MPC8264AZUPIBB

IC MPU MPC82XX 300MHZ 480TBGA
Part Description

PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 300MHz 480-TBGA (37.5x37.5)

Quantity 336 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8264
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2Device Package480-TBGA (37.5x37.5)
ECCN5A991B4BEthernet10/100Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case480-LBGA Exposed PadRAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed300MHzSupplier Device Package480-TBGA (37.5×37.5)
Voltage – I/O3.3V

Overview of MPC8264AZUPIBB – IC MPU MPC82XX 300MHZ 480TBGA

The MPC8264AZUPIBB is a PowerPC G2 32-bit microprocessor from NXP Semiconductors' MPC8264 series. It operates at 300 MHz and integrates communications-oriented subsystems for embedded designs.

Designed for embedded and consumer applications, this device combines a single high-performance PowerPC G2 core with on-chip communications co-processors and multiple peripheral interfaces to deliver a compact, RoHS-compliant solution for networking and control systems.

Key Features

  • Core & Performance  PowerPC G2 single 32-bit core running at 300 MHz, providing deterministic processing for embedded workloads.
  • Processor Architecture Details  Series-level hardware includes a dual-issue integer core design, separate 16 KB instruction and 16 KB data caches, and a floating-point unit as described in the MPC826xA family documentation.
  • Communications Co-processors (CPM)  Integrated communications functionality with a RISC CPM and communications DSP support to offload protocol processing and serial traffic handling.
  • Memory Support  On-chip controllers for DRAM and SDRAM enable direct interfacing with system memory for buffering and application code storage.
  • Ethernet & Interfaces  10/100 Mbps Ethernet capability (noted as 3 ports in product data) plus serial interfaces including I2C and other serial peripherals referenced in the family documentation for flexible connectivity.
  • Clocking & Power Domains  Family-level documentation describes separate supplies and PLLs for core and communications subsystems, enabling power/performance optimization across domains.
  • Package & Mounting  480-TBGA (37.5 × 37.5 mm) 480-LBGA exposed-pad package, surface-mountable for high-density board designs.
  • Electrical & Environmental  3.3 V I/O signaling, RoHS compliant, and an operating temperature range of 0 °C to 105 °C suitable for consumer-class applications.

Typical Applications

  • Embedded Networking  Use in consumer and embedded network devices that require integrated 10/100 Mbps Ethernet and dedicated communications processing.
  • Communications Equipment  Suitable for gateway, router or protocol-bridging designs that benefit from an on-chip Communications Processor Module and serial interfaces.
  • Consumer Electronics  Integration into consumer-focused embedded systems where a 300 MHz PowerPC core and SDRAM/DRAM support provide responsive control and data handling.
  • Control & Interface Appliances  Ideal for systems requiring robust serial/I2C interfacing, memory controller support, and compact TBGA packaging for space-constrained boards.

Unique Advantages

  • Highly integrated communications capability: Combines a PowerPC G2 core with a RISC CPM and communications DSP support to reduce external controller requirements.
  • Deterministic 300 MHz processing: Single 32-bit core at 300 MHz delivers consistent performance for embedded workloads and protocol handling.
  • Flexible memory interfacing: On-chip DRAM and SDRAM controllers simplify board-level memory design and reduce BOM complexity.
  • Compact, manufacturable package: 480-TBGA exposed-pad package supports high I/O density while remaining surface-mount compatible for automated assembly.
  • Industry-ready electrical profile: 3.3 V I/O and RoHS compliance align with common embedded system power and environmental requirements.
  • Consumer qualification: Product data indicates consumer qualification, suitable for consumer-facing embedded products.

Why Choose MPC8264AZUPIBB?

The MPC8264AZUPIBB positions itself as a performance-focused, communications-capable microprocessor for embedded and consumer applications. With a 300 MHz PowerPC G2 core, integrated communications co-processors, memory controllers, and multiple serial interfaces, it delivers a compact platform for networked and control-oriented designs.

Backed by NXP Semiconductors and derived from the MPC826xA family architecture, this part offers a balance of processing performance, integrated I/O, and manufacturable packaging that supports scalable embedded product development and reliable deployment in consumer-class systems.

Request a quote or submit an RFQ today to check availability and pricing for MPC8264AZUPIBB and to discuss how it fits your next embedded design.

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