MPC8270CVVQLDA

IC MPU MPC82XX 333MHZ 480TBGA
Part Description

PowerPC G2_LE Microprocessor IC MPC82xx 1 Core, 32-Bit 333MHz 480-TBGA (37.5x37.5)

Quantity 1,462 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8270
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2_LEDevice Package480-TBGA (37.5x37.5)
ECCN5A991B4BEthernet10/100Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level4 (72 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case480-LBGA Exposed PadRAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed333MHzSupplier Device Package480-TBGA (37.5×37.5)
USBUSB 2.0 (1)Voltage – I/O3.3V

Overview of MPC8270CVVQLDA – IC MPU MPC82XX 333MHZ 480TBGA

The MPC8270CVVQLDA is a single‑core, 32‑bit microprocessor IC based on the PowerPC G2_LE core, operating at 333 MHz. Designed for embedded and industrial applications, this device integrates communications‑oriented peripherals and memory controllers to support networking and control systems.

With dedicated communications co‑processing, multiple Ethernet ports and a compact 480‑TBGA package, the MPC8270CVVQLDA targets embedded networking, industrial automation and communications equipment where integration, rugged operating range and proven PowerQUICC II family functionality matter.

Key Features

  • Core – PowerPC G2_LE single core, 32‑bit architecture running at 333 MHz, offering a dual‑issue integer implementation as specified for the MPC8280 family.
  • On‑chip Caches – 16 KB instruction cache and 16 KB data cache (four‑way set associative) to improve instruction and data throughput for embedded workloads.
  • Communications Co‑processors – Integrated communications DSP and RISC CPM co‑processors to offload protocol and packet handling tasks.
  • Memory Controllers – Built‑in DRAM and SDRAM controllers for system memory interfacing and deterministic access patterns.
  • Ethernet and USB – Three 10/100 Mbps Ethernet interfaces and one USB 2.0 full/low rate port for network and peripheral connectivity.
  • Serial & Management Interfaces – Multiple serial communications controllers (SCCs) and I2C interface for peripheral control and board management.
  • Industrial Qualification & Temperature Range – Qualified for industrial use with operating temperature range from −40 °C to 105 °C.
  • Power and I/O – 3.3 V I/O signaling to match common embedded system voltage domains.
  • Package – 480‑TBGA supplier device package (37.5 × 37.5 mm) with exposed pad; surface‑mount mounting for high‑density board designs.
  • Regulatory – RoHS compliant for lead‑free production and environmental conformance.

Typical Applications

  • Industrial Networking Equipment – Three 10/100 Mbps Ethernet ports and communications co‑processors make this device suitable for switches, managed controllers and protocol converters.
  • Embedded Gateways & Routers – On‑chip Ethernet, USB and serial controllers enable compact gateway and routing solutions for enterprise and industrial networks.
  • Protocol and Telecom Interfaces – Communications DSP and RISC CPM support multi‑channel serial and protocol processing in telecom and converged network equipment.
  • Industrial Control Systems – DRAM/SDRAM controllers, I2C management and industrial temperature grade support reliable operation in automation and control applications.

Unique Advantages

  • Integrated Communications Peripherals: Multiple Ethernet ports, USB 2.0 and serial controllers reduce external component count and simplify board design for networking applications.
  • Offload Co‑processors: Communications DSP and RISC CPM handle protocol processing and packet tasks, freeing the main core for application logic.
  • Embedded Memory Support: On‑chip DRAM and SDRAM controllers streamline memory subsystem design and improve system determinism.
  • Rugged Industrial Operation: Industrial qualification and −40 °C to 105 °C operating range support deployment in demanding environments.
  • Compact Surface‑Mount Package: 480‑TBGA (37.5 × 37.5 mm) with exposed pad enables high‑density PCB layouts while providing thermal and mechanical robustness.
  • Standards‑Aligned I/O: 3.3 V I/O and RoHS compliance align the device with common embedded system requirements and environmental regulations.

Why Choose MPC8270CVVQLDA?

The MPC8270CVVQLDA combines a PowerPC G2_LE core with dedicated communications co‑processors and a broad set of interfaces to deliver a compact, integrated building block for embedded networking and industrial systems. Its combination of Ethernet connectivity, USB, serial controllers and memory interfaces reduces BOM complexity and accelerates time to market for communications‑centric designs.

This device is well suited for engineers and procurement teams building rugged embedded platforms that require deterministic performance, integrated protocol handling and industrial temperature operation. Backed by the MPC8280 family hardware specifications, it provides a scalable foundation for long‑lifecycle embedded products.

Request a quote or submit an inquiry today to get pricing, availability and lead‑time information for the MPC8270CVVQLDA.

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