MPC8255ACZUMIBB

IC MPU MPC82XX 266MHZ 480TBGA
Part Description

PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 266MHz 480-TBGA (37.5x37.5)

Quantity 1,685 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8255
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2Device Package480-TBGA (37.5x37.5)
ECCN5A991B4BEthernet10/100Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case480-LBGA Exposed PadRAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed266MHzSupplier Device Package480-TBGA (37.5×37.5)
Voltage – I/O3.3V

Overview of MPC8255ACZUMIBB – IC MPU MPC82XX 266MHz 480TBGA

The MPC8255ACZUMIBB is a PowerPC G2 single-core microprocessor operating at 266 MHz in a 480-TBGA (37.5 × 37.5 mm) package. It is designed for embedded and communications-focused systems where integrated communications processing, memory interface flexibility, and extended temperature operation are required.

With an on-chip communications processor module (RISC CPM), DRAM/SDRAM controllers, and 10/100 Mbps Ethernet support, this industrial-qualified device targets industrial and embedded applications that need deterministic processing, multi-protocol interfacing, and package-level robustness.

Key Features

  • Core  PowerPC G2 32-bit single core running at 266 MHz, providing deterministic instruction throughput for embedded control and communications tasks.
  • Memory and Cache  On-chip support for DRAM and SDRAM controllers; the G2 core architecture includes separate instruction and data caches as described in the device family documentation.
  • Communications Processor Module (CPM)  Integrated RISC CPM for communications offload and protocol handling to simplify system design and reduce host core load.
  • Ethernet Connectivity  10/100 Mbps Ethernet support, enabling standard LAN connectivity for embedded networking and industrial control.
  • Serial and System Interfaces  Additional interfaces include I2C and other serial/peripheral interfaces provided by the device family to support system management and peripheral control.
  • Power and Clocking  3.3 V I/O voltage specification. Family-level features include separate power domains and clocking elements to allow optimization of core and peripheral clocking.
  • Package and Mounting  480-LBGA exposed-pad package (480-TBGA, 37.5 × 37.5 mm) for surface-mount assembly and thermal handling on industrial PCBs.
  • Temperature and Qualification  Industrial qualification with operating temperature range of −40 °C to 105 °C for use in harsh environments.
  • Regulatory  RoHS compliant.

Typical Applications

  • Industrial Networking: Use as a communications processor for industrial Ethernet endpoints and protocol gateways where 10/100 Mbps connectivity and CPM offload are required.
  • Embedded Control Systems: Deploy in control nodes requiring deterministic 32-bit processing at 266 MHz and DRAM/SDRAM support for application memory.
  • Telecommunications Equipment: Integrate into line-card or edge devices that need on-chip CPM resources and serial interfaces for packet handling and protocol processing.
  • Ruggedized Devices: Suitable for systems operating across −40 °C to 105 °C that require surface-mount mounting and a thermally managed exposed-pad BGA package.

Unique Advantages

  • Integrated Communications Offload: On-chip RISC CPM reduces host core burden for protocol handling and serial DMA tasks, simplifying firmware partitioning.
  • Memory Interface Flexibility: Built-in DRAM and SDRAM controllers let designers choose common external memory types without separate controller ICs.
  • Industrial Temperature Range: Rated from −40 °C to 105 °C to support deployment in demanding environmental conditions.
  • Robust Packaging: 480-TBGA with exposed pad supports thermal dissipation and reliable surface-mount assembly for industrial PCBs.
  • Standards-Oriented Connectivity: 10/100 Mbps Ethernet and I2C support enable straightforward integration into networked and sensor-driven systems.

Why Choose MPC8255ACZUMIBB?

The MPC8255ACZUMIBB combines a PowerPC G2 32-bit core at 266 MHz with integrated communications processing and flexible memory interfaces, making it a focused choice for embedded systems that require on-chip protocol handling and industrial-grade operation. Its industrial qualification, BGA exposed-pad package, and ROHS compliance support long-term deployment in rugged applications.

This part is suited for engineering teams and procurement professionals designing industrial networking, embedded control, and telecom endpoint equipment that need a deterministic microprocessor platform with integrated communications peripherals and standard memory/IO support.

Request a quote or submit a procurement inquiry to receive pricing, lead-time, and availability information for the MPC8255ACZUMIBB.

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