MPC8260ACZUMIBB

IC MPU MPC82XX 266MHZ 480TBGA
Part Description

PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 266MHz 480-TBGA (37.5x37.5)

Quantity 1,105 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8260
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2Device Package480-TBGA (37.5x37.5)
ECCN5A991B4BEthernet10/100Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity LevelN/AMounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case480-LBGA Exposed PadRAM ControllersDRAM, SDRAMREACH ComplianceREACH Unknown
RoHS ComplianceRoHS non-compliantSpeed266MHzSupplier Device Package480-TBGA (37.5×37.5)
Voltage – I/O3.3V

Overview of MPC8260ACZUMIBB – IC MPU MPC82XX 266MHz 480-TBGA

The MPC8260ACZUMIBB is a PowerPC G2-based microprocessor in the MPC8260 series designed for embedded communications and industrial applications. It integrates a single 32-bit PowerPC G2 core running at 266 MHz with on-chip communications and memory controller support for compact, performance-focused system designs.

Targeted at networking and embedded systems, this industrial-qualified device offers multi-interface connectivity, flexible memory support, and a compact 480-TBGA (37.5×37.5 mm) surface-mount package to enable high-density board implementations with extended temperature operation.

Key Features

  • Core PowerPC G2 single core, 32-bit architecture operating at 266 MHz for deterministic embedded processing.
  • Communications Co-processors Integrated communications and RISC CPM co-processors to accelerate protocol handling and serial peripheral control.
  • Memory Support On-chip support for DRAM and SDRAM controllers to simplify system memory interfacing and reduce external logic.
  • Ethernet Connectivity Three 10/100 Mbps Ethernet interfaces for multi-port networking and communication designs.
  • I/O and Peripheral Interfaces 3.3 V I/O signaling and common serial interfaces including I2C to integrate sensors, management controllers, and peripherals.
  • Package and Mounting 480-TBGA (37.5×37.5 mm) exposed-pad package, surface-mount for high-density PCB layouts and thermal management.
  • Industrial Qualification and Temperature Range Industrial-qualified device rated for operation from −40 °C to 105 °C for reliable deployment in harsh environments.
  • Compliance RoHS compliant to meet contemporary environmental and manufacturing requirements.

Typical Applications

  • Embedded Networking Equipment Multi-port 10/100 Mbps Ethernet capability and communications co-processors make this device suitable for routers, switches, and access points.
  • Industrial Control Systems Industrial temperature rating and robust I/O support enable use in factory automation, PLCs, and industrial gateways.
  • Communications Infrastructure Integrated CPM and serial interfaces support protocol offload and interface consolidation for telecom and network appliances.
  • Embedded Platforms Compact 480-TBGA package and DRAM/SDRAM controller support dense embedded designs that require high integration and reliable operation.

Unique Advantages

  • Integrated Communications Processing: On-chip communications and RISC CPM co-processors reduce external components and simplify protocol handling.
  • Multi-port Ethernet: Three 10/100 Mbps Ethernet interfaces enable versatile networking topologies without additional PHY complexity.
  • Industrial-Grade Operation: −40 °C to 105 °C operating range and industrial qualification support deployment in challenging environments.
  • Compact, Thermally Optimized Package: 480-TBGA with exposed pad supports high-density layouts while aiding thermal dissipation on populated PCBs.
  • Flexible Memory Interface: Built-in DRAM and SDRAM controllers streamline system memory integration and board-level design.
  • Standards-Compliant I/O: 3.3 V I/O and common interfaces such as I2C enable broad interoperability with sensors and management devices.

Why Choose MPC8260ACZUMIBB?

The MPC8260ACZUMIBB combines a PowerPC G2 single 32-bit core at 266 MHz with integrated communications processing, multi-port Ethernet, and flexible memory support to deliver a compact, industrial-grade solution for embedded networking and control systems. Its 480-TBGA package and exposed pad enable high-density designs while addressing thermal needs.

This device is well-suited for designers seeking a reliable, RoHS-compliant processor platform that consolidates communications interfaces and memory controllers to reduce BOM and simplify system architecture for long-term, field-deployable products.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time details for the MPC8260ACZUMIBB.

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