MPC8260AZUMHBB

IC MPU MPC82XX 266MHZ 480TBGA
Part Description

PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 266MHz 480-TBGA (37.5x37.5)

Quantity 586 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8260
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2Device Package480-TBGA (37.5x37.5)
ECCN5A991B4BEthernet10/100Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case480-LBGA Exposed PadRAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed266MHzSupplier Device Package480-TBGA (37.5×37.5)
Voltage – I/O3.3V

Overview of MPC8260AZUMHBB – IC MPU MPC82XX 266MHZ 480TBGA

The MPC8260AZUMHBB is a PowerPC G2 microprocessor single-core device operating at 266 MHz, designed for embedded applications that require integrated communications and system-level peripherals. It belongs to the MPC82xx family and provides a combination of core performance and on-chip communications functionality geared toward networking and embedded control use cases.

Key value is delivered through a 32-bit PowerPC G2 core, integrated communications co-processor (CPM), memory controllers for DRAM/SDRAM, and a high-density 480-TBGA package, enabling compact, high-pin-count system designs with support for Ethernet and standard serial interfaces.

Key Features

  • Core  PowerPC G2 single-core 32-bit processor running at 266 MHz.
  • Memory  On-chip controllers for DRAM and SDRAM to support system memory requirements.
  • Communications Co-processor  Integrated Communications Processor Module (RISC CPM) for communications offload and serial DMA support.
  • Ethernet  10/100Mbps Ethernet capability (specification lists "10/100Mbps (3)").
  • Serial and Control Interfaces  Additional interfaces include I2C along with multiple serial controllers available via the CPM.
  • Packaging  480-LBGA exposed pad, supplied in a 480-TBGA package with 37.5×37.5 mm body — designed for surface-mount assembly.
  • Power and Clocking  3.3 V I/O voltage and on-chip clocking architecture described in the MPC8260A PowerQUICC II documentation, including separate PLLs for core and CPM and selectable clock multipliers.
  • Memory Management and Acceleration  Family-level documentation references separate 16-Kbyte instruction and data caches and an MMU in the G2 core.
  • Operating Range & Compliance  Operating temperature 0 °C to 105 °C and RoHS compliant; qualification level listed as Consumer.

Typical Applications

  • Embedded Networking Equipment  Use for packet handling and control in embedded routers, switches, and gateways leveraging on-chip CPM and 10/100Mbps Ethernet.
  • Communications Controllers  Offload and manage serial and time-division multiplexing tasks using the integrated CPM and serial DMA resources.
  • Industrial Control Systems  Embedded control and supervisory applications benefiting from the 266 MHz PowerPC G2 core, DRAM/SDRAM support, and extended temperature up to 105 °C.
  • General Embedded Processing  Platform processing for consumer and embedded products requiring a high-pin-count TBGA package and diverse I/O.

Unique Advantages

  • Highly integrated communications support: The on-chip RISC CPM and serial DMA reduce external components for communications-centric designs.
  • Flexible memory interface: Native DRAM and SDRAM controllers simplify memory subsystem design and speed time to market.
  • High I/O density package: 480-TBGA (37.5×37.5 mm) package with exposed pad accommodates extensive external connectivity and thermal management.
  • Configurable clock and power domains: Separate PLLs and clock multiplier options (documented for the MPC8260A family) enable frequency and power optimization across core and CPM domains.
  • RoHS compliant with extended operating range: Environmentally compliant construction and an operating temperature up to 105 °C support a range of consumer and industrial embedded applications.

Why Choose MPC8260AZUMHBB?

The MPC8260AZUMHBB combines a 266 MHz PowerPC G2 core with integrated communications processing, memory controllers, and high-density packaging to deliver a compact, system-ready processor for embedded and communications applications. Its on-chip CPM and serial interfaces simplify BOM and system architecture while the TBGA package supports high I/O counts in space-constrained designs.

This part is suited for engineers designing networking, communications, and industrial embedded platforms that require a balance of processing performance, integrated communications peripherals, and commercial-grade environmental tolerance. The MPC8260AZUMHBB benefits teams seeking a mature family-level ecosystem and the integration advantages documented for the MPC8260A PowerQUICC II devices.

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