MPC8270CVRMIBA

IC MPU MPC82XX 266MHZ PBGA516
Part Description

PowerPC G2_LE Microprocessor IC MPC82xx 1 Core, 32-Bit 266MHz 516-PBGA (27x27)

Quantity 1,985 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8270
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2_LEDevice Package516-PBGA (27x27)
ECCN5A991B4BEthernet10/100Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case516-BBGARAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed266MHzSupplier Device Package516-PBGA (27×27)
USBUSB 2.0 (1)Voltage – I/O3.3V

Overview of MPC8270CVRMIBA – IC MPU MPC82XX 266MHZ PBGA516

The MPC8270CVRMIBA is a single-core PowerPC G2_LE microprocessor in the MPC8270 series, delivering a 32‑bit processing engine at 266 MHz. Designed for embedded communications and industrial applications, it integrates high-performance processing with multiple networking interfaces to simplify system design.

Built for robust embedded deployments, the device combines a PowerQUICC II family core architecture with integrated memory controllers and communications peripherals, enabling compact, deterministic platform implementations across industrial and networking products.

Key Features

  • Core  Dual-issue PowerPC G2_LE core; single 32‑bit core running at 266 MHz for deterministic embedded processing.
  • Cache  Separate instruction and data caches (16 KB each) to accelerate code and data access for typical embedded workloads.
  • Memory Controllers  Integrated DRAM and SDRAM controllers to support common external memory configurations.
  • Communications Co-processors  On‑chip communications and RISC CPM co-processors to handle serial and communications tasks efficiently.
  • Ethernet and USB  Three 10/100 Mbps Ethernet controllers and one USB 2.0 interface provide versatile wired networking and peripheral connectivity.
  • Additional Interfaces  I2C interface available for configuration and peripheral management.
  • Power and I/O  3.3 V I/O voltage for compatibility with common embedded signaling levels.
  • Package & Mounting  516‑pin PBGA package (27 × 27 mm), surface‑mount for high‑density board designs.
  • Operating Range  Industrial qualification with operating temperature range of −40 °C to 105 °C for reliable field operation.
  • Compliance  RoHS‑compliant device to meet modern manufacturing and environmental requirements.

Typical Applications

  • Industrial Communications Equipment Use the MPC8270CVRMIBA in industrial routers, protocol converters, and gateway devices leveraging its multiple 10/100 Mbps Ethernet controllers and communications co-processors.
  • Embedded Networking Appliances Ideal for compact networking modules and appliances requiring integrated Ethernet, USB connectivity, and deterministic processing.
  • Automation Controllers Suitable for machine and process controllers that need robust temperature tolerance, external DRAM/SDRAM support, and reliable field connectivity.
  • Peripheral and Interface Hubs Employ the onboard I2C, USB 2.0, and serial communications support to manage sensors, configuration devices, and peripheral interfaces.

Unique Advantages

  • Integrated Communications Peripherals Three 10/100 Mbps Ethernet ports plus USB reduce external controller requirements and simplify board-level design.
  • Deterministic Embedded Processing A single PowerPC G2_LE core with dedicated caches provides predictable performance for real-time and networking workloads.
  • Industrial‑Grade Temperature Range Rated from −40 °C to 105 °C to support deployment in harsh and variable environmental conditions.
  • Flexible Memory Support On‑chip DRAM and SDRAM controllers allow designers to choose memory configurations that match performance and cost targets.
  • Compact, Surface‑Mount Package 516‑pin PBGA (27 × 27 mm) enables high‑density system integration while maintaining robust thermal and mechanical characteristics.
  • Environmentally Compliant RoHS compliance supports environmentally responsible manufacturing and end-product requirements.

Why Choose MPC8270CVRMIBA?

The MPC8270CVRMIBA combines a focused PowerPC G2_LE single‑core architecture with integrated communications peripherals and memory controllers to address embedded communications and industrial applications that require reliable, deterministic processing and multiple network interfaces. Its industrial temperature rating and PBGA package make it suitable for compact, field‑deployed systems.

This device is well suited for engineering teams designing networking appliances, industrial controllers, and embedded communication hubs that need a balance of integration, rugged operating range, and proven processor architecture from the MPC8270 family.

Request a quote today to specify MPC8270CVRMIBA for your next embedded communications or industrial application.

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