MPC8265AZUPJDC
| Part Description |
PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 300MHz 480-TBGA (37.5x37.5) |
|---|---|
| Quantity | 1,074 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8265 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC G2 | Device Package | 480-TBGA (37.5x37.5) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10/100Mbps (3) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 105°C (TA) | ||
| Package / Case | 480-LBGA Exposed Pad | RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 300MHz | Supplier Device Package | 480-TBGA (37.5×37.5) | ||
| Voltage – I/O | 3.3V |
Overview of MPC8265AZUPJDC – IC MPU MPC82XX 300MHZ 480TBGA
The MPC8265AZUPJDC is a PowerPC G2 microprocessor offered by NXP Semiconductors, configured as a single 32-bit core running at 300 MHz in a 480-TBGA (37.5x37.5) package. Designed for embedded systems, this device integrates on-chip communications and memory controller capabilities to address networking and embedded control applications.
With 3.3 V I/O, multi-port Ethernet capability, DRAM/SDRAM controllers and a surface-mount 480-LBGA exposed-pad package, the MPC8265AZUPJDC provides an integrated platform for compact, thermally managed embedded designs operating across a 0 °C to 105 °C range.
Key Features
- Processor Core: PowerPC G2 single core, 32-bit architecture running at 300 MHz for deterministic embedded processing.
- On-chip Communication Processor (CPM): Integrated communications co-processor and RISC CPM support for hardware-assisted communications tasks and serial peripheral handling.
- Memory Support: Built-in DRAM and SDRAM controllers to interface directly with common external memory types used in embedded systems.
- Ethernet Connectivity: 10/100 Mbps Ethernet interfaces (3) for multi-port networking and connectivity in communications equipment.
- Peripheral Interfaces: I2C and serial interfaces for board-level control and peripheral integration.
- Power and I/O: 3.3 V I/O voltage for compatibility with common legacy and contemporary embedded peripherals.
- Package and Mounting: 480-LBGA exposed pad, supplied as 480-TBGA (37.5x37.5), surface-mount for compact, thermally efficient board designs.
- Operating Range: Qualified for consumer applications with an operating temperature range from 0 °C to 105 °C.
- Standards and Compliance: RoHS compliant, supporting regulatory and manufacturing requirements for lead-free assembly.
Typical Applications
- Networking and Communications Equipment: Multi-port 10/100 Mbps Ethernet and integrated CPM make the MPC8265AZUPJDC suitable for routers, switches or protocol gateways requiring embedded packet handling.
- Embedded Control Systems: The 300 MHz PowerPC G2 core with on-chip memory controllers supports control and management tasks in industrial and commercial embedded platforms.
- Edge Devices and Appliances: Compact 480-TBGA packaging and 3.3 V I/O allow integration into space-constrained devices that require reliable I/O and memory interfacing.
Unique Advantages
- Integrated Communications Subsystem: On-chip CPM and multiple 10/100 Mbps Ethernet interfaces reduce external component count and simplify board design for communications-focused applications.
- Memory Interface Flexibility: Native DRAM and SDRAM controllers provide straightforward connection to common external memory, supporting system memory needs without additional controllers.
- Thermally Efficient Package: 480-LBGA with exposed pad and 480-TBGA (37.5x37.5) footprint supports efficient thermal dissipation in surface-mount layouts.
- Industry-Standard I/O Voltage: 3.3 V I/O ensures compatibility with a wide range of existing peripherals and interface components.
- RoHS Compliant: Compatible with lead-free manufacturing processes and contemporary environmental requirements.
- Designed for Embedded Use: Consumer qualification and an operating temperature range of 0 °C to 105 °C align the device with a broad set of embedded product requirements.
Why Choose MPC8265AZUPJDC?
The MPC8265AZUPJDC combines a PowerPC G2 300 MHz core with integrated communications processing, multi-port Ethernet capability, and on-chip memory controllers to deliver a compact, capable solution for embedded communications and control applications. Its 480-TBGA package with an exposed pad supports effective thermal design in space-constrained boards.
This device is suited to designers and teams building networking appliances, embedded controllers, and edge devices that require integrated communications features, standard 3.3 V I/O, and robust package options backed by NXP Semiconductors' MPC82xx family documentation and support resources.
Request a quote or submit your inquiry to receive pricing, availability, and technical assistance for the MPC8265AZUPJDC. Our team can provide the information you need to evaluate this microprocessor for your next embedded design.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
Revenue: $10.53 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016