MPC8270CVVUPEA

IC MPU MPC82XX 450MHZ 480TBGA
Part Description

PowerPC G2_LE Microprocessor IC MPC82xx 1 Core, 32-Bit 450MHz 480-TBGA (37.5x37.5)

Quantity 443 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8270
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2_LEDevice Package480-TBGA (37.5x37.5)
ECCN5A991B4BEthernet10/100Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level4 (72 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case480-LBGA Exposed PadRAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed450MHzSupplier Device Package480-TBGA (37.5×37.5)
USBUSB 2.0 (1)Voltage – I/O3.3V

Overview of MPC8270CVVUPEA – IC MPU MPC82XX 450MHZ 480TBGA

The MPC8270CVVUPEA is a PowerPC G2_LE based microprocessor optimized for embedded communications and industrial applications. It delivers a single 32‑bit core running at 450 MHz with on-chip memory controllers and integrated communications peripherals to support networked, real‑time embedded systems.

Designed for industrial environments, this device combines communications-oriented co‑processing and multiple Ethernet and serial interfaces with standard 3.3 V I/O and a 480‑TBGA package for surface‑mount system designs.

Key Features

  • Core PowerPC G2_LE single core, 32‑bit microprocessor running at 450 MHz with separate 16 KB instruction and 16 KB data caches as documented for the MPC8280 family.
  • Memory & Cache On‑chip support for DRAM and SDRAM controllers, plus separate I‑ and D‑caches for efficient code and data handling.
  • Communications Co‑processing Includes communications co‑processors (RISC CPM) and multiple serial communications controllers to accelerate protocol handling and offload the main core.
  • Networking Interfaces Integrated 10/100 Mbps Ethernet interfaces (3 ports) for multi‑port networked applications.
  • Peripheral Interfaces USB 2.0 (1) and I2C among additional peripheral interfaces for device connectivity and control.
  • Power & I/O 3.3 V I/O voltage for interface compatibility with standard embedded components.
  • Package & Mounting 480‑TBGA supplier device package (37.5 × 37.5) / 480‑LBGA package case with exposed pad, surface‑mount mounting type.
  • Qualification & Temperature Industrial qualification with an operating temperature range of −40 °C to 105 °C for demanding environments.

Typical Applications

  • Embedded Communications Equipment Multi‑port Ethernet and serial controllers make the MPC8270 ideal for routers, gateways, and communication modules that require integrated network interfaces.
  • Industrial Automation & Control Industrial qualification and a wide operating temperature range support deployment in factory automation, process control, and industrial I/O systems.
  • Network Appliances On‑chip DRAM/SDRAM controllers, USB and multiple Ethernet ports enable compact, single‑chip designs for networked appliances and appliances that need real‑time communications.
  • Telecommunications Systems Communications co‑processors and multiple serial communications controllers provide protocol handling suitable for telecom and carrier‑grade embedded modules.

Unique Advantages

  • Integrated communications feature set: Native support for three 10/100 Mbps Ethernet ports, USB 2.0, multiple SCCs and communications co‑processors reduces external interface components.
  • Industrial temperature capability: Rated for −40 °C to 105 °C operation to meet the needs of harsh or outdoor installations.
  • On‑chip memory support: Built‑in DRAM and SDRAM controller support simplifies memory subsystem design and integration.
  • Proven PowerPC core architecture: The PowerPC G2_LE core with separated I/D caches provides deterministic performance for embedded tasks and protocol processing.
  • Compact, manufacturable package: 480‑TBGA (37.5 × 37.5) with exposed pad and surface‑mount mounting supports high‑density board designs and robust thermal paths.

Why Choose MPC8270CVVUPEA?

The MPC8270CVVUPEA positions itself as a purpose‑built, communications‑centric microprocessor for embedded and industrial systems that require an integrated mix of networking interfaces, memory controllers, and communications co‑processing. With a 450 MHz PowerPC G2_LE core, industrial temperature rating, and a compact 480‑TBGA package, it is suited to designs where interface density, thermal considerations, and reliable operation across temperature extremes matter.

Engineers building network appliances, industrial controllers, or telecom modules will find the MPC8270CVVUPEA provides a balanced combination of processing performance, integrated peripheral set, and hardened operating range to support long‑lifecycle embedded deployments.

Request a quote or submit an inquiry for pricing, availability, and volume options to move your design forward with the MPC8270CVVUPEA.

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