MPC8270CZQMIBA
| Part Description |
PowerPC G2_LE Microprocessor IC MPC82xx 1 Core, 32-Bit 333MHz 516-PBGA (27x27) |
|---|---|
| Quantity | 352 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8270 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC G2_LE | Device Package | 516-PBGA (27x27) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10/100Mbps (3) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 105°C (TA) | ||
| Package / Case | 516-BBGA | RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 333MHz | Supplier Device Package | 516-PBGA (27×27) | ||
| USB | USB 2.0 (1) | Voltage – I/O | 3.3V |
Overview of MPC8270CZQMIBA – IC MPU MPC82XX 333MHZ PBGA516
The MPC8270CZQMIBA is a single‑core PowerPC G2_LE microprocessor delivering 333 MHz operation in a 516‑pin PBGA (27×27 mm) package. Designed for embedded and industrial applications, it integrates communications‑oriented peripherals and memory controllers to support networked and control‑centric systems.
With industrial qualification and a −40 °C to 105 °C operating range, this device targets embedded communications, networking, and industrial control designs that require a robust, integrated processing and I/O solution.
Key Features
- Core PowerPC G2_LE single 32‑bit core running at 333 MHz; dual‑issue integer architecture as documented for the MPC82xx family.
- Caches Separate 16 KB instruction cache and 16 KB data cache; four‑way set associative, physically addressed cache architecture with LRU replacement.
- Connectivity & Peripherals Three 10/100 Mbps Ethernet controllers and one USB 2.0 full/low‑speed controller for versatile networking and host/device interfaces. Includes I2C for system control and peripherals.
- Co‑processors & Controllers Integrated communications co‑processors (RISC CPM) and serial communications controllers (SCCs) for offloaded protocol handling and multi‑channel communications.
- Memory Support On‑chip DRAM and SDRAM controllers to interface directly with system memory, simplifying board design.
- Power & IO 3.3 V I/O signaling compatible with common embedded systems.
- Package & Mounting 516‑PBGA (27×27 mm) surface‑mount package optimized for high‑pin‑count embedded applications.
- Qualification & Temperature Industrial qualification with an operating temperature range of −40 °C to 105 °C for demanding environments.
- Compliance RoHS‑compliant lead‑free device.
- Graphics No graphics acceleration (device focused on communications and control workloads).
Typical Applications
- Industrial Communications: Use in field controllers and industrial gateways leveraging multiple 10/100 Ethernet ports and RISC CPM for protocol processing.
- Networking Equipment: Suitable for switches, routers, and managed network appliances that require integrated Ethernet, SCCs, and packet handling offload.
- Embedded Control Systems: Ideal for embedded controllers and automation platforms that need deterministic processing, DRAM/SDRAM support, and industrial temperature operation.
- I/O and Interface Gateways: Builds interface concentrators and protocol converters using USB, I2C, SCCs, and the device’s communications co‑processors.
Unique Advantages
- Integrated Communications Peripherals: Multiple Ethernet controllers, USB 2.0, SCCs, and CPM co‑processors reduce external component count for communications‑heavy designs.
- Embedded‑Focused Core and Caches: PowerPC G2_LE core with dedicated 16 KB I‑ and D‑caches provides predictable performance for control and packet processing tasks.
- Industrial Temperature Rating: −40 °C to 105 °C qualification supports deployment in harsh and temperature‑variable environments.
- Board‑Level Simplicity: On‑chip DRAM/SDRAM controllers and 3.3 V I/O minimize glue logic and simplify memory interfacing.
- High‑Pin‑Count PBGA Package: 516‑pin PBGA (27×27) provides extensive I/O and connectivity options in a compact surface‑mount footprint.
- RoHS Compliance: Lead‑free device meets RoHS requirements for modern manufacturing and supply chains.
Why Choose MPC8270CZQMIBA?
The MPC8270CZQMIBA combines a PowerPC G2_LE processing core with a broad set of integrated communications peripherals and memory controllers in a single 516‑PBGA package. Its industrial qualification, extended temperature range, and support for DRAM/SDRAM and multiple Ethernet interfaces make it a practical choice for embedded networking and industrial control designs that require a compact, integrated solution.
Engineers designing communications‑centric embedded systems will find the MPC8270CZQMIBA attractive for reducing BOM complexity, simplifying board layout, and meeting industrial temperature and RoHS requirements while leveraging NXP Semiconductors’ MPC82xx family architecture.
Request a quote or submit a product inquiry to evaluate the MPC8270CZQMIBA for your next embedded communications or industrial control project.

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