MPC8264AZUPIBB
| Part Description |
PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 300MHz 480-TBGA (37.5x37.5) |
|---|---|
| Quantity | 336 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8264 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC G2 | Device Package | 480-TBGA (37.5x37.5) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10/100Mbps (3) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 105°C (TA) | ||
| Package / Case | 480-LBGA Exposed Pad | RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 300MHz | Supplier Device Package | 480-TBGA (37.5×37.5) | ||
| Voltage – I/O | 3.3V |
Overview of MPC8264AZUPIBB – IC MPU MPC82XX 300MHZ 480TBGA
The MPC8264AZUPIBB is a PowerPC G2 32-bit microprocessor from NXP Semiconductors' MPC8264 series. It operates at 300 MHz and integrates communications-oriented subsystems for embedded designs.
Designed for embedded and consumer applications, this device combines a single high-performance PowerPC G2 core with on-chip communications co-processors and multiple peripheral interfaces to deliver a compact, RoHS-compliant solution for networking and control systems.
Key Features
- Core & Performance PowerPC G2 single 32-bit core running at 300 MHz, providing deterministic processing for embedded workloads.
- Processor Architecture Details Series-level hardware includes a dual-issue integer core design, separate 16 KB instruction and 16 KB data caches, and a floating-point unit as described in the MPC826xA family documentation.
- Communications Co-processors (CPM) Integrated communications functionality with a RISC CPM and communications DSP support to offload protocol processing and serial traffic handling.
- Memory Support On-chip controllers for DRAM and SDRAM enable direct interfacing with system memory for buffering and application code storage.
- Ethernet & Interfaces 10/100 Mbps Ethernet capability (noted as 3 ports in product data) plus serial interfaces including I2C and other serial peripherals referenced in the family documentation for flexible connectivity.
- Clocking & Power Domains Family-level documentation describes separate supplies and PLLs for core and communications subsystems, enabling power/performance optimization across domains.
- Package & Mounting 480-TBGA (37.5 × 37.5 mm) 480-LBGA exposed-pad package, surface-mountable for high-density board designs.
- Electrical & Environmental 3.3 V I/O signaling, RoHS compliant, and an operating temperature range of 0 °C to 105 °C suitable for consumer-class applications.
Typical Applications
- Embedded Networking Use in consumer and embedded network devices that require integrated 10/100 Mbps Ethernet and dedicated communications processing.
- Communications Equipment Suitable for gateway, router or protocol-bridging designs that benefit from an on-chip Communications Processor Module and serial interfaces.
- Consumer Electronics Integration into consumer-focused embedded systems where a 300 MHz PowerPC core and SDRAM/DRAM support provide responsive control and data handling.
- Control & Interface Appliances Ideal for systems requiring robust serial/I2C interfacing, memory controller support, and compact TBGA packaging for space-constrained boards.
Unique Advantages
- Highly integrated communications capability: Combines a PowerPC G2 core with a RISC CPM and communications DSP support to reduce external controller requirements.
- Deterministic 300 MHz processing: Single 32-bit core at 300 MHz delivers consistent performance for embedded workloads and protocol handling.
- Flexible memory interfacing: On-chip DRAM and SDRAM controllers simplify board-level memory design and reduce BOM complexity.
- Compact, manufacturable package: 480-TBGA exposed-pad package supports high I/O density while remaining surface-mount compatible for automated assembly.
- Industry-ready electrical profile: 3.3 V I/O and RoHS compliance align with common embedded system power and environmental requirements.
- Consumer qualification: Product data indicates consumer qualification, suitable for consumer-facing embedded products.
Why Choose MPC8264AZUPIBB?
The MPC8264AZUPIBB positions itself as a performance-focused, communications-capable microprocessor for embedded and consumer applications. With a 300 MHz PowerPC G2 core, integrated communications co-processors, memory controllers, and multiple serial interfaces, it delivers a compact platform for networked and control-oriented designs.
Backed by NXP Semiconductors and derived from the MPC826xA family architecture, this part offers a balance of processing performance, integrated I/O, and manufacturable packaging that supports scalable embedded product development and reliable deployment in consumer-class systems.
Request a quote or submit an RFQ today to check availability and pricing for MPC8264AZUPIBB and to discuss how it fits your next embedded design.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
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