MPC8264ACZUMIBB

The MPC8264ACZUMIBB is a PowerPC G2 microprocessor IC offered by NXP Semiconductors, configured as a single 32-bit core running at 266 MHz in a 480-TBGA (37.5 × 37.5 mm) package. It targets embedded and industrial applications that demand integrated communications capabilities, deterministic control and extended temperature operation.

Designed as part of the MPC8264 series, the device integrates communications-oriented peripherals and memory interfaces to simplify system design while delivering reliable performance across an industrial temperature range.

Key Features

• Core – PowerPC G2 single 32-bit core operating at 266 MHz, providing a deterministic processing platform for embedded control and communications tasks.
• Memory and Cache – Integrated DRAM/SDRAM controllers for system memory support and series-level core/cache architecture to support efficient instruction and data handling.
• Communications Processing (CPM) – Built to support communications offload and RISC CPM co-processor functionality, enabling protocol handling and serial data operations.
• Ethernet – Three 10/100 Mbps Ethernet interfaces for building networked or data-transport systems with on-chip connectivity.
• Interfaces – Additional peripheral connectivity including I2C and multiple serial interfaces for system control, configuration and peripheral expansion.
• Power and Clock – Separate I/O voltage domain at 3.3 V and series-level clocking options for core and CPM, enabling power/performance tuning.
• Package and Mounting – 480-TBGA (37.5 × 37.5 mm) supplier package with exposed pad, surface-mount footprint suitable for compact embedded boards.
• Industrial Qualification & Temperature – Rated for industrial operation with an operating temperature range of −40 °C to 105 °C for reliable field deployment.
• Compliance – RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• Embedded Communications Equipment – Use the integrated CPM and multiple 10/100 Mbps Ethernet ports to implement routers, switches, and protocol gateways.
• Industrial Control Systems – The industrial temperature rating and robust packaging suit factory automation controllers and remote I/O modules.
• Networking Appliances – Single-core PowerPC processing with on-chip Ethernet and serial interfaces supports mid-range networked appliances and management devices.
• Telecommunications Infrastructure – Leverage the communications-oriented co-processor and serial resources for telecom control plane and peripheral interfacing.

Unique Advantages

• Integrated Communications Capability: On-chip CPM and multiple Ethernet interfaces reduce external component count for networked designs.
• Industrial-Grade Operation: −40 °C to 105 °C temperature rating and RoHS compliance make it suitable for harsh-environment deployments and regulated builds.
• Compact High-Pin Package: 480-TBGA with exposed pad provides dense I/O and thermal performance in a compact surface-mount form factor.
• Power/Performance Flexibility: Separate I/O voltage domain and series clocking features enable designers to balance performance against power budget.
• Single-Core Determinism: A dedicated 32-bit PowerPC G2 core at 266 MHz provides predictable processing for real-time embedded tasks.

Why Choose MPC8264ACZUMIBB?

The MPC8264ACZUMIBB combines a PowerPC G2 single-core architecture with integrated communications peripherals and robust industrial qualifications to deliver a compact, network-capable processing solution for embedded systems. Its 266 MHz core speed, on-chip Ethernet and serial interfaces, and industry-rated temperature range position it for reliable deployment in networking, industrial control and telecom applications.

Backed by NXP Semiconductors and the MPC8264 series documentation, the part provides a predictable platform for designs that require integrated communications offload, DRAM/SDRAM support and a surface-mount 480-TBGA package for dense board layouts.

Request a quote or submit a procurement inquiry for MPC8264ACZUMIBB to evaluate suitability for your next embedded or industrial networking project.