MPC8255ACZUMIBB
| Part Description |
PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 266MHz 480-TBGA (37.5x37.5) |
|---|---|
| Quantity | 1,685 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8255 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC G2 | Device Package | 480-TBGA (37.5x37.5) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10/100Mbps (3) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 105°C (TA) | ||
| Package / Case | 480-LBGA Exposed Pad | RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 266MHz | Supplier Device Package | 480-TBGA (37.5×37.5) | ||
| Voltage – I/O | 3.3V |
Overview of MPC8255ACZUMIBB – IC MPU MPC82XX 266MHz 480TBGA
The MPC8255ACZUMIBB is a PowerPC G2 single-core microprocessor operating at 266 MHz in a 480-TBGA (37.5 × 37.5 mm) package. It is designed for embedded and communications-focused systems where integrated communications processing, memory interface flexibility, and extended temperature operation are required.
With an on-chip communications processor module (RISC CPM), DRAM/SDRAM controllers, and 10/100 Mbps Ethernet support, this industrial-qualified device targets industrial and embedded applications that need deterministic processing, multi-protocol interfacing, and package-level robustness.
Key Features
- Core PowerPC G2 32-bit single core running at 266 MHz, providing deterministic instruction throughput for embedded control and communications tasks.
- Memory and Cache On-chip support for DRAM and SDRAM controllers; the G2 core architecture includes separate instruction and data caches as described in the device family documentation.
- Communications Processor Module (CPM) Integrated RISC CPM for communications offload and protocol handling to simplify system design and reduce host core load.
- Ethernet Connectivity 10/100 Mbps Ethernet support, enabling standard LAN connectivity for embedded networking and industrial control.
- Serial and System Interfaces Additional interfaces include I2C and other serial/peripheral interfaces provided by the device family to support system management and peripheral control.
- Power and Clocking 3.3 V I/O voltage specification. Family-level features include separate power domains and clocking elements to allow optimization of core and peripheral clocking.
- Package and Mounting 480-LBGA exposed-pad package (480-TBGA, 37.5 × 37.5 mm) for surface-mount assembly and thermal handling on industrial PCBs.
- Temperature and Qualification Industrial qualification with operating temperature range of −40 °C to 105 °C for use in harsh environments.
- Regulatory RoHS compliant.
Typical Applications
- Industrial Networking: Use as a communications processor for industrial Ethernet endpoints and protocol gateways where 10/100 Mbps connectivity and CPM offload are required.
- Embedded Control Systems: Deploy in control nodes requiring deterministic 32-bit processing at 266 MHz and DRAM/SDRAM support for application memory.
- Telecommunications Equipment: Integrate into line-card or edge devices that need on-chip CPM resources and serial interfaces for packet handling and protocol processing.
- Ruggedized Devices: Suitable for systems operating across −40 °C to 105 °C that require surface-mount mounting and a thermally managed exposed-pad BGA package.
Unique Advantages
- Integrated Communications Offload: On-chip RISC CPM reduces host core burden for protocol handling and serial DMA tasks, simplifying firmware partitioning.
- Memory Interface Flexibility: Built-in DRAM and SDRAM controllers let designers choose common external memory types without separate controller ICs.
- Industrial Temperature Range: Rated from −40 °C to 105 °C to support deployment in demanding environmental conditions.
- Robust Packaging: 480-TBGA with exposed pad supports thermal dissipation and reliable surface-mount assembly for industrial PCBs.
- Standards-Oriented Connectivity: 10/100 Mbps Ethernet and I2C support enable straightforward integration into networked and sensor-driven systems.
Why Choose MPC8255ACZUMIBB?
The MPC8255ACZUMIBB combines a PowerPC G2 32-bit core at 266 MHz with integrated communications processing and flexible memory interfaces, making it a focused choice for embedded systems that require on-chip protocol handling and industrial-grade operation. Its industrial qualification, BGA exposed-pad package, and ROHS compliance support long-term deployment in rugged applications.
This part is suited for engineering teams and procurement professionals designing industrial networking, embedded control, and telecom endpoint equipment that need a deterministic microprocessor platform with integrated communications peripherals and standard memory/IO support.
Request a quote or submit a procurement inquiry to receive pricing, lead-time, and availability information for the MPC8255ACZUMIBB.

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