MPC8260ACZUMHBB

IC MPU MPC82XX 266MHZ 480TBGA
Part Description

PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 266MHz 480-TBGA (37.5x37.5)

Quantity 860 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8260
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2Device Package480-TBGA (37.5x37.5)
ECCN5A991B4BEthernet10/100Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case480-LBGA Exposed PadRAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed266MHzSupplier Device Package480-TBGA (37.5×37.5)
Voltage – I/O3.3V

Overview of MPC8260ACZUMHBB – PowerPC G2 266 MHz, 32‑Bit MPU in 480‑TBGA

The MPC8260ACZUMHBB is a PowerPC G2 microprocessor in the MPC8260 family, delivering a 266 MHz single‑core 32‑bit architecture optimized for embedded communications and industrial applications. It integrates a Communication Processor Module (CPM) and multiple on‑chip interfaces to support networked embedded systems that require deterministic control, Ethernet connectivity, and industrial temperature operation.

Designed for system integration and long‑life embedded designs, this device pairs on‑chip protocol and I/O support with flexible clocking and power options to balance performance and system power requirements.

Key Features

  • Core and Architecture  PowerPC G2 single core, 32‑bit processor operating at 266 MHz with on‑chip instruction and data resources from the MPC826xA family.
  • Memory and MMU  Includes a PowerPC‑architecture compliant MMU and family‑level cache architecture (separate instruction and data caches as described in MPC826xA documentation) to support efficient memory management and task isolation.
  • Communications Coprocessor (CPM)  Integrated RISC CPM for communications and DSP tasks, enabling offload of serial protocol processing and real‑time data handling.
  • Ethernet Connectivity  10/100 Mbps Ethernet ports (3) for networked embedded applications requiring multiple Ethernet interfaces.
  • Memory Controllers  On‑chip DRAM and SDRAM controllers to simplify external memory interfacing and reduce system BOM.
  • Clocking and Power  Separate PLLs for the G2 core and CPM and multiple internal clock multiplier ratios, plus separate supplies for internal logic and I/O to support power/performance optimization.
  • Peripheral Interfaces  Multiple serial interfaces including I2C and other UART/SPI/SCC/FCC style serial peripherals available in the MPC826xA family to support diverse peripheral connectivity.
  • Package and Mounting  480‑TBGA (37.5 × 37.5 mm) 480‑LBGA with exposed pad; surface‑mount package suitable for high‑density board designs.
  • Industrial Qualification and Temperature Range  Industrial qualification with an operating temperature range of −40 °C to 105 °C for deployment in demanding environments.
  • I/O Voltage  3.3 V I/O voltage for compatibility with standard embedded peripherals.
  • RoHS Compliant  Material compliance for regulated manufacturing requirements.

Typical Applications

  • Networking and Communications Equipment  Multi‑port Ethernet support and an integrated CPM make this device suitable for routers, switches, and edge communications modules.
  • Industrial Automation and Control  Industrial temperature rating and on‑chip real‑time communications capabilities support PLCs, motion controllers, and factory automation gateways.
  • Embedded Communications Appliances  Integrated DRAM/SDRAM controllers and serial interfaces enable compact embedded appliances that require protocol handling and deterministic I/O.

Unique Advantages

  • Integrated Communications Subsystem: The on‑chip RISC CPM offloads protocol and serial processing, reducing external components and simplifying system design.
  • Flexible Clocking and Power Partitioning: Separate PLLs and supply domains for core and I/O allow designers to tune performance and power independently for core and communications functions.
  • Industrial‑Grade Operation: −40 °C to 105 °C operating range supports deployment in harsh environments and extended‑temperature industrial systems.
  • High‑Density Packaging: 480‑TBGA (37.5 × 37.5 mm) package enables high pin‑count connectivity in a surface‑mount form factor for compact boards.
  • On‑Chip Memory Support: Integrated DRAM/SDRAM controllers and MMU support efficient memory architectures and simplify board-level memory integration.
  • Standards‑Oriented I/O Voltage: 3.3 V I/O ensures compatibility with common embedded peripherals and transceiver components.

Why Choose MPC8260ACZUMHBB?

The MPC8260ACZUMHBB positions itself as a robust, integrated solution for embedded communications and industrial systems that require a PowerPC G2 core with dedicated communications processing. Its combination of CPM offload, multiple Ethernet ports, flexible clocking, and industrial temperature qualification makes it well suited for networked appliances, automation controllers, and embedded communication platforms where integration, deterministic I/O, and thermal robustness matter.

For designers seeking a long‑life, manufacturable MPU option with on‑chip memory controllers and extensive serial/peripheral interfaces, this device provides a compact, surface‑mount package and ecosystem continuity within the MPC8260 family and PowerQUICC II architecture.

Request a quote or submit a purchase inquiry to receive pricing, availability, and lead‑time information for the MPC8260ACZUMHBB.

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