MPC8265ACVVMIBC

IC MPU MPC82XX 266MHZ 480TBGA
Part Description

PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 266MHz 480-TBGA (37.5x37.5)

Quantity 491 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8265
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2Device Package480-TBGA (37.5x37.5)
ECCN5A991B4BEthernet10/100Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case480-LBGA Exposed PadRAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed266MHzSupplier Device Package480-TBGA (37.5×37.5)
Voltage – I/O3.3V

Overview of MPC8265ACVVMIBC – PowerPC G2 Microprocessor, 266 MHz, 480-TBGA

The MPC8265ACVVMIBC is an industrial‑qualified, single‑core PowerPC G2 microprocessor running at 266 MHz, supplied in a 480‑TBGA (37.5 × 37.5 mm) surface‑mount package. It targets embedded and communications applications that require integrated networking peripherals, deterministic operation across a wide temperature range, and RoHS compliance.

Designed around the PowerQUICC II family architecture, the device combines a PowerPC G2 core with a Communication Processor Module (CPM), multiple Ethernet controllers and on‑chip memory controller support to simplify system design for embedded networking and control applications.

Key Features

  • Core  PowerPC G2 single 32‑bit core operating at 266 MHz; the MPC8265 is a member of the MPC826xA (PowerQUICC II) family and benefits from the family architecture.
  • Family architecture enhancements  PowerQUICC II family features include a dual‑issue integer core implementation with separate instruction and data caches and an integrated floating‑point unit as documented for the MPC826xA family.
  • Communications and coprocessors  Integrated Communication Processor Module (CPM) and communications‑focused coprocessors (RISC CPM/DSP functionality) to offload serial and packet processing tasks.
  • Ethernet and interfaces  Three 10/100 Mbps Ethernet controllers and additional interfaces such as I2C are provided for embedded networking and peripheral control.
  • Memory and bus support  On‑chip DRAM and SDRAM controller support to connect external memory; family documentation also describes local bus and PCI bridging capabilities for system expansion.
  • Power and clocking  3.3 V I/O signaling; PowerQUICC II family hardware provides separate PLLs and power domains for core and peripheral clocking optimizations.
  • Package and mounting  480‑LBGA exposed‑pad package (480‑TBGA, 37.5 × 37.5 mm), surface‑mount for high‑density board designs.
  • Industrial qualification and temperature range  Qualified for industrial applications with an operating temperature range of −40 °C to 105 °C and RoHS compliance.

Typical Applications

  • Embedded networking equipment  Use the on‑chip CPM and three 10/100 Mbps Ethernet ports for routing, switching and packet processing in compact network appliances.
  • Industrial control and automation  Industrial temperature rating and robust packaging make the device suitable for controllers and gateways in factory and process automation systems.
  • Communications modules and appliances  Integrated communications coprocessors and serial interfaces support protocol handling and offload tasks in communications modules and security gateways.
  • System expansion and bridging  Memory controller support and family‑level bus/bridge features enable use as a processing and bridging element in complex embedded systems.

Unique Advantages

  • Integrated communications engine  On‑chip CPM and communications coprocessors reduce external silicon and simplify BOM for networking applications.
  • Multiple Ethernet ports  Three 10/100 Mbps Ethernet controllers provide native connectivity for multi‑port network nodes and embedded gateways.
  • Industrial temperature and RoHS compliance  −40 °C to 105 °C operating range and RoHS status support deployment in industrial environments with regulatory compliance.
  • Compact, high‑density package  480‑TBGA (37.5 × 37.5 mm) exposed‑pad LBGA enables high pin‑count integration in space‑constrained boards.
  • Flexible memory options  On‑chip support for DRAM and SDRAM simplifies memory interface design and system memory choices.
  • Power and clock domain flexibility  Family‑level support for separate PLLs and power domains enables optimized power/performance tradeoffs between core and communications subsystems.

Why Choose MPC8265ACVVMIBC?

The MPC8265ACVVMIBC delivers a focused combination of PowerPC G2 processing, integrated communications subsystems and industrial qualification to support embedded networking and control applications. Its multi‑port Ethernet capability, memory controller support and CPM architecture reduce external components and accelerate time to market for packet‑oriented designs.

This device is well suited to engineers and procurement teams building industrial networking equipment, communications modules and embedded systems that require deterministic processing, native Ethernet connectivity and a compact, RoHS‑compliant package backed by the PowerQUICC II family architecture.

Request a quote or submit an inquiry to obtain pricing, availability and lead‑time information for the MPC8265ACVVMIBC.

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