MPC8270VVQLDA
| Part Description |
PowerPC G2_LE Microprocessor IC MPC82xx 1 Core, 32-Bit 333MHz 480-TBGA (37.5x37.5) |
|---|---|
| Quantity | 470 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8270 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC G2_LE | Device Package | 480-TBGA (37.5x37.5) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10/100Mbps (3) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 4 (72 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 105°C (TA) | ||
| Package / Case | 480-LBGA Exposed Pad | RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 333MHz | Supplier Device Package | 480-TBGA (37.5×37.5) | ||
| USB | USB 2.0 (1) | Voltage – I/O | 3.3V |
Overview of MPC8270VVQLDA – PowerPC G2_LE Microprocessor, 333 MHz, 480-TBGA
The MPC8270VVQLDA is a single-core PowerPC G2_LE microprocessor from NXP Semiconductors designed for embedded applications requiring integrated communications functionality. Operating at 333 MHz with a 32-bit core and support for DRAM/SDRAM memory controllers, this device suits embedded communications and networking designs where a compact, surface-mount SoC with multiple I/O options is required.
As a member of the MPC82xx/PowerQUICC II family, the MPC8270VVQLDA combines a dual-issue integer core architecture with a range of on-chip communications controllers—enabling streamlined system designs for routers, gateways, and industrial communications equipment.
Key Features
- Core Dual-issue PowerPC G2_LE integer core (EC603e family) delivering 333 MHz single-core 32-bit processing.
- Caches Separate 16 KB instruction and 16 KB data caches for predictable on-chip performance and reduced external memory access.
- Memory Controllers Integrated controllers for DRAM and SDRAM to support common embedded memory configurations.
- Communications Co-processors On-chip communications DSP and RISC CPM to accelerate protocol handling and data plane tasks.
- Ethernet and USB Three 10/100 Mbps Ethernet controllers and one USB 2.0 controller provide multiple host and network connectivity options on-chip.
- Serial and Peripheral Interfaces Four serial communications controllers (SCCs) and additional interfaces including I²C expand peripheral connectivity for system integration.
- Power and I/O 3.3 V I/O signaling for compatibility with standard embedded peripherals.
- Package 480-TBGA package (37.5×37.5 mm) with 480-LBGA exposed pad, surface-mount mounting for high-density designs.
- Operating Range Rated for 0°C to 105°C operating temperature.
- Compliance RoHS compliant.
Typical Applications
- Embedded Networking Ideal for routers, switches or gateway controllers that require multiple 10/100 Mbps Ethernet ports and on-chip protocol acceleration.
- Industrial Communications Suited to industrial controllers and communication modules where deterministic processing and multiple serial interfaces are needed.
- Protocol and Control Appliances Useful in systems that offload protocol handling to on-chip communications co-processors and need USB connectivity.
- OEM Embedded Platforms Fits compact, surface-mount designs requiring a high pin-count TBGA package and integrated memory controller support.
Unique Advantages
- Integrated communications feature set: Three 10/100 Mbps Ethernet controllers, one USB 2.0 controller, and four SCCs reduce external components and simplify board design.
- On-chip protocol acceleration: Communications DSP and RISC CPM offload protocol processing from the main core, improving throughput for networking tasks.
- Compact, production-ready package: 480-TBGA (37.5×37.5 mm) with exposed pad supports high-density surface-mount layouts and thermal conduction.
- Embedded-friendly memory support: Built-in DRAM/SDRAM controllers streamline memory subsystem design for embedded platforms.
- Broad operating window: 0°C to 105°C rating provides suitability across commercial and many industrial temperature conditions.
- Standards-aligned I/O voltage: 3.3 V I/O compatibility with common peripheral devices.
Why Choose MPC8270VVQLDA?
The MPC8270VVQLDA positions itself as a compact, communications-focused embedded processor combining a PowerPC G2_LE core with extensive on-chip networking and peripheral capabilities. Its 333 MHz single-core architecture, combined with dedicated communications co-processors and multiple Ethernet ports, delivers a tightly integrated solution for embedded networking and industrial communications designs.
For designers building routers, gateways, industrial controllers, or OEM embedded platforms, the MPC8270VVQLDA offers a balance of processing, connectivity, and packaging that reduces board complexity while supporting robust thermal and environmental ranges. Documentation is available at the family level to assist development and integration into production systems.
Request a quote or submit an inquiry to receive pricing and availability for the MPC8270VVQLDA and to discuss integration requirements for your embedded design.

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