MPC8250AZQIHBC
| Part Description |
PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 200MHz 516-PBGA (27x27) |
|---|---|
| Quantity | 804 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8250 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC G2 | Device Package | 516-PBGA (27x27) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10/100Mbps (3) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 105°C (TA) | ||
| Package / Case | 516-BBGA | RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 200MHz | Supplier Device Package | 516-PBGA (27×27) | ||
| Voltage – I/O | 3.3V |
Overview of MPC8250AZQIHBC – PowerPC G2 Microprocessor IC, 1 Core, 32‑Bit 200 MHz, 516‑PBGA (27×27)
The MPC8250AZQIHBC is a PowerPC G2‑based microprocessor from NXP Semiconductors, designed for embedded communications and networking applications. It combines a single 32‑bit G2 core running at 200 MHz with an on‑chip Communication Processor Module (CPM) and multiple I/O interfaces for integrated system designs.
Targeted at embedded and communications markets, the device offers a balance of processing throughput, peripheral integration and flexible clock/power domains to support multi‑interface networking and control applications.
Key Features
- Core and Performance The PowerPC G2 single core operates at 200 MHz, delivering benchmarked integer performance documented for the MPC8250 series.
- Caches and MMU Separate 16 Kbyte instruction and 16 Kbyte data caches with a PowerPC‑compliant MMU provide efficient memory access and virtual memory support.
- Communications Processor Module (CPM) Integrated CPM and RISC co‑processor functionality handle communications offload and serial DMA tasks to streamline packet and serial processing.
- Memory Controllers On‑chip controllers for DRAM and SDRAM enable direct connection to external memory arrays for system memory requirements.
- Ethernet and Serial Interfaces Three 10/100 Mbps Ethernet ports and multiple serial controllers (including MII ports and I2C) support versatile connectivity and networked applications.
- Bus and System Interfaces 60x bus with 64‑bit data path and 32‑bit address support, plus a 32‑bit PCI interface operating up to 66 MHz and a local bus up to 66 MHz for flexible system integration.
- Clocking and Power Domains Separate PLLs for the G2 core and the CPM and separate power supplies for core logic (1.8 V) and I/O (3.3 V) enable power/performance optimization.
- Package and Mounting 516‑pin PBGA (27×27 mm) surface‑mount package for compact, high‑pin‑count board designs.
- Operating Range and Compliance Consumer qualification with an operating temperature range of 0 °C to 105 °C and RoHS compliance for environmental regulatory compatibility.
Typical Applications
- Network Appliances Routing, switching, and gateway devices that require integrated Ethernet ports and dedicated communications processing.
- Voice and Data Gateways Multi‑channel serial and TDM interfaces handled by the CPM make the device suitable for voice/data aggregation and gateway functions.
- Embedded Communication Systems Products that need on‑chip memory controllers, PCI/local bus connectivity and flexible clocking for mixed‑speed subsystems.
Unique Advantages
- Highly Integrated Communications Engine: The on‑chip CPM and serial DMA resources reduce external controller requirements and simplify BOM for communication‑centric designs.
- Flexible Performance Scaling: Separate PLLs and power domains for the core and CPM allow designers to balance performance and power consumption across subsystems.
- Broad Connectivity: Multiple 10/100 Mbps Ethernet ports, MII and I2C interfaces plus extensive serial controllers enable diverse network and peripheral integration.
- Robust System Interfaces: 60x system bus and 32‑bit PCI/local bus support up to 66 MHz for high‑throughput board‑level integration.
- Compact PBGA Packaging: 516‑pin PBGA (27×27 mm) provides high pin density for complex system designs while maintaining a surface‑mount form factor.
- Standards‑oriented Documentation: Detailed hardware and electrical specifications for the MPC8250 series support design, power and thermal planning for production systems.
Why Choose MPC8250AZQIHBC?
The MPC8250AZQIHBC positions itself as a purpose‑built embedded communications processor that blends a 200 MHz PowerPC G2 core with an integrated CPM, multiple Ethernet interfaces and flexible bus options. This combination supports designs that require both application processing and dedicated communications handling in a single device.
From networking appliances to embedded gateways, the MPC8250AZQIHBC is suitable for designers seeking a balance of on‑chip connectivity, memory controller support and configurable clock/power domains, all provided by NXP Semiconductors and supported by comprehensive series documentation.
Request a quote or submit an inquiry for MPC8250AZQIHBC to obtain pricing and availability details for your next embedded communications design.

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