MPC8255ACVVMHBB

IC MPU MPC82XX 266MHZ 480TBGA
Part Description

PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 266MHz 480-TBGA (37.5x37.5)

Quantity 931 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8255
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2Device Package480-TBGA (37.5x37.5)
ECCN5A991B4BEthernet10/100Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case480-LBGA Exposed PadRAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed266MHzSupplier Device Package480-TBGA (37.5×37.5)
Voltage – I/O3.3V

Overview of MPC8255ACVVMHBB – IC MPU MPC82XX 266MHZ 480TBGA

The MPC8255ACVVMHBB is an industrial-grade PowerPC G2 microprocessor in the MPC8255 series, featuring a single 32-bit core running at 266 MHz. It targets embedded and communications-oriented applications that require integrated peripherals, memory controllers and deterministic thermal and voltage ranges for industrial deployment.

Designed for surface-mount applications, the device combines on-chip communications processing capabilities, multiple I/O interfaces and DRAM/SDRAM memory controllers in a 480-TBGA (37.5x37.5) package, providing a compact, RoHS-compliant solution for embedded systems engineering.

Key Features

  • Core  PowerPC G2 single 32-bit core running at 266 MHz, optimized for embedded communications and control workloads.
  • Memory Controllers  On-chip DRAM and SDRAM controllers to interface directly with external memory subsystems.
  • Communications Co-processors  Integrated communications and RISC CPM co-processor support for offloading protocol and data-path tasks.
  • Ethernet  10/100 Mbps Ethernet capability (3) for multi-port network connectivity in embedded networking applications.
  • Peripheral Interfaces  Includes I2C plus multiple serial and parallel interfaces as part of the device’s embedded I/O set.
  • Power and I/O  3.3 V I/O voltage domain for common embedded system compatibility.
  • Package and Mounting  480-LBGA exposed pad / 480-TBGA (37.5x37.5) supplier package, surface-mount mounting type for compact board designs.
  • Industrial Qualification & Thermal Range  Industrial-qualified device with an operating temperature range of −40 °C to 105 °C.
  • Regulatory  RoHS compliant.
  • Graphics  No dedicated graphics acceleration — suited for control, communications and data-processing tasks rather than graphics-intensive workloads.
  • Family-Level Hardware Notes  Documentation for the MPC82xx/MPC826x family highlights features such as separate instruction/data caches, an FPU in family devices, and separate PLLs for core and communications modules; refer to family documentation for detailed architecture-level capabilities.

Typical Applications

  • Embedded Communications  Multi-port 10/100 Mbps Ethernet and CPM support make the MPC8255ACVVMHBB suitable for routers, gateways and protocol-handling modules in industrial networks.
  • Industrial Control  Industrial temperature qualification and on-chip DRAM/SDRAM controllers enable reliable control and automation platforms that require robust processing and memory interfaces.
  • Networking Appliances  Single-core PowerPC performance at 266 MHz and multiple network interfaces support medium-performance networking appliances and edge devices.
  • Protocol Offload and DSP Tasks  Communications/RISC CPM co-processor support helps offload serial and communications tasks from the main CPU, improving system determinism.

Unique Advantages

  • Integrated Communications Capability: Built-in CPM and 10/100 Mbps Ethernet interfaces reduce external component count and simplify board-level design for networked systems.
  • Industrial Thermal Range: Rated from −40 °C to 105 °C to meet temperature demands of industrial embedded applications.
  • Compact BGA Package: 480-TBGA (37.5x37.5) package with exposed pad offers high pin density in a compact surface-mount form factor for space-constrained designs.
  • Memory Interface Flexibility: Native DRAM and SDRAM controllers allow direct connection to common memory types without additional controller ICs.
  • Design Compatibility: 3.3 V I/O signaling and standard interfaces such as I2C help integrate the device into a wide range of existing embedded systems.
  • RoHS Compliance: Environmentally compliant manufacturing and materials support regulatory needs for modern product designs.

Why Choose MPC8255ACVVMHBB?

The MPC8255ACVVMHBB positions itself as a compact, industrially qualified embedded processor for communications and control applications requiring a PowerPC G2 core at 266 MHz, integrated memory controllers and multi-port Ethernet capability. Its combination of on-chip communications support and standard interfaces reduces BOM complexity and accelerates system integration.

Engineers designing industrial routers, gateways, automation controllers or other embedded networked appliances will find the MPC8255ACVVMHBB suitable when deterministic operation across a wide temperature range, surface-mount packaging and RoHS compliance are required. Consult MPC8255 family documentation for additional architecture-level details and implementation guidance.

Request a quote or submit an RFQ to inquire about pricing, lead times and availability for the MPC8255ACVVMHBB. Our team can provide the parts and documentation needed to evaluate this device in your next embedded design.

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