MPC8270VVQLDA

IC MPU MPC82XX 333MHZ 480TBGA
Part Description

PowerPC G2_LE Microprocessor IC MPC82xx 1 Core, 32-Bit 333MHz 480-TBGA (37.5x37.5)

Quantity 470 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8270
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2_LEDevice Package480-TBGA (37.5x37.5)
ECCN5A991B4BEthernet10/100Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level4 (72 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case480-LBGA Exposed PadRAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed333MHzSupplier Device Package480-TBGA (37.5×37.5)
USBUSB 2.0 (1)Voltage – I/O3.3V

Overview of MPC8270VVQLDA – PowerPC G2_LE Microprocessor, 333 MHz, 480-TBGA

The MPC8270VVQLDA is a single-core PowerPC G2_LE microprocessor from NXP Semiconductors designed for embedded applications requiring integrated communications functionality. Operating at 333 MHz with a 32-bit core and support for DRAM/SDRAM memory controllers, this device suits embedded communications and networking designs where a compact, surface-mount SoC with multiple I/O options is required.

As a member of the MPC82xx/PowerQUICC II family, the MPC8270VVQLDA combines a dual-issue integer core architecture with a range of on-chip communications controllers—enabling streamlined system designs for routers, gateways, and industrial communications equipment.

Key Features

  • Core  Dual-issue PowerPC G2_LE integer core (EC603e family) delivering 333 MHz single-core 32-bit processing.
  • Caches  Separate 16 KB instruction and 16 KB data caches for predictable on-chip performance and reduced external memory access.
  • Memory Controllers  Integrated controllers for DRAM and SDRAM to support common embedded memory configurations.
  • Communications Co-processors  On-chip communications DSP and RISC CPM to accelerate protocol handling and data plane tasks.
  • Ethernet and USB  Three 10/100 Mbps Ethernet controllers and one USB 2.0 controller provide multiple host and network connectivity options on-chip.
  • Serial and Peripheral Interfaces  Four serial communications controllers (SCCs) and additional interfaces including I²C expand peripheral connectivity for system integration.
  • Power and I/O  3.3 V I/O signaling for compatibility with standard embedded peripherals.
  • Package  480-TBGA package (37.5×37.5 mm) with 480-LBGA exposed pad, surface-mount mounting for high-density designs.
  • Operating Range  Rated for 0°C to 105°C operating temperature.
  • Compliance  RoHS compliant.

Typical Applications

  • Embedded Networking  Ideal for routers, switches or gateway controllers that require multiple 10/100 Mbps Ethernet ports and on-chip protocol acceleration.
  • Industrial Communications  Suited to industrial controllers and communication modules where deterministic processing and multiple serial interfaces are needed.
  • Protocol and Control Appliances  Useful in systems that offload protocol handling to on-chip communications co-processors and need USB connectivity.
  • OEM Embedded Platforms  Fits compact, surface-mount designs requiring a high pin-count TBGA package and integrated memory controller support.

Unique Advantages

  • Integrated communications feature set: Three 10/100 Mbps Ethernet controllers, one USB 2.0 controller, and four SCCs reduce external components and simplify board design.
  • On-chip protocol acceleration: Communications DSP and RISC CPM offload protocol processing from the main core, improving throughput for networking tasks.
  • Compact, production-ready package: 480-TBGA (37.5×37.5 mm) with exposed pad supports high-density surface-mount layouts and thermal conduction.
  • Embedded-friendly memory support: Built-in DRAM/SDRAM controllers streamline memory subsystem design for embedded platforms.
  • Broad operating window: 0°C to 105°C rating provides suitability across commercial and many industrial temperature conditions.
  • Standards-aligned I/O voltage: 3.3 V I/O compatibility with common peripheral devices.

Why Choose MPC8270VVQLDA?

The MPC8270VVQLDA positions itself as a compact, communications-focused embedded processor combining a PowerPC G2_LE core with extensive on-chip networking and peripheral capabilities. Its 333 MHz single-core architecture, combined with dedicated communications co-processors and multiple Ethernet ports, delivers a tightly integrated solution for embedded networking and industrial communications designs.

For designers building routers, gateways, industrial controllers, or OEM embedded platforms, the MPC8270VVQLDA offers a balance of processing, connectivity, and packaging that reduces board complexity while supporting robust thermal and environmental ranges. Documentation is available at the family level to assist development and integration into production systems.

Request a quote or submit an inquiry to receive pricing and availability for the MPC8270VVQLDA and to discuss integration requirements for your embedded design.

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