MPC8260ACZUMIBB
| Part Description |
PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 266MHz 480-TBGA (37.5x37.5) |
|---|---|
| Quantity | 1,105 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8260 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC G2 | Device Package | 480-TBGA (37.5x37.5) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10/100Mbps (3) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 105°C (TA) | ||
| Package / Case | 480-LBGA Exposed Pad | RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unknown | ||
| RoHS Compliance | RoHS non-compliant | Speed | 266MHz | Supplier Device Package | 480-TBGA (37.5×37.5) | ||
| Voltage – I/O | 3.3V |
Overview of MPC8260ACZUMIBB – IC MPU MPC82XX 266MHz 480-TBGA
The MPC8260ACZUMIBB is a PowerPC G2-based microprocessor in the MPC8260 series designed for embedded communications and industrial applications. It integrates a single 32-bit PowerPC G2 core running at 266 MHz with on-chip communications and memory controller support for compact, performance-focused system designs.
Targeted at networking and embedded systems, this industrial-qualified device offers multi-interface connectivity, flexible memory support, and a compact 480-TBGA (37.5×37.5 mm) surface-mount package to enable high-density board implementations with extended temperature operation.
Key Features
- Core PowerPC G2 single core, 32-bit architecture operating at 266 MHz for deterministic embedded processing.
- Communications Co-processors Integrated communications and RISC CPM co-processors to accelerate protocol handling and serial peripheral control.
- Memory Support On-chip support for DRAM and SDRAM controllers to simplify system memory interfacing and reduce external logic.
- Ethernet Connectivity Three 10/100 Mbps Ethernet interfaces for multi-port networking and communication designs.
- I/O and Peripheral Interfaces 3.3 V I/O signaling and common serial interfaces including I2C to integrate sensors, management controllers, and peripherals.
- Package and Mounting 480-TBGA (37.5×37.5 mm) exposed-pad package, surface-mount for high-density PCB layouts and thermal management.
- Industrial Qualification and Temperature Range Industrial-qualified device rated for operation from −40 °C to 105 °C for reliable deployment in harsh environments.
- Compliance RoHS compliant to meet contemporary environmental and manufacturing requirements.
Typical Applications
- Embedded Networking Equipment Multi-port 10/100 Mbps Ethernet capability and communications co-processors make this device suitable for routers, switches, and access points.
- Industrial Control Systems Industrial temperature rating and robust I/O support enable use in factory automation, PLCs, and industrial gateways.
- Communications Infrastructure Integrated CPM and serial interfaces support protocol offload and interface consolidation for telecom and network appliances.
- Embedded Platforms Compact 480-TBGA package and DRAM/SDRAM controller support dense embedded designs that require high integration and reliable operation.
Unique Advantages
- Integrated Communications Processing: On-chip communications and RISC CPM co-processors reduce external components and simplify protocol handling.
- Multi-port Ethernet: Three 10/100 Mbps Ethernet interfaces enable versatile networking topologies without additional PHY complexity.
- Industrial-Grade Operation: −40 °C to 105 °C operating range and industrial qualification support deployment in challenging environments.
- Compact, Thermally Optimized Package: 480-TBGA with exposed pad supports high-density layouts while aiding thermal dissipation on populated PCBs.
- Flexible Memory Interface: Built-in DRAM and SDRAM controllers streamline system memory integration and board-level design.
- Standards-Compliant I/O: 3.3 V I/O and common interfaces such as I2C enable broad interoperability with sensors and management devices.
Why Choose MPC8260ACZUMIBB?
The MPC8260ACZUMIBB combines a PowerPC G2 single 32-bit core at 266 MHz with integrated communications processing, multi-port Ethernet, and flexible memory support to deliver a compact, industrial-grade solution for embedded networking and control systems. Its 480-TBGA package and exposed pad enable high-density designs while addressing thermal needs.
This device is well-suited for designers seeking a reliable, RoHS-compliant processor platform that consolidates communications interfaces and memory controllers to reduce BOM and simplify system architecture for long-term, field-deployable products.
Request a quote or submit an inquiry to receive pricing, availability, and lead-time details for the MPC8260ACZUMIBB.

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