 Kbytes each) and MMU support.
- Communications Processor Module (CPM) Integrated CPM/RISC co-processor for communications tasks, enabling serial DMA, time-slot assignment and offloaded protocol handling.
- Memory and Bus On-chip DRAM and SDRAM controllers plus a 60x system bus (64-bit data, 32-bit address) supporting multiple masters and burst transfers for high-throughput embedded designs.
- Networking Interfaces Three 10/100 Mbps Ethernet ports and multiple serial interfaces (including I²C and SPI), suited to networked embedded applications.
- Clocking and Performance Scaling Separate PLLs and configurable clock multipliers for the G2 core and CPM allow independent core and communications clocking for power/performance optimization.
- Power Domains Separate internal logic supply and I/O supply (internal core logic at 1.8 V; I/O at 3.3 V) to support robust system power design.
- Package and Mounting 516-PBGA (27×27) surface-mount package; footprint-compatible with MPC8260 as documented in the hardware specifications.
- Industrial Qualification & Temperature Range Qualified for industrial use with an operating temperature range of −40 °C to 105 °C.
- Compliance RoHS compliant for environmental and regulatory alignment.
Typical Applications
- Networking and Communications Equipment Use the integrated CPM and multiple 10/100 Mbps Ethernet ports for routers, switches, and protocol gateways that require embedded packet handling and serial connectivity.
- Industrial Control Systems Industrial-grade operating range and integrated memory interfaces make it suitable for controllers and automation nodes with demanding environmental requirements.
- Embedded Appliances with Ethernet Ideal for networked appliances and subsystems that need a compact MPU with built-in Ethernet and serial interfaces to reduce external components.
Unique Advantages
- Integrated Communications Engine: CPM and multiple Ethernet ports reduce external controller needs and simplify BOM for communication-centric designs.
- Independent Clock Domains: Separate PLLs and configurable clock multipliers for the G2 core and CPM enable tailored power/performance tuning per subsystem.
- Robust Industrial Operation: Industrial qualification and a −40 °C to 105 °C operating range support deployments in harsh environments.
- Separated Power Domains: Distinct core (1.8 V) and I/O (3.3 V) supplies aid system-level power management and signal compatibility.
- Footprint Compatibility: Documented compatibility with the MPC8260 footprint helps migration and design reuse.
- On-chip Memory Interfaces: Integrated DRAM/SDRAM controllers and a wide system bus simplify high-bandwidth memory subsystem design.
Why Choose MPC8250ACVRIHBC?
The MPC8250ACVRIHBC delivers a balanced combination of PowerPC G2 processing performance, dedicated communications processing and extensive on-chip I/O to address embedded designs where integrated networking and industrial reliability matter. Its configurable clocking, separate power domains and on-chip memory controllers provide designers with flexibility to optimize for throughput, power and system cost.
This device is well suited for engineers building networked embedded systems, industrial controllers and communications appliances that require a compact, documented MPU solution with industrial temperature capability and RoHS compliance. The detailed hardware specifications and datasheet information support confident integration into long-lived products.
Request a quote or submit an inquiry to receive pricing and availability for the MPC8250ACVRIHBC.

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