MPC8265AVVPJDC
| Part Description |
PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 300MHz 480-TBGA (37.5x37.5) |
|---|---|
| Quantity | 673 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8265 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC G2 | Device Package | 480-TBGA (37.5x37.5) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10/100Mbps (3) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 105°C (TA) | ||
| Package / Case | 480-LBGA Exposed Pad | RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 300MHz | Supplier Device Package | 480-TBGA (37.5×37.5) | ||
| Voltage – I/O | 3.3V |
Overview of MPC8265AVVPJDC – IC MPU MPC82XX 300MHz 480-TBGA
The MPC8265AVVPJDC is a PowerPC G2 microprocessor in the MPC8265 family, delivering a 300 MHz, single-core 32-bit processing foundation for embedded communications applications. Designed for integrated network and communications tasks, it combines a high-performance core with on-chip communications processing and memory controller functionality to simplify system design.
Targeted at embedded and communications markets, this device emphasizes integrated peripherals and deterministic performance—providing a compact, surface-mount solution in a 480-TBGA (37.5 × 37.5 mm) package with a 0 °C to 105 °C operating range.
Key Features
- PowerPC G2 Core, 300 MHz — Single 32-bit core running at 300 MHz for deterministic embedded processing.
- On-chip Communications Processor (CPM) — Integrated communications/RISC CPM and communications-oriented co-processors to offload protocol and data movement tasks.
- Memory Subsystem — On-chip DRAM/SDRAM controllers plus separate 16 KB instruction and 16 KB data caches and a PowerPC-compatible MMU for efficient memory management (series-level feature).
- Ethernet and Serial Connectivity — 10/100 Mbps Ethernet support and additional interfaces including I2C for peripheral control and system integration.
- Clocking and Power Flexibility — Series-level features include separate PLLs for core and CPM and internal clock multipliers to optimize performance and power tradeoffs.
- Precision I/O and Voltage — 3.3 V I/O supply simplifies interface compatibility with common peripheral voltages.
- Package and Thermal — 480-LBGA exposed pad / 480-TBGA (37.5 × 37.5 mm) surface-mount package rated for 0 °C to 105 °C operation.
- Standards and Compliance — RoHS compliant for environmental regulatory alignment.
Typical Applications
- Embedded Communications Gateways — Use the integrated communications processor and Ethernet support to handle protocol offload and packet processing in compact gateway designs.
- Networked Industrial Controllers — Combine deterministic PowerPC processing with DRAM/SDRAM controllers and industrial-temperature capability for control and monitoring systems.
- Telecommunications Equipment — Leverage the CPM and serial interfaces to implement voice, data, and timing functions in telecom modules and voice/data transcoders.
Unique Advantages
- Integrated Communications Offload: On-chip CPM and communications co-processors reduce external controller requirements and simplify protocol handling.
- Flexible Clocking: Separate PLLs and internal clock multipliers for core and CPM enable tailored performance and power configurations.
- Compact, Serviceable Package: 480-TBGA (37.5 × 37.5 mm) surface-mount package with exposed pad supports high-density board designs with thermal considerations.
- Robust Memory Support: Built-in DRAM/SDRAM controllers and an MMU with separate instruction and data caches improve data throughput and system responsiveness.
- Industry-Ready I/O: 3.3 V I/O and standard interfaces such as I2C facilitate integration with common peripherals and sensors.
- Regulatory Alignment: RoHS compliance supports environmental requirements for modern electronics manufacturing.
Why Choose MPC8265AVVPJDC?
The MPC8265AVVPJDC positions itself as a communications-focused embedded processor that combines a PowerPC G2 core with dedicated communications processing, flexible clocking, and a robust memory subsystem. It is suited for designers requiring an integrated solution that reduces external components while delivering predictable embedded performance in networking and industrial environments.
Backed by NXP Semiconductors’ MPC826x family documentation, this part offers a balance of integration, interface options, and thermal performance that supports scalable embedded system designs and long-term maintainability.
Request a quote or submit an inquiry to obtain pricing and availability for the MPC8265AVVPJDC and to discuss how it fits your embedded communications design requirements.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
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Certifications and Memberships: ISO9001:2015, IATF16949:2016