MPC8265ACZUMIBC

IC MPU MPC82XX 266MHZ 480TBGA
Part Description

PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 266MHz 480-TBGA (37.5x37.5)

Quantity 1,944 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8265
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2Device Package480-TBGA (37.5x37.5)
ECCN5A991B4BEthernet10/100Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case480-LBGA Exposed PadRAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed266MHzSupplier Device Package480-TBGA (37.5×37.5)
Voltage – I/O3.3V

Overview of MPC8265ACZUMIBC – PowerPC G2 266 MHz, 480‑TBGA

The MPC8265ACZUMIBC is a single‑core PowerPC G2 microprocessor in the MPC82xx family, running at 266 MHz and packaged in a 480‑TBGA (37.5 × 37.5 mm) surface‑mount package. It targets embedded and communications‑focused industrial applications that require integrated networking, on‑chip co‑processing and rugged temperature capability.

Built for embedded communications and industrial control designs, this device combines a 32‑bit G2 core with communications co‑processor resources, memory controllers and multiple 10/100 Mbps Ethernet interfaces, while meeting industrial qualification and RoHS compliance.

Key Features

  • Core One PowerPC G2 32‑bit core operating at 266 MHz, with on‑chip memory management support as described for the MPC826xA family.
  • Cache and MMU Separate instruction and data caches and a PowerPC‑architecture MMU are included in the MPC826xA series hardware specifications.
  • Communications Co‑processor Integrated communications co‑processor (RISC CPM) and communications resources drawn from the MPC826xA family design to support protocol and data‑path tasks.
  • Ethernet Multiple 10/100 Mbps Ethernet interfaces (specified as 10/100 Mbps (3) in device specifications) for networked and industrial Ethernet applications.
  • Memory Controllers On‑chip controllers for DRAM and SDRAM to support system memory requirements.
  • Interfaces I2C listed among additional interfaces; the MPC826xA series documentation describes a comprehensive set of serial/peripheral interfaces for embedded systems.
  • Clocking and Power I/O operates at 3.3 V; the MPC826xA family includes separate power domains and PLL/clock multiplier options enabling independent core and communications processor frequencies for power/performance tuning.
  • Package and Mounting 480‑TBGA (37.5 × 37.5 mm) package, 480‑LBGA with exposed pad, surface‑mount mounting for PCB integration.
  • Industrial Qualification and Temperature Range Qualified for industrial use with an operating temperature range of −40 °C to 105 °C and RoHS compliance.

Typical Applications

  • Embedded Communications Use the on‑chip communications resources and multiple 10/100 Mbps Ethernet ports for networked protocol processing and data routing in embedded systems.
  • Industrial Networking Industrial controllers and gateways benefit from the industrial qualification and wide operating temperature range for reliable field deployment.
  • Control and Automation Leverage the PowerPC G2 core and DRAM/SDRAM controllers for real‑time control tasks and local data buffering in automation equipment.
  • Telecommunications Equipment The integrated communications co‑processor and serial/peripheral interfaces suit management and data‑plane tasks in communications hardware.

Unique Advantages

  • Integrated Communications Engine: On‑chip communications co‑processor (CPM) reduces external logic and simplifies protocol offload for embedded networking designs.
  • Flexible Clocking and Power Domains: Separate PLLs and clock multipliers for the G2 core and CPM allow designers to balance performance and power across subsystems.
  • Network‑Ready Connectivity: Multiple 10/100 Mbps Ethernet interfaces provide native network connectivity for gateway and communication‑centric applications.
  • Industrial Reliability: Industrial qualification and an operating range of −40 °C to 105 °C support deployment in harsh or outdoor environments.
  • System Memory Support: Built‑in DRAM and SDRAM controllers simplify memory subsystem design and reduce external component count.
  • RoHS Compliant Packaging: Lead‑free, surface‑mount 480‑TBGA package suitable for modern, environmentally compliant production processes.

Why Choose MPC8265ACZUMIBC?

The MPC8265ACZUMIBC positions itself as a purpose‑built embedded communications processor that combines a PowerPC G2 core, integrated communications co‑processing, and native Ethernet connectivity in a single industrial‑qualified device. Its package and thermal ratings make it suitable for rugged embedded and networking applications that require sustained operation across a wide temperature range.

Designers and procurement teams looking for a field‑proven MPC82xx family device will find the MPC8265ACZUMIBC offers a balance of compute, communications integration and system‑level interfaces backed by established MPC826xA family documentation from the manufacturer.

Request a quote or submit an inquiry for pricing, availability and volume options to evaluate the MPC8265ACZUMIBC for your next embedded communications or industrial networking design.

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