MPC8250AZQIHBC

IC MPU MPC82XX 200MHZ PBGA516
Part Description

PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 200MHz 516-PBGA (27x27)

Quantity 804 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8250
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2Device Package516-PBGA (27x27)
ECCN5A991B4BEthernet10/100Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case516-BBGARAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed200MHzSupplier Device Package516-PBGA (27×27)
Voltage – I/O3.3V

Overview of MPC8250AZQIHBC – PowerPC G2 Microprocessor IC, 1 Core, 32‑Bit 200 MHz, 516‑PBGA (27×27)

The MPC8250AZQIHBC is a PowerPC G2‑based microprocessor from NXP Semiconductors, designed for embedded communications and networking applications. It combines a single 32‑bit G2 core running at 200 MHz with an on‑chip Communication Processor Module (CPM) and multiple I/O interfaces for integrated system designs.

Targeted at embedded and communications markets, the device offers a balance of processing throughput, peripheral integration and flexible clock/power domains to support multi‑interface networking and control applications.

Key Features

  • Core and Performance  The PowerPC G2 single core operates at 200 MHz, delivering benchmarked integer performance documented for the MPC8250 series.
  • Caches and MMU  Separate 16 Kbyte instruction and 16 Kbyte data caches with a PowerPC‑compliant MMU provide efficient memory access and virtual memory support.
  • Communications Processor Module (CPM)  Integrated CPM and RISC co‑processor functionality handle communications offload and serial DMA tasks to streamline packet and serial processing.
  • Memory Controllers  On‑chip controllers for DRAM and SDRAM enable direct connection to external memory arrays for system memory requirements.
  • Ethernet and Serial Interfaces  Three 10/100 Mbps Ethernet ports and multiple serial controllers (including MII ports and I2C) support versatile connectivity and networked applications.
  • Bus and System Interfaces  60x bus with 64‑bit data path and 32‑bit address support, plus a 32‑bit PCI interface operating up to 66 MHz and a local bus up to 66 MHz for flexible system integration.
  • Clocking and Power Domains  Separate PLLs for the G2 core and the CPM and separate power supplies for core logic (1.8 V) and I/O (3.3 V) enable power/performance optimization.
  • Package and Mounting  516‑pin PBGA (27×27 mm) surface‑mount package for compact, high‑pin‑count board designs.
  • Operating Range and Compliance  Consumer qualification with an operating temperature range of 0 °C to 105 °C and RoHS compliance for environmental regulatory compatibility.

Typical Applications

  • Network Appliances  Routing, switching, and gateway devices that require integrated Ethernet ports and dedicated communications processing.
  • Voice and Data Gateways  Multi‑channel serial and TDM interfaces handled by the CPM make the device suitable for voice/data aggregation and gateway functions.
  • Embedded Communication Systems  Products that need on‑chip memory controllers, PCI/local bus connectivity and flexible clocking for mixed‑speed subsystems.

Unique Advantages

  • Highly Integrated Communications Engine: The on‑chip CPM and serial DMA resources reduce external controller requirements and simplify BOM for communication‑centric designs.
  • Flexible Performance Scaling: Separate PLLs and power domains for the core and CPM allow designers to balance performance and power consumption across subsystems.
  • Broad Connectivity: Multiple 10/100 Mbps Ethernet ports, MII and I2C interfaces plus extensive serial controllers enable diverse network and peripheral integration.
  • Robust System Interfaces: 60x system bus and 32‑bit PCI/local bus support up to 66 MHz for high‑throughput board‑level integration.
  • Compact PBGA Packaging: 516‑pin PBGA (27×27 mm) provides high pin density for complex system designs while maintaining a surface‑mount form factor.
  • Standards‑oriented Documentation: Detailed hardware and electrical specifications for the MPC8250 series support design, power and thermal planning for production systems.

Why Choose MPC8250AZQIHBC?

The MPC8250AZQIHBC positions itself as a purpose‑built embedded communications processor that blends a 200 MHz PowerPC G2 core with an integrated CPM, multiple Ethernet interfaces and flexible bus options. This combination supports designs that require both application processing and dedicated communications handling in a single device.

From networking appliances to embedded gateways, the MPC8250AZQIHBC is suitable for designers seeking a balance of on‑chip connectivity, memory controller support and configurable clock/power domains, all provided by NXP Semiconductors and supported by comprehensive series documentation.

Request a quote or submit an inquiry for MPC8250AZQIHBC to obtain pricing and availability details for your next embedded communications design.

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